JP6336027B2 - ウエハ温度測定ツール - Google Patents

ウエハ温度測定ツール Download PDF

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Publication number
JP6336027B2
JP6336027B2 JP2016500365A JP2016500365A JP6336027B2 JP 6336027 B2 JP6336027 B2 JP 6336027B2 JP 2016500365 A JP2016500365 A JP 2016500365A JP 2016500365 A JP2016500365 A JP 2016500365A JP 6336027 B2 JP6336027 B2 JP 6336027B2
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JP
Japan
Prior art keywords
tool
wafer
temperature
temperature measurement
temperature sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016500365A
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English (en)
Japanese (ja)
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JP2016516992A (ja
JP2016516992A5 (enExample
Inventor
マクラウド・エドワード・エー．
ヴァンデンバーグ・デービッド
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
QualiTau Inc
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QualiTau Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by QualiTau Inc filed Critical QualiTau Inc
Publication of JP2016516992A publication Critical patent/JP2016516992A/ja
Publication of JP2016516992A5 publication Critical patent/JP2016516992A5/ja
Application granted granted Critical
Publication of JP6336027B2 publication Critical patent/JP6336027B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
    • G01K1/143—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations for measuring surface temperatures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
    • G01K1/146—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations arrangements for moving thermometers to or from a measuring position

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
JP2016500365A 2013-03-14 2014-02-24 ウエハ温度測定ツール Active JP6336027B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/827,490 2013-03-14
US13/827,490 US9196516B2 (en) 2013-03-14 2013-03-14 Wafer temperature measurement tool
PCT/US2014/018070 WO2014158549A1 (en) 2013-03-14 2014-02-24 Wafer temperature measurement tool

Publications (3)

Publication Number Publication Date
JP2016516992A JP2016516992A (ja) 2016-06-09
JP2016516992A5 JP2016516992A5 (enExample) 2017-03-23
JP6336027B2 true JP6336027B2 (ja) 2018-06-06

Family

ID=50280490

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016500365A Active JP6336027B2 (ja) 2013-03-14 2014-02-24 ウエハ温度測定ツール

Country Status (7)

Country Link
US (1) US9196516B2 (enExample)
JP (1) JP6336027B2 (enExample)
KR (1) KR101787222B1 (enExample)
CN (1) CN104838244B (enExample)
DE (1) DE112014001341B4 (enExample)
TW (1) TWI633285B (enExample)
WO (1) WO2014158549A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9196516B2 (en) * 2013-03-14 2015-11-24 Qualitau, Inc. Wafer temperature measurement tool
US10522380B2 (en) * 2014-06-20 2019-12-31 Applied Materials, Inc. Method and apparatus for determining substrate placement in a process chamber
US11114321B2 (en) 2017-08-17 2021-09-07 Tokyo Electron Limited Apparatus and method for real-time sensing of properties in industrial manufacturing equipment
US11646210B2 (en) 2018-06-18 2023-05-09 Tokyo Electron Limited Reduced interference, real-time sensing of properties in manufacturing equipment

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5059032A (en) 1990-08-16 1991-10-22 The Dow Chemical Company Free standing fluxmeter fixture with dual infrared pyrometers
US5446824A (en) * 1991-10-11 1995-08-29 Texas Instruments Lamp-heated chuck for uniform wafer processing
US5436494A (en) 1994-01-12 1995-07-25 Texas Instruments Incorporated Temperature sensor calibration wafer structure and method of fabrication
JP3067962B2 (ja) * 1994-10-19 2000-07-24 新日本製鐵株式会社 接触型測温センサー
US6004029A (en) * 1995-07-10 1999-12-21 Cvc Products, Inc. Method for automated calibration of temperature sensors in rapid thermal processing equipment
JPH0945752A (ja) * 1995-07-27 1997-02-14 Dainippon Screen Mfg Co Ltd 基板処理装置
JPH11125566A (ja) * 1997-10-22 1999-05-11 Sumitomo Electric Ind Ltd 表面温度測定センサ及び温度測定プローブ
US6110288A (en) 1998-12-17 2000-08-29 Eaton Corporation Temperature probe and measurement method for low pressure process
JP2001085488A (ja) 1999-09-16 2001-03-30 Bridgestone Corp 測温ウエハ
US6355994B1 (en) * 1999-11-05 2002-03-12 Multibeam Systems, Inc. Precision stage
JP3567855B2 (ja) 2000-01-20 2004-09-22 住友電気工業株式会社 半導体製造装置用ウェハ保持体
US6572265B1 (en) * 2001-04-20 2003-06-03 Luxtron Corporation In situ optical surface temperature measuring techniques and devices
JP2004022803A (ja) 2002-06-17 2004-01-22 Taiheiyo Cement Corp 温度測定機能付き突き上げピン
JP2004200619A (ja) 2002-12-20 2004-07-15 Kyocera Corp ウエハ支持部材
US6976782B1 (en) * 2003-11-24 2005-12-20 Lam Research Corporation Methods and apparatus for in situ substrate temperature monitoring
US7275861B2 (en) * 2005-01-31 2007-10-02 Veeco Instruments Inc. Calibration wafer and method of calibrating in situ temperatures
DE102005016896B3 (de) * 2005-04-12 2006-10-26 Sitronic Gesellschaft für elektrotechnische Ausrüstung mbH. & Co. KG Sensoranordnung zur Temperaturmessung
US20080034855A1 (en) 2006-08-11 2008-02-14 Maximiliaan Peeters Sliding weight borehole gravimeter
JP2012230023A (ja) * 2011-04-27 2012-11-22 Tokyo Electron Ltd 温度測定装置、温度校正装置及び温度校正方法
US9196516B2 (en) * 2013-03-14 2015-11-24 Qualitau, Inc. Wafer temperature measurement tool

Also Published As

Publication number Publication date
KR101787222B1 (ko) 2017-10-18
US20140269822A1 (en) 2014-09-18
CN104838244A (zh) 2015-08-12
DE112014001341B4 (de) 2021-05-06
CN104838244B (zh) 2017-09-15
DE112014001341T5 (de) 2015-12-03
TWI633285B (zh) 2018-08-21
JP2016516992A (ja) 2016-06-09
KR20150113188A (ko) 2015-10-07
US9196516B2 (en) 2015-11-24
TW201502479A (zh) 2015-01-16
WO2014158549A1 (en) 2014-10-02

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