KR101800719B1 - 프로세스 챔버 가스 유동 장치, 시스템들 및 방법들 - Google Patents
프로세스 챔버 가스 유동 장치, 시스템들 및 방법들 Download PDFInfo
- Publication number
- KR101800719B1 KR101800719B1 KR1020157016707A KR20157016707A KR101800719B1 KR 101800719 B1 KR101800719 B1 KR 101800719B1 KR 1020157016707 A KR1020157016707 A KR 1020157016707A KR 20157016707 A KR20157016707 A KR 20157016707A KR 101800719 B1 KR101800719 B1 KR 101800719B1
- Authority
- KR
- South Korea
- Prior art keywords
- process chamber
- valve
- tiltable
- tiltable valve
- gas flow
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K51/00—Other details not peculiar to particular types of valves or cut-off apparatus
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4412—Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
- C23C16/45565—Shower nozzles
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K1/00—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces
- F16K1/24—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces with valve members that, on opening of the valve, are initially lifted from the seat and next are turned around an axis parallel to the seat
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K1/00—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces
- F16K1/32—Details
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K31/00—Actuating devices; Operating means; Releasing devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K51/00—Other details not peculiar to particular types of valves or cut-off apparatus
- F16K51/02—Other details not peculiar to particular types of valves or cut-off apparatus specially adapted for high-vacuum installations
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/0318—Processes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/8593—Systems
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Lift Valve (AREA)
- Chemical Vapour Deposition (AREA)
- Drying Of Semiconductors (AREA)
- Physical Vapour Deposition (AREA)
- Valve Housings (AREA)
- Mechanically-Actuated Valves (AREA)
- Fluid-Driven Valves (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261732186P | 2012-11-30 | 2012-11-30 | |
| US61/732,186 | 2012-11-30 | ||
| PCT/US2013/072079 WO2014085497A1 (en) | 2012-11-30 | 2013-11-26 | Process chamber gas flow apparatus, systems, and methods |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20150089047A KR20150089047A (ko) | 2015-08-04 |
| KR101800719B1 true KR101800719B1 (ko) | 2017-11-23 |
Family
ID=50824243
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020157016707A Expired - Fee Related KR101800719B1 (ko) | 2012-11-30 | 2013-11-26 | 프로세스 챔버 가스 유동 장치, 시스템들 및 방법들 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9429248B2 (enExample) |
| JP (1) | JP6180541B2 (enExample) |
| KR (1) | KR101800719B1 (enExample) |
| CN (1) | CN104812939B (enExample) |
| TW (1) | TWI587358B (enExample) |
| WO (1) | WO2014085497A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20240021283A (ko) * | 2021-09-27 | 2024-02-16 | 어플라이드 머티어리얼스, 인코포레이티드 | 내부 웨이퍼 이송 능력을 이용하여 챔버 용적을 프로세스 용적에 대해 격리시키는 방법 |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI674168B (zh) * | 2015-07-27 | 2019-10-11 | 美商應用材料股份有限公司 | 升降杆致動器、基板材支撐組件、及利用基板材支撐組件的方法 |
| SG11201800143RA (en) | 2015-08-04 | 2018-02-27 | Hitachi Int Electric Inc | Substrate processing device, semiconductor device manufacturing method, and recording medium |
| EP3258149A1 (de) * | 2016-06-14 | 2017-12-20 | VAT Holding AG | Vakuumventil zur regelung eines flusses und zur unterbrechung eines fliessweges |
| EP3406340B1 (de) * | 2017-05-26 | 2021-07-07 | Thinxxs Microtechnology Ag | Flusszelle mit gehäusebauteil |
| US11268630B2 (en) * | 2018-08-07 | 2022-03-08 | Persimmon Technologies, Corp. | Direct-drive flexure-mechanism vacuum control valve |
| FI130051B (en) | 2019-04-25 | 2023-01-13 | Beneq Oy | DEVICE AND METHOD |
| GB2584160A (en) * | 2019-05-24 | 2020-11-25 | Edwards Ltd | Vacuum assembly and vacuum pump with an axial through passage |
| WO2021181498A1 (ja) * | 2020-03-10 | 2021-09-16 | 株式会社Kokusai Electric | 基板処理装置、排気流量制御装置及び半導体装置の製造方法 |
| US11447866B2 (en) | 2020-06-17 | 2022-09-20 | Applied Materials, Inc. | High temperature chemical vapor deposition lid |
| RU2747895C1 (ru) * | 2020-10-19 | 2021-05-17 | Юрий Иванович Духанин | Криогенный запорно-регулирующий клапан |
| KR102795009B1 (ko) * | 2023-09-27 | 2025-04-15 | (주)동헌기업 | 2-스테이지 액츄에이터 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012121941A2 (en) * | 2011-03-07 | 2012-09-13 | Novellus Systems Inc. | Reduction of a process volume of a processing chamber using a nested dynamic inert volume |
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| AT356989B (de) * | 1975-03-11 | 1980-06-10 | Wurzer Lothar | Vorrichtung zum getrennthalten zweier benachbarter raeume gleichen oder verschiedenen druckes mittels einer membran |
| DE2940239A1 (de) * | 1979-10-04 | 1981-04-16 | Robert Bosch Gmbh, 7000 Stuttgart | Elektromagnetisch betaetigbares ventil |
| DE4119955C2 (de) * | 1991-06-18 | 2000-05-31 | Danfoss As | Miniatur-Betätigungselement |
| JP2729916B2 (ja) * | 1994-04-28 | 1998-03-18 | 大明金属工業株式会社 | 平板栓 |
| JPH09260230A (ja) * | 1996-03-22 | 1997-10-03 | Toshiba Corp | 半導体装置の製造装置および製造方法 |
| US5954079A (en) * | 1996-04-30 | 1999-09-21 | Hewlett-Packard Co. | Asymmetrical thermal actuation in a microactuator |
| US5667197A (en) * | 1996-07-09 | 1997-09-16 | Lam Research Corporation | Vacuum chamber gate valve and method for making same |
| US6079693A (en) * | 1998-05-20 | 2000-06-27 | Applied Komatsu Technology, Inc. | Isolation valves |
| US6192827B1 (en) * | 1998-07-03 | 2001-02-27 | Applied Materials, Inc. | Double slit-valve doors for plasma processing |
| JP2001239143A (ja) * | 2000-02-29 | 2001-09-04 | Showa Shinku:Kk | 排気速度調整機能付き防着バッフル搭載真空装置 |
| US6592709B1 (en) | 2000-04-05 | 2003-07-15 | Applied Materials Inc. | Method and apparatus for plasma processing |
| JP3756429B2 (ja) | 2001-07-12 | 2006-03-15 | Smc株式会社 | 流量制御弁 |
| US20030168174A1 (en) * | 2002-03-08 | 2003-09-11 | Foree Michael Todd | Gas cushion susceptor system |
| CN1184669C (zh) * | 2002-12-10 | 2005-01-12 | 西安电子科技大学 | 硅锗/硅的化学气相沉积生长方法 |
| US7497414B2 (en) * | 2004-06-14 | 2009-03-03 | Applied Materials, Inc. | Curved slit valve door with flexible coupling |
| JP2006292130A (ja) * | 2005-04-14 | 2006-10-26 | Matsushita Electric Ind Co Ltd | ゲートバルブ |
| JP4491737B2 (ja) * | 2005-05-27 | 2010-06-30 | Smc株式会社 | 真空バルブ |
| US7845618B2 (en) * | 2006-06-28 | 2010-12-07 | Applied Materials, Inc. | Valve door with ball coupling |
| JP4299863B2 (ja) * | 2007-01-22 | 2009-07-22 | エルピーダメモリ株式会社 | 半導体装置の製造方法 |
| US8377213B2 (en) | 2008-05-05 | 2013-02-19 | Applied Materials, Inc. | Slit valve having increased flow uniformity |
| JP2010034505A (ja) * | 2008-06-30 | 2010-02-12 | Canon Anelva Corp | 積層ロードロックチャンバおよびそれを備えた基板処理装置 |
| US20100099266A1 (en) | 2008-09-22 | 2010-04-22 | Applied Materials, Inc. | Etch reactor suitable for etching high aspect ratio features |
| JP4265815B1 (ja) * | 2008-10-27 | 2009-05-20 | 株式会社シンクロン | 成膜装置 |
| EP2315236B1 (de) * | 2009-10-22 | 2014-05-14 | VAT Holding AG | Klappen-Transferventil |
| EP2336611A1 (en) * | 2009-12-15 | 2011-06-22 | Applied Materials, Inc. | Water cooled valve |
| EP2355132B1 (de) * | 2010-02-04 | 2014-05-21 | VAT Holding AG | Klappen-Transferventil mit schwenkbarem Ventilverschlussbalken |
| US8562742B2 (en) * | 2010-04-30 | 2013-10-22 | Applied Materials, Inc. | Apparatus for radial delivery of gas to a chamber and methods of use thereof |
| US8652297B2 (en) | 2010-08-03 | 2014-02-18 | Applied Materials, Inc. | Symmetric VHF plasma power coupler with active uniformity steering |
| JP5683388B2 (ja) * | 2010-08-19 | 2015-03-11 | 株式会社日立国際電気 | 半導体装置の製造方法、基板処理方法及び基板処理装置 |
| US9091371B2 (en) * | 2010-12-27 | 2015-07-28 | Kenneth K L Lee | Single axis gate valve for vacuum applications |
| CN103014661A (zh) * | 2011-09-20 | 2013-04-03 | 吉富新能源科技(上海)有限公司 | 设计喷洒气流以镀膜均匀硅薄膜 |
-
2013
- 2013-11-26 WO PCT/US2013/072079 patent/WO2014085497A1/en not_active Ceased
- 2013-11-26 JP JP2015545199A patent/JP6180541B2/ja active Active
- 2013-11-26 CN CN201380061955.1A patent/CN104812939B/zh not_active Expired - Fee Related
- 2013-11-26 KR KR1020157016707A patent/KR101800719B1/ko not_active Expired - Fee Related
- 2013-11-26 US US14/091,130 patent/US9429248B2/en active Active
- 2013-11-29 TW TW102143863A patent/TWI587358B/zh active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012121941A2 (en) * | 2011-03-07 | 2012-09-13 | Novellus Systems Inc. | Reduction of a process volume of a processing chamber using a nested dynamic inert volume |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20240021283A (ko) * | 2021-09-27 | 2024-02-16 | 어플라이드 머티어리얼스, 인코포레이티드 | 내부 웨이퍼 이송 능력을 이용하여 챔버 용적을 프로세스 용적에 대해 격리시키는 방법 |
| KR102879152B1 (ko) * | 2021-09-27 | 2025-11-03 | 어플라이드 머티어리얼스, 인코포레이티드 | 내부 웨이퍼 이송 능력을 이용하여 챔버 용적을 프로세스 용적에 대해 격리시키는 방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201432782A (zh) | 2014-08-16 |
| WO2014085497A1 (en) | 2014-06-05 |
| JP6180541B2 (ja) | 2017-08-16 |
| JP2016505711A (ja) | 2016-02-25 |
| KR20150089047A (ko) | 2015-08-04 |
| CN104812939A (zh) | 2015-07-29 |
| CN104812939B (zh) | 2017-02-22 |
| TWI587358B (zh) | 2017-06-11 |
| US9429248B2 (en) | 2016-08-30 |
| US20140150878A1 (en) | 2014-06-05 |
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