KR101812666B1 - 얇은 기판 취급을 위한 정전 캐리어 - Google Patents

얇은 기판 취급을 위한 정전 캐리어 Download PDF

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Publication number
KR101812666B1
KR101812666B1 KR1020167005660A KR20167005660A KR101812666B1 KR 101812666 B1 KR101812666 B1 KR 101812666B1 KR 1020167005660 A KR1020167005660 A KR 1020167005660A KR 20167005660 A KR20167005660 A KR 20167005660A KR 101812666 B1 KR101812666 B1 KR 101812666B1
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South Korea
Prior art keywords
electrode
electrostatic chuck
esc
dielectric layer
substrate
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Korean (ko)
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KR20160040656A (ko
Inventor
마이클 에스. 콕스
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어플라이드 머티어리얼스, 인코포레이티드
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Publication of KR20160040656A publication Critical patent/KR20160040656A/ko
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    • H01L21/6833—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • H01L21/6831—
    • H01L21/68728—
    • H01L21/68735—
    • H01L21/68785—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7611—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
KR1020167005660A 2013-08-05 2014-07-24 얇은 기판 취급을 위한 정전 캐리어 Active KR101812666B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361862471P 2013-08-05 2013-08-05
US61/862,471 2013-08-05
PCT/US2014/048065 WO2015020810A1 (en) 2013-08-05 2014-07-24 Electrostatic carrier for thin substrate handling

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020177014510A Division KR102139682B1 (ko) 2013-08-05 2014-07-24 얇은 기판 취급을 위한 정전 캐리어

Publications (2)

Publication Number Publication Date
KR20160040656A KR20160040656A (ko) 2016-04-14
KR101812666B1 true KR101812666B1 (ko) 2017-12-27

Family

ID=52427454

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020167005660A Active KR101812666B1 (ko) 2013-08-05 2014-07-24 얇은 기판 취급을 위한 정전 캐리어
KR1020177014510A Active KR102139682B1 (ko) 2013-08-05 2014-07-24 얇은 기판 취급을 위한 정전 캐리어

Family Applications After (1)

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Country Status (6)

Country Link
US (2) US9536768B2 (enExample)
JP (2) JP6518666B2 (enExample)
KR (2) KR101812666B1 (enExample)
CN (2) CN110085546B (enExample)
TW (2) TWI613756B (enExample)
WO (1) WO2015020810A1 (enExample)

Families Citing this family (13)

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Publication number Priority date Publication date Assignee Title
CN110085546B (zh) * 2013-08-05 2023-05-16 应用材料公司 用于薄基板搬运的静电载体
JP6282080B2 (ja) * 2013-10-30 2018-02-21 株式会社日立ハイテクノロジーズ プラズマ処理装置
US9551070B2 (en) * 2014-05-30 2017-01-24 Applied Materials, Inc. In-situ corrosion resistant substrate support coating
KR20200135569A (ko) * 2016-01-13 2020-12-02 어플라이드 머티어리얼스, 인코포레이티드 기판을 홀딩하기 위한 홀딩 어레인지먼트, 기판을 지지하기 위한 캐리어, 진공 프로세싱 시스템, 기판을 홀딩하기 위한 방법, 및 기판을 릴리스하기 위한 방법
DE102016206193A1 (de) * 2016-04-13 2017-10-19 Trumpf Gmbh + Co. Kg Elektroadhäsionsgreifer mit fraktalen Elektroden
JP6867686B2 (ja) * 2017-06-30 2021-05-12 株式会社 セルバック 接合装置
KR102515262B1 (ko) * 2018-12-05 2023-03-29 가부시키가이샤 아루박 정전척, 진공처리장치 및 기판처리방법
US11887878B2 (en) * 2019-06-28 2024-01-30 Applied Materials, Inc. Detachable biasable electrostatic chuck for high temperature applications
US20210381101A1 (en) * 2020-06-03 2021-12-09 Applied Materials, Inc. Substrate processing system
US11749542B2 (en) * 2020-07-27 2023-09-05 Applied Materials, Inc. Apparatus, system, and method for non-contact temperature monitoring of substrate supports
KR20230158053A (ko) * 2021-03-16 2023-11-17 램 리써치 코포레이션 정전 척들을 위한 3 극성 (tripolar) 전극 배열
US12046503B2 (en) * 2021-10-26 2024-07-23 Applied Materials, Inc. Chuck for processing semiconductor workpieces at high temperatures
JP2025119839A (ja) * 2024-02-02 2025-08-15 信越化学工業株式会社 静電吸着機能を有する加熱装置

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JP2007258607A (ja) 2006-03-24 2007-10-04 Ngk Insulators Ltd 静電チャック
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Also Published As

Publication number Publication date
JP6518666B2 (ja) 2019-05-22
KR20170063982A (ko) 2017-06-08
CN110085546B (zh) 2023-05-16
US20150036260A1 (en) 2015-02-05
KR102139682B1 (ko) 2020-07-30
WO2015020810A1 (en) 2015-02-12
TWI613756B (zh) 2018-02-01
KR20160040656A (ko) 2016-04-14
CN105408992A (zh) 2016-03-16
US20170062261A1 (en) 2017-03-02
CN110085546A (zh) 2019-08-02
CN105408992B (zh) 2019-01-29
JP2016529718A (ja) 2016-09-23
TW201519362A (zh) 2015-05-16
US9536768B2 (en) 2017-01-03
JP2019125811A (ja) 2019-07-25
US9779975B2 (en) 2017-10-03
TWI629748B (zh) 2018-07-11
JP6968120B2 (ja) 2021-11-17
TW201737411A (zh) 2017-10-16

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