KR101780130B1 - 캐리어 부착 동박 - Google Patents

캐리어 부착 동박 Download PDF

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Publication number
KR101780130B1
KR101780130B1 KR1020157006010A KR20157006010A KR101780130B1 KR 101780130 B1 KR101780130 B1 KR 101780130B1 KR 1020157006010 A KR1020157006010 A KR 1020157006010A KR 20157006010 A KR20157006010 A KR 20157006010A KR 101780130 B1 KR101780130 B1 KR 101780130B1
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KR
South Korea
Prior art keywords
layer
carrier
resin
ultra
copper foil
Prior art date
Application number
KR1020157006010A
Other languages
English (en)
Korean (ko)
Other versions
KR20150041107A (ko
Inventor
미사토 혼다
도모타 나가우라
Original Assignee
제이엑스금속주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 제이엑스금속주식회사 filed Critical 제이엑스금속주식회사
Publication of KR20150041107A publication Critical patent/KR20150041107A/ko
Application granted granted Critical
Publication of KR101780130B1 publication Critical patent/KR101780130B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C19/00—Alloys based on nickel or cobalt
    • C22C19/03—Alloys based on nickel or cobalt based on nickel
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C19/00—Alloys based on nickel or cobalt
    • C22C19/07—Alloys based on nickel or cobalt based on cobalt
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/20—Separation of the formed objects from the electrodes with no destruction of said electrodes
    • C25D1/22—Separating compounds
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C27/00—Alloys based on rhenium or a refractory metal not mentioned in groups C22C14/00 or C22C16/00
    • C22C27/04—Alloys based on tungsten or molybdenum
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
KR1020157006010A 2012-08-08 2013-08-08 캐리어 부착 동박 KR101780130B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012176388A JP5228130B1 (ja) 2012-08-08 2012-08-08 キャリア付銅箔
JPJP-P-2012-176388 2012-08-08
PCT/JP2013/071558 WO2014024994A1 (ja) 2012-08-08 2013-08-08 キャリア付銅箔

Publications (2)

Publication Number Publication Date
KR20150041107A KR20150041107A (ko) 2015-04-15
KR101780130B1 true KR101780130B1 (ko) 2017-09-19

Family

ID=48913929

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157006010A KR101780130B1 (ko) 2012-08-08 2013-08-08 캐리어 부착 동박

Country Status (5)

Country Link
JP (1) JP5228130B1 (ja)
KR (1) KR101780130B1 (ja)
CN (1) CN104584699B (ja)
TW (1) TWI523756B (ja)
WO (1) WO2014024994A1 (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5885791B2 (ja) * 2013-08-20 2016-03-15 Ｊｘ金属株式会社 表面処理銅箔及びそれを用いた積層板、キャリア付銅箔、銅箔、プリント配線板、電子機器、電子機器の製造方法、並びに、プリント配線板の製造方法
JP5885790B2 (ja) * 2013-08-20 2016-03-15 Ｊｘ金属株式会社 表面処理銅箔及びそれを用いた積層板、キャリア付銅箔、プリント配線板、電子機器、電子機器の製造方法、並びに、プリント配線板の製造方法
JP6591766B2 (ja) * 2014-04-24 2019-10-16 Ｊｘ金属株式会社 キャリア付銅箔、プリント配線板、積層体、電子機器及びプリント配線板の製造方法
TWI616122B (zh) 2014-05-28 2018-02-21 Jx Nippon Mining & Metals Corp 表面處理銅箔、附載體銅箔、積層體、印刷配線板、電子機器、表面處理銅箔的製造方法及印刷配線板的製造方法
JP6236119B2 (ja) * 2015-06-24 2017-11-22 Ｊｘ金属株式会社 キャリア付銅箔、積層体、積層体の製造方法、プリント配線板の製造方法及び電子機器の製造方法
CN104902696B (zh) * 2015-06-24 2017-11-28 上海美维科技有限公司 一种基于埋线结构在印制电路板上制作铜柱的方法
JP6236120B2 (ja) * 2015-06-24 2017-11-22 Ｊｘ金属株式会社 キャリア付銅箔、積層体、積層体の製造方法、プリント配線板の製造方法及び電子機器の製造方法
CN106626580B (zh) 2015-10-28 2019-12-24 财团法人工业技术研究院 复合积层板
DK3555347T3 (da) * 2016-12-16 2023-08-21 Topsoe As Aflejring af en belægning på en sammenkobling til fastoxidcellestabler
CN112226790B (zh) * 2020-10-19 2022-04-22 九江德福科技股份有限公司 一种超薄高强度电子铜箔的生产方法
KR20230146517A (ko) * 2021-02-19 2023-10-19 미쓰이금속광업주식회사 적층판 및 발열체의 제조 방법 그리고 디프로스터
CN116829348A (zh) * 2021-02-19 2023-09-29 三井金属矿业株式会社 层叠板和发热体的制造方法以及除霜器

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006022406A (ja) 2000-09-22 2006-01-26 Furukawa Circuit Foil Kk キャリア付き極薄銅箔
JP2007186782A (ja) 2005-12-15 2007-07-26 Furukawa Circuit Foil Kk キャリア付き極薄銅箔及びプリント配線基板
WO2010027052A1 (ja) 2008-09-05 2010-03-11 古河電気工業株式会社 キャリア付き極薄銅箔、並びに銅貼積層板またはプリント配線基板

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6346335B1 (en) * 2000-03-10 2002-02-12 Olin Corporation Copper foil composite including a release layer
TW200420208A (en) * 2002-10-31 2004-10-01 Furukawa Circuit Foil Ultra-thin copper foil with carrier, method of production of the same, and printed circuit board using ultra-thin copper foil with carrier
CN1984526B (zh) * 2005-12-15 2011-01-12 古河电气工业株式会社 带载体的极薄铜箔及印刷电路基板
JP2010258398A (ja) * 2009-03-31 2010-11-11 Jx Nippon Mining & Metals Corp プリント配線板用銅箔
CN102124823B (zh) * 2009-06-30 2013-03-06 Jx日矿日石金属株式会社 印刷布线板用铜箔
WO2011001551A1 (ja) * 2009-06-30 2011-01-06 Jx日鉱日石金属株式会社 プリント配線板用銅箔
CN102233699B (zh) * 2010-04-29 2013-10-16 南亚塑胶工业股份有限公司 以超低棱线铜箔为载体的极薄铜箔及其制造方法
TWI525221B (zh) * 2010-10-06 2016-03-11 Furukawa Electric Co Ltd Copper foil and its manufacturing method, carrier copper foil and its manufacturing method, printed circuit board and multilayer printed circuit board

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006022406A (ja) 2000-09-22 2006-01-26 Furukawa Circuit Foil Kk キャリア付き極薄銅箔
JP2007186782A (ja) 2005-12-15 2007-07-26 Furukawa Circuit Foil Kk キャリア付き極薄銅箔及びプリント配線基板
WO2010027052A1 (ja) 2008-09-05 2010-03-11 古河電気工業株式会社 キャリア付き極薄銅箔、並びに銅貼積層板またはプリント配線基板

Also Published As

Publication number Publication date
TW201412518A (zh) 2014-04-01
TWI523756B (zh) 2016-03-01
CN104584699A (zh) 2015-04-29
CN104584699B (zh) 2017-09-26
JP2014034705A (ja) 2014-02-24
WO2014024994A1 (ja) 2014-02-13
JP5228130B1 (ja) 2013-07-03
KR20150041107A (ko) 2015-04-15

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