JP7471237B2 - 長い運動能力を有する精密な動的レベリング機構 - Google Patents
長い運動能力を有する精密な動的レベリング機構 Download PDFInfo
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- JP7471237B2 JP7471237B2 JP2020565796A JP2020565796A JP7471237B2 JP 7471237 B2 JP7471237 B2 JP 7471237B2 JP 2020565796 A JP2020565796 A JP 2020565796A JP 2020565796 A JP2020565796 A JP 2020565796A JP 7471237 B2 JP7471237 B2 JP 7471237B2
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- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 104
- 238000000429 assembly Methods 0.000 claims description 35
- 230000000712 assembly Effects 0.000 claims description 35
- 238000003825 pressing Methods 0.000 claims description 5
- 239000000758 substrate Substances 0.000 description 15
- 238000000034 method Methods 0.000 description 10
- 238000005229 chemical vapour deposition Methods 0.000 description 5
- 238000000151 deposition Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 239000007789 gas Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 238000011112 process operation Methods 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000003534 oscillatory effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000007669 thermal treatment Methods 0.000 description 1
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- F16M11/00—Stands or trestles as supports for apparatus or articles placed thereon ; Stands for scientific apparatus such as gravitational force meters
- F16M11/02—Heads
- F16M11/18—Heads with mechanism for moving the apparatus relatively to the stand
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- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
- C23C16/4584—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally the substrate being rotated
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- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
- F16F1/00—Springs
- F16F1/02—Springs made of steel or other material having low internal friction; Wound, torsion, leaf, cup, ring or the like springs, the material of the spring not being relevant
- F16F1/04—Wound springs
- F16F1/12—Attachments or mountings
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- F16M11/00—Stands or trestles as supports for apparatus or articles placed thereon ; Stands for scientific apparatus such as gravitational force meters
- F16M11/02—Heads
- F16M11/04—Means for attachment of apparatus; Means allowing adjustment of the apparatus relatively to the stand
- F16M11/043—Allowing translations
- F16M11/046—Allowing translations adapted to upward-downward translation movement
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- F16M—FRAMES, CASINGS OR BEDS OF ENGINES, MACHINES OR APPARATUS, NOT SPECIFIC TO ENGINES, MACHINES OR APPARATUS PROVIDED FOR ELSEWHERE; STANDS; SUPPORTS
- F16M11/00—Stands or trestles as supports for apparatus or articles placed thereon ; Stands for scientific apparatus such as gravitational force meters
- F16M11/02—Heads
- F16M11/04—Means for attachment of apparatus; Means allowing adjustment of the apparatus relatively to the stand
- F16M11/06—Means for attachment of apparatus; Means allowing adjustment of the apparatus relatively to the stand allowing pivoting
- F16M11/12—Means for attachment of apparatus; Means allowing adjustment of the apparatus relatively to the stand allowing pivoting in more than one direction
- F16M11/121—Means for attachment of apparatus; Means allowing adjustment of the apparatus relatively to the stand allowing pivoting in more than one direction constituted of several dependent joints
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- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16M—FRAMES, CASINGS OR BEDS OF ENGINES, MACHINES OR APPARATUS, NOT SPECIFIC TO ENGINES, MACHINES OR APPARATUS PROVIDED FOR ELSEWHERE; STANDS; SUPPORTS
- F16M11/00—Stands or trestles as supports for apparatus or articles placed thereon ; Stands for scientific apparatus such as gravitational force meters
- F16M11/20—Undercarriages with or without wheels
- F16M11/2007—Undercarriages with or without wheels comprising means allowing pivoting adjustment
- F16M11/2035—Undercarriages with or without wheels comprising means allowing pivoting adjustment in more than one direction
- F16M11/2078—Undercarriages with or without wheels comprising means allowing pivoting adjustment in more than one direction with ball-joint
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
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- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
- F16F2228/00—Functional characteristics, e.g. variability, frequency-dependence
- F16F2228/08—Functional characteristics, e.g. variability, frequency-dependence pre-stressed
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- F16M—FRAMES, CASINGS OR BEDS OF ENGINES, MACHINES OR APPARATUS, NOT SPECIFIC TO ENGINES, MACHINES OR APPARATUS PROVIDED FOR ELSEWHERE; STANDS; SUPPORTS
- F16M2200/00—Details of stands or supports
- F16M2200/04—Balancing means
- F16M2200/041—Balancing means for balancing rotational movement of the head
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Description
Claims (15)
- リフトアセンブリであって、
ベースブラケット;
ステム及びペデスタルを含むペデスタルアセンブリを支持するように構成されたペデスタルアセンブリキャリア;及び
各々がピボットジョイントを介して前記ベースブラケットに取り付けられ、かつ、3つ以上の軸受アセンブリによって前記ペデスタルアセンブリキャリアに取り付けられた、3つ以上のサーボモータアセンブリ
を備えた、リフトアセンブリにおいて、各軸受アセンブリが、
ガイドアクチュエータと、前記リフトアセンブリの前記ペデスタルアセンブリキャリアとに接続されたガイドアダプタ;及び
前記ペデスタルアセンブリキャリアに軸受を接続するように前記ガイドアダプタのポケットを介して挿入されたボルト及びバネであって、前記軸受が、内側レース及び外側レースを有しており、前記内側レースは前記ペデスタルアセンブリキャリアに押し付けられており、前記外側レースは前記ガイドアダプタに押し付けられている、ボルト及びバネ
を備えている、
リフトアセンブリ。 - 前記ボルト及びバネが軸方向に予荷重をかけられている、請求項1に記載のアセンブリ。
- 前記ボルト及びバネが、軸方向に1.36重量キログラム(kgf)から90.72kgfの予荷重をかけられている、請求項2に記載のアセンブリ。
- 前記リフトアセンブリが、0.001インチ未満の位置分解能で、3つの自由度で繰り返し運動するように構成されている、請求項1、2、又は3に記載のアセンブリ。
- 各ピボットジョイントが1つの回転自由度を有する、請求項1、2、3、又は4に記載のアセンブリ。
- 前記軸受が球面スラスト軸受である、請求項1、2、3、4、又は5に記載のアセンブリ。
- 前記軸受がアンギュラコンタクト球面軸受である、請求項1、2、3、4、又は5に記載のアセンブリ。
- 前記ペデスタルアセンブリキャリアに押し付けられた前記内側レースと、前記ガイドアダプタに押し付けられた前記外側レースとが、該内側レースと外側レースとの間に公称クリアランスを提供する、請求項1、2、3、4、5、6、又は7に記載のアセンブリ。
- 前記内側レース及び前記外側レースが、半径方向の運動なしに、互いにスライドするように構成されている、請求項1、2、3、4、5、6、7、又は8に記載のアセンブリ。
- 球面スラスト軸受アセンブリにおいて、
ガイドアクチュエータとリフトアセンブリのペデスタルアセンブリキャリアとに接続されたガイドアダプタであって、前記リフトアセンブリが、
ベースブラケット;
ステム及びペデスタルを含むペデスタルアセンブリを支持するように構成されたペデスタルアセンブリキャリア;及び
各サーボモータアセンブリがピボットジョイントを介して前記ベースブラケットに取り付けられ、かつ軸受アセンブリによって前記ペデスタルアセンブリキャリアに取り付けられた、3つ以上のサーボモータアセンブリ
を備えたガイドアダプタ、並びに
前記ペデスタルアセンブリキャリアに軸受を接続するように前記ガイドアダプタのポケットを介して挿入されたボルト及びバネであって、前記軸受が内側レース及び外側レースを有しており、前記内側レースは前記ペデスタルアセンブリキャリアに押し付けられており、前記外側レースは前記ガイドアダプタに押し付けられている、ボルト及びバネ
を備えている、球面スラスト軸受アセンブリ。 - 前記ボルト及びバネが軸方向に予荷重をかけられている、請求項10に記載のアセンブリ。
- 前記リフトアセンブリが、0.001インチ未満の位置分解能で、3つの自由度で繰り返し運動するように構成されている、請求項10又は11に記載のアセンブリ。
- 各ピボットジョイントが1つの回転自由度を有する、請求項10、11、又は12に記載のアセンブリ。
- 前記ペデスタルアセンブリキャリアに押し付けられた前記内側レースと前記ガイドアダプタに押し付けられた前記外側レースとが、前記内側レースと前記外側レースとの間に公称クリアランスを提供する、請求項10、11、12、又は13に記載のアセンブリ。
- チャンバであって、
チャンバリッド;
複数のチャンバ壁;
チャンバベース;
前記チャンバリッド、前記複数のチャンバ壁、及び前記チャンバベースによって画定された処理領域;及び
リフトアセンブリ
を備えたチャンバにおいて、前記リフトアセンブリが、
ベースブラケット;
ステム及びペデスタルを含むペデスタルアセンブリを支持するように構成されたペデスタルアセンブリキャリアであって、前記ステムが、前記チャンバベース及び前記ベースブラケットの開口部を通して位置付けられ、前記ペデスタルが前記処理領域に配置される、ペデスタルアセンブリキャリア;並びに
各々がピボットジョイントを介して前記ベースブラケットに取り付けられ、かつ、3つ以上の軸受アセンブリによって前記ペデスタルアセンブリキャリアに取り付けられた、3つ以上のサーボモータアセンブリ
を備えており、各軸受アセンブリが、
ガイドアクチュエータと、前記リフトアセンブリの前記ペデスタルアセンブリキャリアとに接続されたガイドアダプタ;及び
前記ペデスタルアセンブリキャリアに軸受を接続するように前記ガイドアダプタのポケットを介して挿入されたボルト及びバネであって、前記軸受が内側レース及び外側レースを有しており、前記内側レースは前記ペデスタルアセンブリキャリアに押し付けられており、及び前記外側レースは前記ガイドアダプタに押し付けられている、ボルト及びバネ
を備えている、
チャンバ。
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US201862676880P | 2018-05-25 | 2018-05-25 | |
US62/676,880 | 2018-05-25 | ||
US201862724186P | 2018-08-29 | 2018-08-29 | |
US62/724,186 | 2018-08-29 | ||
PCT/US2019/030737 WO2019226295A1 (en) | 2018-05-25 | 2019-05-03 | Precision dynamic leveling mechanism with long motion capability |
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JP7471237B2 true JP7471237B2 (ja) | 2024-04-19 |
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JP (1) | JP7471237B2 (ja) |
KR (1) | KR20210003283A (ja) |
CN (1) | CN111937133A (ja) |
SG (1) | SG11202009019PA (ja) |
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US20190360633A1 (en) | 2019-11-28 |
TW202004954A (zh) | 2020-01-16 |
JP2021525953A (ja) | 2021-09-27 |
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CN111937133A (zh) | 2020-11-13 |
KR20210003283A (ko) | 2021-01-11 |
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