KR101780684B1 - 도전성 접착제, 도전성 접착시트, 전자파 차폐 시트 및 프린트 배선판 - Google Patents

도전성 접착제, 도전성 접착시트, 전자파 차폐 시트 및 프린트 배선판 Download PDF

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KR101780684B1
KR101780684B1 KR1020160063301A KR20160063301A KR101780684B1 KR 101780684 B1 KR101780684 B1 KR 101780684B1 KR 1020160063301 A KR1020160063301 A KR 1020160063301A KR 20160063301 A KR20160063301 A KR 20160063301A KR 101780684 B1 KR101780684 B1 KR 101780684B1
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South Korea
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conductive adhesive
conductive
resin
parts
sheet
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KR1020160063301A
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Korean (ko)
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KR20160140422A (ko
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츠토무 하야사카
히로유키 콘도
카즈노리 마츠도
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토요잉크Sc홀딩스주식회사
토요켐주식회사
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
    • C09J167/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/06—Polyurethanes from polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/08—Polyurethanes from polyethers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • C09J177/06—Polyamides derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • C09J177/06—Polyamides derived from polyamines and polycarboxylic acids
    • C09J177/08—Polyamides derived from polyamines and polycarboxylic acids from polyamines and polymerised unsaturated fatty acids
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C09J201/02—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C09J201/06—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing oxygen atoms
    • C09J201/08—Carboxyl groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/02—
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Structure Of Printed Boards (AREA)
KR1020160063301A 2015-05-27 2016-05-24 도전성 접착제, 도전성 접착시트, 전자파 차폐 시트 및 프린트 배선판 KR101780684B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015107080A JP5854248B1 (ja) 2015-05-27 2015-05-27 導電性接着剤、ならびにそれを用いた導電性接着シートおよび電磁波シールドシート
JPJP-P-2015-107080 2015-05-27

Publications (2)

Publication Number Publication Date
KR20160140422A KR20160140422A (ko) 2016-12-07
KR101780684B1 true KR101780684B1 (ko) 2017-09-21

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KR1020160063301A KR101780684B1 (ko) 2015-05-27 2016-05-24 도전성 접착제, 도전성 접착시트, 전자파 차폐 시트 및 프린트 배선판

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JP (1) JP5854248B1 (zh)
KR (1) KR101780684B1 (zh)
CN (1) CN106189918B (zh)
TW (1) TWI585186B (zh)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018056424A (ja) * 2016-09-30 2018-04-05 信越ポリマー株式会社 電磁波シールドフィルムの製造方法および電磁波シールドフィルム付きプリント配線板の製造方法
JP6237944B1 (ja) * 2017-02-03 2017-11-29 東洋インキＳｃホールディングス株式会社 熱硬化性接着シート、およびその利用
JP6554618B2 (ja) * 2017-02-13 2019-07-31 タツタ電線株式会社 シールドプリント配線板及びシールドプリント配線板の製造方法
JP6969165B2 (ja) * 2017-06-02 2021-11-24 昭和電工マテリアルズ株式会社 異方導電性接着剤組成物、異方導電性フィルム、及び接続構造体
CN109219259B (zh) * 2017-07-05 2021-09-14 宏启胜精密电子(秦皇岛)有限公司 柔性电路板及其制作方法
JP7031203B2 (ja) * 2017-09-29 2022-03-08 東洋インキＳｃホールディングス株式会社 放熱用接着シート、放熱接着部材用積層体、及び複合部材
US20210017427A1 (en) * 2017-12-28 2021-01-21 Hitachi Chemical Company, Ltd. Adhesive film
WO2019189512A1 (ja) * 2018-03-30 2019-10-03 田中貴金属工業株式会社 導電性接着剤組成物
JP7070061B2 (ja) * 2018-05-11 2022-05-18 Dic株式会社 導電性接着剤組成物
JP6544466B1 (ja) * 2018-06-21 2019-07-17 東洋インキＳｃホールディングス株式会社 電磁波シールドシートおよびプリント配線板
JP6497477B1 (ja) * 2018-10-03 2019-04-10 東洋インキＳｃホールディングス株式会社 電磁波シールドシート、および電子部品搭載基板
CN113614142A (zh) * 2019-03-19 2021-11-05 积水化学工业株式会社 树脂粒子、导电性粒子、导电材料及连接结构体
JP7211403B2 (ja) * 2019-10-23 2023-01-24 三菱ケミカル株式会社 接着剤組成物及び接着剤
KR20220087444A (ko) * 2019-10-23 2022-06-24 미쯔비시 케미컬 주식회사 플렉시블 프린트 배선판용 접착제 조성물, 플렉시블 프린트 배선판용 접착제 및 플렉시블 프린트 배선판
JP7127674B2 (ja) * 2020-02-21 2022-08-30 三菱ケミカル株式会社 接着剤組成物及び接着剤
CN113613482B (zh) * 2021-08-06 2024-03-19 航天智造科技股份有限公司 适用于极小接地孔接地的电磁波屏蔽膜、制备方法及应用
WO2023188206A1 (ja) * 2022-03-30 2023-10-05 東洋インキＳｃホールディングス株式会社 金属板用接合剤、プリント配線板用補強部材及びその製造方法、並びに、配線板及びその製造方法
KR102699619B1 (ko) * 2022-11-03 2024-08-28 율촌화학 주식회사 단차 추종성과 레진플로우가 우수한 열경화형 도전성 접착 필름
KR102699620B1 (ko) * 2022-11-03 2024-08-28 율촌화학 주식회사 벤딩성 및 단차 추종성이 우수한 열경화형 도전성 접착 필름

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JP2009040932A (ja) 2007-08-10 2009-02-26 Taiyo Ink Mfg Ltd 導電性樹脂組成物、それを用いて得られる導電性パターンを有する基板
JP2009290195A (ja) 2008-04-30 2009-12-10 Toyo Ink Mfg Co Ltd 硬化性電磁波シールド性接着性フィルムおよびその製造方法

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JP5528857B2 (ja) 2010-03-11 2014-06-25 タツタ電線株式会社 電磁波シールドフィルム、これを用いたフレキシブル基板及びその製造方法
JP5701695B2 (ja) * 2011-06-13 2015-04-15 三井金属鉱業株式会社 銀被覆銅粉及びその製造方法
WO2014010524A1 (ja) * 2012-07-11 2014-01-16 タツタ電線株式会社 硬化性導電性接着剤組成物、電磁波シールドフィルム、導電性接着フィルム、接着方法及び回路基板
JP6155876B2 (ja) 2012-12-28 2017-07-05 東洋インキＳｃホールディングス株式会社 導電性樹脂組成物

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Publication number Priority date Publication date Assignee Title
JP2005244138A (ja) * 2004-02-27 2005-09-08 Toyobo Co Ltd フレキシブルプリント配線基板
JP2009040932A (ja) 2007-08-10 2009-02-26 Taiyo Ink Mfg Ltd 導電性樹脂組成物、それを用いて得られる導電性パターンを有する基板
JP2009290195A (ja) 2008-04-30 2009-12-10 Toyo Ink Mfg Co Ltd 硬化性電磁波シールド性接着性フィルムおよびその製造方法

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CN106189918B (zh) 2019-01-11
TWI585186B (zh) 2017-06-01
CN106189918A (zh) 2016-12-07
TW201641645A (zh) 2016-12-01
KR20160140422A (ko) 2016-12-07
JP2016222748A (ja) 2016-12-28
JP5854248B1 (ja) 2016-02-09

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