KR101801693B1 - 저밀도 폴리싱 패드 - Google Patents

저밀도 폴리싱 패드 Download PDF

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Publication number
KR101801693B1
KR101801693B1 KR1020167002464A KR20167002464A KR101801693B1 KR 101801693 B1 KR101801693 B1 KR 101801693B1 KR 1020167002464 A KR1020167002464 A KR 1020167002464A KR 20167002464 A KR20167002464 A KR 20167002464A KR 101801693 B1 KR101801693 B1 KR 101801693B1
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South Korea
Prior art keywords
delete delete
trace elements
polishing pad
polishing
closed cell
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KR1020167002464A
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Korean (ko)
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KR20160027075A (ko
Inventor
핑 후앙
윌리엄 씨 앨리슨
리차드 프렌?
리차드 프렌?f
폴 안드레 레페브레
로버트 커프리치
다이안 스코트
Original Assignee
캐보트 마이크로일렉트로닉스 코포레이션
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Publication of KR20160027075A publication Critical patent/KR20160027075A/ko
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    • H01L21/304—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/04—Zonally-graded surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials
    • B24D11/005—Making abrasive webs
    • B24D11/006—Making abrasive webs without embedded abrasive particles
    • H01L21/30625—
    • H01L21/461—
    • H01L21/67219—
    • H01L2924/069—

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
KR1020167002464A 2013-07-31 2014-07-17 저밀도 폴리싱 패드 Active KR101801693B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/955,398 US20150038066A1 (en) 2013-07-31 2013-07-31 Low density polishing pad
US13/955,398 2013-07-31
PCT/US2014/047065 WO2015017138A1 (en) 2013-07-31 2014-07-17 Low density polishing pad

Publications (2)

Publication Number Publication Date
KR20160027075A KR20160027075A (ko) 2016-03-09
KR101801693B1 true KR101801693B1 (ko) 2017-11-27

Family

ID=51263570

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020167002464A Active KR101801693B1 (ko) 2013-07-31 2014-07-17 저밀도 폴리싱 패드

Country Status (8)

Country Link
US (1) US20150038066A1 (https=)
EP (1) EP3027363B1 (https=)
JP (3) JP6517802B2 (https=)
KR (1) KR101801693B1 (https=)
CN (1) CN105408063B (https=)
SG (1) SG11201600242PA (https=)
TW (1) TWI579106B (https=)
WO (1) WO2015017138A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240157794A (ko) * 2023-04-25 2024-11-04 주식회사 브러쉬텍 씨엠피용 패드 컨디셔닝 디스크 및 그 제조방법

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