KR101868642B1 - 기판 처리 장치, 기판 처리 방법 및 기억 매체 - Google Patents

기판 처리 장치, 기판 처리 방법 및 기억 매체 Download PDF

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Publication number
KR101868642B1
KR101868642B1 KR1020130049215A KR20130049215A KR101868642B1 KR 101868642 B1 KR101868642 B1 KR 101868642B1 KR 1020130049215 A KR1020130049215 A KR 1020130049215A KR 20130049215 A KR20130049215 A KR 20130049215A KR 101868642 B1 KR101868642 B1 KR 101868642B1
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KR
South Korea
Prior art keywords
processing
liquid
substrate
section
treatment
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KR1020130049215A
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English (en)
Korean (ko)
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KR20130126483A (ko
Inventor
유스케 하시모토
슈이치 나가미네
노리히로 이토
Original Assignee
도쿄엘렉트론가부시키가이샤
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Publication of KR20130126483A publication Critical patent/KR20130126483A/ko
Application granted granted Critical
Publication of KR101868642B1 publication Critical patent/KR101868642B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
KR1020130049215A 2012-05-11 2013-05-02 기판 처리 장치, 기판 처리 방법 및 기억 매체 KR101868642B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012109998A JP5840563B2 (ja) 2012-05-11 2012-05-11 基板処理装置、基板処理方法および記憶媒体
JPJP-P-2012-109998 2012-05-11

Publications (2)

Publication Number Publication Date
KR20130126483A KR20130126483A (ko) 2013-11-20
KR101868642B1 true KR101868642B1 (ko) 2018-06-18

Family

ID=49764305

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130049215A KR101868642B1 (ko) 2012-05-11 2013-05-02 기판 처리 장치, 기판 처리 방법 및 기억 매체

Country Status (2)

Country Link
JP (1) JP5840563B2 (ja)
KR (1) KR101868642B1 (ja)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001038310A (ja) * 1999-07-30 2001-02-13 Matsushita Electric Ind Co Ltd 枚葉式薬液洗浄方法および装置
JP2004214222A (ja) * 2002-06-06 2004-07-29 Ebara Corp 基板処理装置及び基板処理方法
JP2008004878A (ja) 2006-06-26 2008-01-10 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP2008073636A (ja) * 2006-09-22 2008-04-03 Niigata Univ 磁気的浮上回転処理装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2894451B2 (ja) * 1989-11-06 1999-05-24 株式会社荏原製作所 ジェットスクラバー
JPH0697136A (ja) * 1992-09-17 1994-04-08 Hitachi Ltd 基板洗浄方法およびその装置
JP3730829B2 (ja) * 2000-02-17 2006-01-05 東京エレクトロン株式会社 現像処理方法及び現像処理装置
JP2002212784A (ja) * 2001-01-12 2002-07-31 Tokyo Electron Ltd 電解メッキ装置及び電解メッキ方法
JP3850226B2 (ja) * 2001-04-02 2006-11-29 株式会社荏原製作所 基板処理装置
JP2006073753A (ja) * 2004-09-01 2006-03-16 Renesas Technology Corp 基板洗浄装置
JP4805003B2 (ja) * 2006-04-18 2011-11-02 東京エレクトロン株式会社 液処理装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001038310A (ja) * 1999-07-30 2001-02-13 Matsushita Electric Ind Co Ltd 枚葉式薬液洗浄方法および装置
JP2004214222A (ja) * 2002-06-06 2004-07-29 Ebara Corp 基板処理装置及び基板処理方法
JP2008004878A (ja) 2006-06-26 2008-01-10 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP2008073636A (ja) * 2006-09-22 2008-04-03 Niigata Univ 磁気的浮上回転処理装置

Also Published As

Publication number Publication date
JP2013239494A (ja) 2013-11-28
KR20130126483A (ko) 2013-11-20
JP5840563B2 (ja) 2016-01-06

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