KR101787222B1 - 웨이퍼 온도측정 공구 - Google Patents

웨이퍼 온도측정 공구 Download PDF

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Publication number
KR101787222B1
KR101787222B1 KR1020157023878A KR20157023878A KR101787222B1 KR 101787222 B1 KR101787222 B1 KR 101787222B1 KR 1020157023878 A KR1020157023878 A KR 1020157023878A KR 20157023878 A KR20157023878 A KR 20157023878A KR 101787222 B1 KR101787222 B1 KR 101787222B1
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KR
South Korea
Prior art keywords
tool
wafer
temperature
temperature sensor
tool body
Prior art date
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Application number
KR1020157023878A
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English (en)
Korean (ko)
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KR20150113188A (ko
Inventor
에드워드 에이. 맥클로드
데이비드 반덴버그
Original Assignee
퀘리타우, 인크.
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Application filed by 퀘리타우, 인크. filed Critical 퀘리타우, 인크.
Publication of KR20150113188A publication Critical patent/KR20150113188A/ko
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Publication of KR101787222B1 publication Critical patent/KR101787222B1/ko
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
    • G01K1/143—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations for measuring surface temperatures
    • H10P72/0602—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
    • G01K1/146—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations arrangements for moving thermometers to or from a measuring position
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/16—Special arrangements for conducting heat from the object to the sensitive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
KR1020157023878A 2013-03-14 2014-02-24 웨이퍼 온도측정 공구 Active KR101787222B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/827,490 2013-03-14
US13/827,490 US9196516B2 (en) 2013-03-14 2013-03-14 Wafer temperature measurement tool
PCT/US2014/018070 WO2014158549A1 (en) 2013-03-14 2014-02-24 Wafer temperature measurement tool

Publications (2)

Publication Number Publication Date
KR20150113188A KR20150113188A (ko) 2015-10-07
KR101787222B1 true KR101787222B1 (ko) 2017-10-18

Family

ID=50280490

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157023878A Active KR101787222B1 (ko) 2013-03-14 2014-02-24 웨이퍼 온도측정 공구

Country Status (7)

Country Link
US (1) US9196516B2 (enExample)
JP (1) JP6336027B2 (enExample)
KR (1) KR101787222B1 (enExample)
CN (1) CN104838244B (enExample)
DE (1) DE112014001341B4 (enExample)
TW (1) TWI633285B (enExample)
WO (1) WO2014158549A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9196516B2 (en) * 2013-03-14 2015-11-24 Qualitau, Inc. Wafer temperature measurement tool
US10522380B2 (en) * 2014-06-20 2019-12-31 Applied Materials, Inc. Method and apparatus for determining substrate placement in a process chamber
US11114321B2 (en) 2017-08-17 2021-09-07 Tokyo Electron Limited Apparatus and method for real-time sensing of properties in industrial manufacturing equipment
US11646210B2 (en) 2018-06-18 2023-05-09 Tokyo Electron Limited Reduced interference, real-time sensing of properties in manufacturing equipment

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4909986B2 (ja) * 2005-04-12 2012-04-04 シトリニック ゲス フュール エレクトロテクニッシュ オウスルゥスタング エム ベー ハー ウント コー カー ゲー 表面温度測定用センサ装置

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5059032A (en) 1990-08-16 1991-10-22 The Dow Chemical Company Free standing fluxmeter fixture with dual infrared pyrometers
US5446824A (en) * 1991-10-11 1995-08-29 Texas Instruments Lamp-heated chuck for uniform wafer processing
US5436494A (en) 1994-01-12 1995-07-25 Texas Instruments Incorporated Temperature sensor calibration wafer structure and method of fabrication
JP3067962B2 (ja) * 1994-10-19 2000-07-24 新日本製鐵株式会社 接触型測温センサー
WO1997003342A1 (en) 1995-07-10 1997-01-30 Cvc Products, Inc. Automated calibration of temperature sensors in rapid thermal processing
JPH0945752A (ja) * 1995-07-27 1997-02-14 Dainippon Screen Mfg Co Ltd 基板処理装置
JPH11125566A (ja) * 1997-10-22 1999-05-11 Sumitomo Electric Ind Ltd 表面温度測定センサ及び温度測定プローブ
US6110288A (en) 1998-12-17 2000-08-29 Eaton Corporation Temperature probe and measurement method for low pressure process
JP2001085488A (ja) 1999-09-16 2001-03-30 Bridgestone Corp 測温ウエハ
US6355994B1 (en) * 1999-11-05 2002-03-12 Multibeam Systems, Inc. Precision stage
JP3567855B2 (ja) 2000-01-20 2004-09-22 住友電気工業株式会社 半導体製造装置用ウェハ保持体
US6572265B1 (en) * 2001-04-20 2003-06-03 Luxtron Corporation In situ optical surface temperature measuring techniques and devices
JP2004022803A (ja) 2002-06-17 2004-01-22 Taiheiyo Cement Corp 温度測定機能付き突き上げピン
JP2004200619A (ja) 2002-12-20 2004-07-15 Kyocera Corp ウエハ支持部材
US6976782B1 (en) * 2003-11-24 2005-12-20 Lam Research Corporation Methods and apparatus for in situ substrate temperature monitoring
US7275861B2 (en) * 2005-01-31 2007-10-02 Veeco Instruments Inc. Calibration wafer and method of calibrating in situ temperatures
US20080034855A1 (en) 2006-08-11 2008-02-14 Maximiliaan Peeters Sliding weight borehole gravimeter
JP2012230023A (ja) * 2011-04-27 2012-11-22 Tokyo Electron Ltd 温度測定装置、温度校正装置及び温度校正方法
US9196516B2 (en) * 2013-03-14 2015-11-24 Qualitau, Inc. Wafer temperature measurement tool

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4909986B2 (ja) * 2005-04-12 2012-04-04 シトリニック ゲス フュール エレクトロテクニッシュ オウスルゥスタング エム ベー ハー ウント コー カー ゲー 表面温度測定用センサ装置

Also Published As

Publication number Publication date
CN104838244A (zh) 2015-08-12
WO2014158549A1 (en) 2014-10-02
TWI633285B (zh) 2018-08-21
KR20150113188A (ko) 2015-10-07
TW201502479A (zh) 2015-01-16
CN104838244B (zh) 2017-09-15
DE112014001341B4 (de) 2021-05-06
JP6336027B2 (ja) 2018-06-06
DE112014001341T5 (de) 2015-12-03
US9196516B2 (en) 2015-11-24
US20140269822A1 (en) 2014-09-18
JP2016516992A (ja) 2016-06-09

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