KR101819074B1 - 레이저 가공 장치 - Google Patents

레이저 가공 장치 Download PDF

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Publication number
KR101819074B1
KR101819074B1 KR1020120010604A KR20120010604A KR101819074B1 KR 101819074 B1 KR101819074 B1 KR 101819074B1 KR 1020120010604 A KR1020120010604 A KR 1020120010604A KR 20120010604 A KR20120010604 A KR 20120010604A KR 101819074 B1 KR101819074 B1 KR 101819074B1
Authority
KR
South Korea
Prior art keywords
laser
machining
indexing
processing
feed
Prior art date
Application number
KR1020120010604A
Other languages
English (en)
Korean (ko)
Other versions
KR20120089593A (ko
Inventor
사토시 다카하시
Original Assignee
가부시기가이샤 디스코
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시기가이샤 디스코 filed Critical 가부시기가이샤 디스코
Publication of KR20120089593A publication Critical patent/KR20120089593A/ko
Application granted granted Critical
Publication of KR101819074B1 publication Critical patent/KR101819074B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
KR1020120010604A 2011-02-03 2012-02-02 레이저 가공 장치 KR101819074B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011021542A JP5804716B2 (ja) 2011-02-03 2011-02-03 レーザー加工装置
JPJP-P-2011-021542 2011-02-03

Publications (2)

Publication Number Publication Date
KR20120089593A KR20120089593A (ko) 2012-08-13
KR101819074B1 true KR101819074B1 (ko) 2018-01-16

Family

ID=46547190

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020120010604A KR101819074B1 (ko) 2011-02-03 2012-02-02 레이저 가공 장치

Country Status (4)

Country Link
JP (1) JP5804716B2 (ja)
KR (1) KR101819074B1 (ja)
CN (1) CN102626825B (ja)
DE (1) DE102012201419B4 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101424877B1 (ko) 2012-08-16 2014-08-01 주식회사 만도 자동차의 조향 컬럼
JP6501530B2 (ja) 2015-01-21 2019-04-17 株式会社ディスコ レーザー加工装置
CN105215545A (zh) * 2015-11-11 2016-01-06 苏州天弘激光股份有限公司 晶圆直切机
JP7467821B2 (ja) * 2020-02-06 2024-04-16 株式会社東京精密 レーザ加工装置及び加工方法
KR102697514B1 (ko) * 2023-11-23 2024-08-22 대구대학교 산학협력단 재제조용 비부착성 서포터 지그 장치

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008042032A (ja) * 2006-08-08 2008-02-21 Sumitomo Heavy Ind Ltd ステージ駆動方法及び該方法を用いたレーザ加工装置
JP2008254035A (ja) * 2007-04-05 2008-10-23 Disco Abrasive Syst Ltd レーザー加工装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10305420A (ja) 1997-03-04 1998-11-17 Ngk Insulators Ltd 酸化物単結晶からなる母材の加工方法、機能性デバイスの製造方法
US6808102B1 (en) * 2000-08-28 2004-10-26 Asm Assembly Automation Ltd. Wire-bonding apparatus with improved XY-table orientation
JP3408805B2 (ja) 2000-09-13 2003-05-19 浜松ホトニクス株式会社 切断起点領域形成方法及び加工対象物切断方法
JP3746019B2 (ja) * 2002-06-03 2006-02-15 ヤマザキマザック株式会社 レーザ加工機
JP2006159254A (ja) * 2004-12-07 2006-06-22 Disco Abrasive Syst Ltd レーザー加工装置
JP5122773B2 (ja) * 2006-08-04 2013-01-16 株式会社ディスコ レーザー加工機
JP2010064125A (ja) * 2008-09-12 2010-03-25 Disco Abrasive Syst Ltd レーザー加工装置
JP5324180B2 (ja) * 2008-10-07 2013-10-23 株式会社ディスコ レーザ加工方法およびレーザ加工装置
JP5528015B2 (ja) * 2009-06-10 2014-06-25 株式会社ディスコ レーザ加工装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008042032A (ja) * 2006-08-08 2008-02-21 Sumitomo Heavy Ind Ltd ステージ駆動方法及び該方法を用いたレーザ加工装置
JP2008254035A (ja) * 2007-04-05 2008-10-23 Disco Abrasive Syst Ltd レーザー加工装置

Also Published As

Publication number Publication date
CN102626825B (zh) 2015-08-19
DE102012201419A1 (de) 2012-08-09
KR20120089593A (ko) 2012-08-13
JP2012161799A (ja) 2012-08-30
CN102626825A (zh) 2012-08-08
JP5804716B2 (ja) 2015-11-04
DE102012201419B4 (de) 2023-10-26

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