TWI633285B - 測量晶圓溫度的工具和方法 - Google Patents

測量晶圓溫度的工具和方法 Download PDF

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Publication number
TWI633285B
TWI633285B TW103107033A TW103107033A TWI633285B TW I633285 B TWI633285 B TW I633285B TW 103107033 A TW103107033 A TW 103107033A TW 103107033 A TW103107033 A TW 103107033A TW I633285 B TWI633285 B TW I633285B
Authority
TW
Taiwan
Prior art keywords
temperature
wafer
tool
measuring
temperature sensor
Prior art date
Application number
TW103107033A
Other languages
English (en)
Chinese (zh)
Other versions
TW201502479A (zh
Inventor
艾德華 麥洛德
大衛 范登柏
Original Assignee
克禮陶股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 克禮陶股份有限公司 filed Critical 克禮陶股份有限公司
Publication of TW201502479A publication Critical patent/TW201502479A/zh
Application granted granted Critical
Publication of TWI633285B publication Critical patent/TWI633285B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
    • G01K1/143—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations for measuring surface temperatures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
    • G01K1/146—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations arrangements for moving thermometers to or from a measuring position

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
TW103107033A 2013-03-14 2014-03-03 測量晶圓溫度的工具和方法 TWI633285B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/827,490 2013-03-14
US13/827,490 US9196516B2 (en) 2013-03-14 2013-03-14 Wafer temperature measurement tool

Publications (2)

Publication Number Publication Date
TW201502479A TW201502479A (zh) 2015-01-16
TWI633285B true TWI633285B (zh) 2018-08-21

Family

ID=50280490

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103107033A TWI633285B (zh) 2013-03-14 2014-03-03 測量晶圓溫度的工具和方法

Country Status (7)

Country Link
US (1) US9196516B2 (enExample)
JP (1) JP6336027B2 (enExample)
KR (1) KR101787222B1 (enExample)
CN (1) CN104838244B (enExample)
DE (1) DE112014001341B4 (enExample)
TW (1) TWI633285B (enExample)
WO (1) WO2014158549A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9196516B2 (en) * 2013-03-14 2015-11-24 Qualitau, Inc. Wafer temperature measurement tool
US10522380B2 (en) * 2014-06-20 2019-12-31 Applied Materials, Inc. Method and apparatus for determining substrate placement in a process chamber
US11114321B2 (en) 2017-08-17 2021-09-07 Tokyo Electron Limited Apparatus and method for real-time sensing of properties in industrial manufacturing equipment
JP7357191B2 (ja) 2018-06-18 2023-10-06 東京エレクトロン株式会社 製造装置における特性の低干渉でのリアルタイム感知

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6004029A (en) * 1995-07-10 1999-12-21 Cvc Products, Inc. Method for automated calibration of temperature sensors in rapid thermal processing equipment
US6110288A (en) * 1998-12-17 2000-08-29 Eaton Corporation Temperature probe and measurement method for low pressure process
US6572265B1 (en) * 2001-04-20 2003-06-03 Luxtron Corporation In situ optical surface temperature measuring techniques and devices
TW557531B (en) * 2000-01-20 2003-10-11 Sumitomo Electric Industries Wafer holder for semiconductor manufacturing apparatus and semiconductor manufacturing apparatus using the same
US7275861B2 (en) * 2005-01-31 2007-10-02 Veeco Instruments Inc. Calibration wafer and method of calibrating in situ temperatures

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5059032A (en) 1990-08-16 1991-10-22 The Dow Chemical Company Free standing fluxmeter fixture with dual infrared pyrometers
US5446824A (en) * 1991-10-11 1995-08-29 Texas Instruments Lamp-heated chuck for uniform wafer processing
US5436494A (en) 1994-01-12 1995-07-25 Texas Instruments Incorporated Temperature sensor calibration wafer structure and method of fabrication
JP3067962B2 (ja) * 1994-10-19 2000-07-24 新日本製鐵株式会社 接触型測温センサー
JPH0945752A (ja) * 1995-07-27 1997-02-14 Dainippon Screen Mfg Co Ltd 基板処理装置
JPH11125566A (ja) * 1997-10-22 1999-05-11 Sumitomo Electric Ind Ltd 表面温度測定センサ及び温度測定プローブ
JP2001085488A (ja) 1999-09-16 2001-03-30 Bridgestone Corp 測温ウエハ
US6355994B1 (en) * 1999-11-05 2002-03-12 Multibeam Systems, Inc. Precision stage
JP2004022803A (ja) 2002-06-17 2004-01-22 Taiheiyo Cement Corp 温度測定機能付き突き上げピン
JP2004200619A (ja) 2002-12-20 2004-07-15 Kyocera Corp ウエハ支持部材
US6976782B1 (en) * 2003-11-24 2005-12-20 Lam Research Corporation Methods and apparatus for in situ substrate temperature monitoring
DE102005016896B3 (de) * 2005-04-12 2006-10-26 Sitronic Gesellschaft für elektrotechnische Ausrüstung mbH. & Co. KG Sensoranordnung zur Temperaturmessung
US20080034855A1 (en) 2006-08-11 2008-02-14 Maximiliaan Peeters Sliding weight borehole gravimeter
JP2012230023A (ja) * 2011-04-27 2012-11-22 Tokyo Electron Ltd 温度測定装置、温度校正装置及び温度校正方法
US9196516B2 (en) * 2013-03-14 2015-11-24 Qualitau, Inc. Wafer temperature measurement tool

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6004029A (en) * 1995-07-10 1999-12-21 Cvc Products, Inc. Method for automated calibration of temperature sensors in rapid thermal processing equipment
US6110288A (en) * 1998-12-17 2000-08-29 Eaton Corporation Temperature probe and measurement method for low pressure process
TW557531B (en) * 2000-01-20 2003-10-11 Sumitomo Electric Industries Wafer holder for semiconductor manufacturing apparatus and semiconductor manufacturing apparatus using the same
US6572265B1 (en) * 2001-04-20 2003-06-03 Luxtron Corporation In situ optical surface temperature measuring techniques and devices
US7275861B2 (en) * 2005-01-31 2007-10-02 Veeco Instruments Inc. Calibration wafer and method of calibrating in situ temperatures

Also Published As

Publication number Publication date
JP6336027B2 (ja) 2018-06-06
KR101787222B1 (ko) 2017-10-18
CN104838244A (zh) 2015-08-12
DE112014001341T5 (de) 2015-12-03
DE112014001341B4 (de) 2021-05-06
CN104838244B (zh) 2017-09-15
US9196516B2 (en) 2015-11-24
KR20150113188A (ko) 2015-10-07
JP2016516992A (ja) 2016-06-09
TW201502479A (zh) 2015-01-16
US20140269822A1 (en) 2014-09-18
WO2014158549A1 (en) 2014-10-02

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