CN104838244B - 晶片温度测量工具 - Google Patents

晶片温度测量工具 Download PDF

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Publication number
CN104838244B
CN104838244B CN201480003511.7A CN201480003511A CN104838244B CN 104838244 B CN104838244 B CN 104838244B CN 201480003511 A CN201480003511 A CN 201480003511A CN 104838244 B CN104838244 B CN 104838244B
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CN
China
Prior art keywords
temperature
wafer
tool body
temperature sensor
instrument
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201480003511.7A
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English (en)
Chinese (zh)
Other versions
CN104838244A (zh
Inventor
E.A.麦克劳德
D.范登伯格
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
QualiTau Inc
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QualiTau Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Publication of CN104838244A publication Critical patent/CN104838244A/zh
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Publication of CN104838244B publication Critical patent/CN104838244B/zh
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
    • G01K1/143—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations for measuring surface temperatures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
    • G01K1/146—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations arrangements for moving thermometers to or from a measuring position

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
CN201480003511.7A 2013-03-14 2014-02-24 晶片温度测量工具 Active CN104838244B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/827490 2013-03-14
US13/827,490 US9196516B2 (en) 2013-03-14 2013-03-14 Wafer temperature measurement tool
PCT/US2014/018070 WO2014158549A1 (en) 2013-03-14 2014-02-24 Wafer temperature measurement tool

Publications (2)

Publication Number Publication Date
CN104838244A CN104838244A (zh) 2015-08-12
CN104838244B true CN104838244B (zh) 2017-09-15

Family

ID=50280490

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480003511.7A Active CN104838244B (zh) 2013-03-14 2014-02-24 晶片温度测量工具

Country Status (7)

Country Link
US (1) US9196516B2 (enExample)
JP (1) JP6336027B2 (enExample)
KR (1) KR101787222B1 (enExample)
CN (1) CN104838244B (enExample)
DE (1) DE112014001341B4 (enExample)
TW (1) TWI633285B (enExample)
WO (1) WO2014158549A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9196516B2 (en) * 2013-03-14 2015-11-24 Qualitau, Inc. Wafer temperature measurement tool
US10522380B2 (en) * 2014-06-20 2019-12-31 Applied Materials, Inc. Method and apparatus for determining substrate placement in a process chamber
US11114321B2 (en) 2017-08-17 2021-09-07 Tokyo Electron Limited Apparatus and method for real-time sensing of properties in industrial manufacturing equipment
JP7357191B2 (ja) 2018-06-18 2023-10-06 東京エレクトロン株式会社 製造装置における特性の低干渉でのリアルタイム感知

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5446824A (en) * 1991-10-11 1995-08-29 Texas Instruments Lamp-heated chuck for uniform wafer processing
US6004029A (en) * 1995-07-10 1999-12-21 Cvc Products, Inc. Method for automated calibration of temperature sensors in rapid thermal processing equipment
CN1402830A (zh) * 1999-11-05 2003-03-12 多束系统公司 精密工作台
US6572265B1 (en) * 2001-04-20 2003-06-03 Luxtron Corporation In situ optical surface temperature measuring techniques and devices
WO2006083819A1 (en) * 2005-01-31 2006-08-10 Veeco Instruments Inc. Calibration wafer and method of calibrating in situ temperatures
CN1886641A (zh) * 2003-11-24 2006-12-27 朗姆研究公司 用于现场衬底温度监控的方法和设备

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5059032A (en) 1990-08-16 1991-10-22 The Dow Chemical Company Free standing fluxmeter fixture with dual infrared pyrometers
US5436494A (en) 1994-01-12 1995-07-25 Texas Instruments Incorporated Temperature sensor calibration wafer structure and method of fabrication
JP3067962B2 (ja) * 1994-10-19 2000-07-24 新日本製鐵株式会社 接触型測温センサー
JPH0945752A (ja) * 1995-07-27 1997-02-14 Dainippon Screen Mfg Co Ltd 基板処理装置
JPH11125566A (ja) * 1997-10-22 1999-05-11 Sumitomo Electric Ind Ltd 表面温度測定センサ及び温度測定プローブ
US6110288A (en) 1998-12-17 2000-08-29 Eaton Corporation Temperature probe and measurement method for low pressure process
JP2001085488A (ja) 1999-09-16 2001-03-30 Bridgestone Corp 測温ウエハ
JP3567855B2 (ja) 2000-01-20 2004-09-22 住友電気工業株式会社 半導体製造装置用ウェハ保持体
JP2004022803A (ja) 2002-06-17 2004-01-22 Taiheiyo Cement Corp 温度測定機能付き突き上げピン
JP2004200619A (ja) 2002-12-20 2004-07-15 Kyocera Corp ウエハ支持部材
DE102005016896B3 (de) * 2005-04-12 2006-10-26 Sitronic Gesellschaft für elektrotechnische Ausrüstung mbH. & Co. KG Sensoranordnung zur Temperaturmessung
US20080034855A1 (en) 2006-08-11 2008-02-14 Maximiliaan Peeters Sliding weight borehole gravimeter
JP2012230023A (ja) * 2011-04-27 2012-11-22 Tokyo Electron Ltd 温度測定装置、温度校正装置及び温度校正方法
US9196516B2 (en) * 2013-03-14 2015-11-24 Qualitau, Inc. Wafer temperature measurement tool

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5446824A (en) * 1991-10-11 1995-08-29 Texas Instruments Lamp-heated chuck for uniform wafer processing
US6004029A (en) * 1995-07-10 1999-12-21 Cvc Products, Inc. Method for automated calibration of temperature sensors in rapid thermal processing equipment
CN1402830A (zh) * 1999-11-05 2003-03-12 多束系统公司 精密工作台
US6572265B1 (en) * 2001-04-20 2003-06-03 Luxtron Corporation In situ optical surface temperature measuring techniques and devices
CN1886641A (zh) * 2003-11-24 2006-12-27 朗姆研究公司 用于现场衬底温度监控的方法和设备
WO2006083819A1 (en) * 2005-01-31 2006-08-10 Veeco Instruments Inc. Calibration wafer and method of calibrating in situ temperatures

Also Published As

Publication number Publication date
JP6336027B2 (ja) 2018-06-06
KR101787222B1 (ko) 2017-10-18
CN104838244A (zh) 2015-08-12
DE112014001341T5 (de) 2015-12-03
DE112014001341B4 (de) 2021-05-06
US9196516B2 (en) 2015-11-24
KR20150113188A (ko) 2015-10-07
TWI633285B (zh) 2018-08-21
JP2016516992A (ja) 2016-06-09
TW201502479A (zh) 2015-01-16
US20140269822A1 (en) 2014-09-18
WO2014158549A1 (en) 2014-10-02

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