KR101848694B1 - 무연 후막 저항체 및 이를 포함하는 전자부품 - Google Patents

무연 후막 저항체 및 이를 포함하는 전자부품 Download PDF

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Publication number
KR101848694B1
KR101848694B1 KR1020170019648A KR20170019648A KR101848694B1 KR 101848694 B1 KR101848694 B1 KR 101848694B1 KR 1020170019648 A KR1020170019648 A KR 1020170019648A KR 20170019648 A KR20170019648 A KR 20170019648A KR 101848694 B1 KR101848694 B1 KR 101848694B1
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KR
South Korea
Prior art keywords
lead
network
film resistor
oxide
glass precursor
Prior art date
Application number
KR1020170019648A
Other languages
English (en)
Korean (ko)
Inventor
우동준
이혜성
김경용
강성학
임종찬
Original Assignee
대주전자재료 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 대주전자재료 주식회사 filed Critical 대주전자재료 주식회사
Priority to KR1020170019648A priority Critical patent/KR101848694B1/ko
Priority to JP2019543789A priority patent/JP6975246B2/ja
Priority to PCT/KR2018/001903 priority patent/WO2018147713A1/ko
Priority to CN201880024662.9A priority patent/CN110494937B/zh
Application granted granted Critical
Publication of KR101848694B1 publication Critical patent/KR101848694B1/ko

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/08Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances oxides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14Conductive material dispersed in non-conductive inorganic material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C1/00Details
    • H01C1/14Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/142Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being coated on the resistive element
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Non-Adjustable Resistors (AREA)
  • Glass Compositions (AREA)
KR1020170019648A 2017-02-13 2017-02-13 무연 후막 저항체 및 이를 포함하는 전자부품 KR101848694B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020170019648A KR101848694B1 (ko) 2017-02-13 2017-02-13 무연 후막 저항체 및 이를 포함하는 전자부품
JP2019543789A JP6975246B2 (ja) 2017-02-13 2018-02-13 鉛フリー厚膜低抗体およびこれを含む電子部品
PCT/KR2018/001903 WO2018147713A1 (ko) 2017-02-13 2018-02-13 무연 후막 저항체 및 이를 포함하는 전자부품
CN201880024662.9A CN110494937B (zh) 2017-02-13 2018-02-13 无铅厚膜电阻体及包含其的电子部件

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020170019648A KR101848694B1 (ko) 2017-02-13 2017-02-13 무연 후막 저항체 및 이를 포함하는 전자부품

Publications (1)

Publication Number Publication Date
KR101848694B1 true KR101848694B1 (ko) 2018-04-16

Family

ID=62082114

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170019648A KR101848694B1 (ko) 2017-02-13 2017-02-13 무연 후막 저항체 및 이를 포함하는 전자부품

Country Status (4)

Country Link
JP (1) JP6975246B2 (ja)
KR (1) KR101848694B1 (ja)
CN (1) CN110494937B (ja)
WO (1) WO2018147713A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7279551B2 (ja) * 2019-07-09 2023-05-23 住友金属鉱山株式会社 厚膜抵抗体用組成物、厚膜抵抗体用ペースト、および厚膜抵抗体

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009505395A (ja) 2005-08-10 2009-02-05 フエロ コーポレーション コンデンサ用の鉛フリー及びカドミウムフリーガラスを含む銅端子インク

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2003211482A1 (en) * 2002-02-28 2003-09-09 Kojima Chemical Co., Ltd. Resistor
JP4079669B2 (ja) * 2002-02-28 2008-04-23 小島化学薬品株式会社 厚膜抵抗体ペースト
US7176152B2 (en) * 2004-06-09 2007-02-13 Ferro Corporation Lead-free and cadmium-free conductive copper thick film pastes
CN100511496C (zh) * 2004-09-01 2009-07-08 Tdk株式会社 厚膜电阻浆料和厚膜电阻
TW200612443A (en) * 2004-09-01 2006-04-16 Tdk Corp Thick-film resistor paste and thick-film resistor
JP2007103594A (ja) * 2005-10-03 2007-04-19 Shoei Chem Ind Co 抵抗体組成物並びに厚膜抵抗体
JP5159080B2 (ja) * 2005-12-02 2013-03-06 昭栄化学工業株式会社 オーバーコート用ガラスペースト及び厚膜抵抗素子
US8628695B2 (en) * 2008-04-18 2014-01-14 E I Du Pont De Nemours And Company Surface-modified ruthenium oxide conductive material, lead-free glass(es), thick film resistor paste(s), and devices made therefrom
JP5831055B2 (ja) * 2011-09-02 2015-12-09 住友金属鉱山株式会社 板状酸化ルテニウム粉末とその製造方法、それを用いた厚膜抵抗組成物
MY180840A (en) * 2014-09-12 2020-12-10 Shoei Chemical Ind Co Thick film resistor and production method for same
CN104795128B (zh) * 2015-05-14 2017-02-22 刘飞全 一种无铅电阻浆料及其制造工艺和应用

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009505395A (ja) 2005-08-10 2009-02-05 フエロ コーポレーション コンデンサ用の鉛フリー及びカドミウムフリーガラスを含む銅端子インク

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Konrad Kielbasinski et.al., J Master Sci: Mater Electron (2010) 21: 1099-1105

Also Published As

Publication number Publication date
JP2020510996A (ja) 2020-04-09
CN110494937B (zh) 2021-09-21
CN110494937A (zh) 2019-11-22
WO2018147713A1 (ko) 2018-08-16
JP6975246B2 (ja) 2021-12-01

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