KR101772352B1 - 발광 재료, 발광 재료의 제조 방법, 및 발광 재료의 용도 - Google Patents

발광 재료, 발광 재료의 제조 방법, 및 발광 재료의 용도 Download PDF

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KR101772352B1
KR101772352B1 KR1020167012030A KR20167012030A KR101772352B1 KR 101772352 B1 KR101772352 B1 KR 101772352B1 KR 1020167012030 A KR1020167012030 A KR 1020167012030A KR 20167012030 A KR20167012030 A KR 20167012030A KR 101772352 B1 KR101772352 B1 KR 101772352B1
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light emitting
emitting material
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light
luminescent
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KR20160067996A (ko
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팀 피들러
다니엘 비흘러
슈테판 랑게
레베카 뢰머
프란크 예르만
프라우케 티넬
바바라 허켄베크
알렉산데르 바움가르트너
페라 슈퇴펠캄프
노르베르트 뵈니쉬
하이링 쿠이
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오스람 옵토 세미컨덕터스 게엠베하
오스람 게엠베하
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    • C09K11/00Luminescent, e.g. electroluminescent, chemiluminescent materials
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    • C09K11/77Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
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    • C09K11/77Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/7729Chalcogenides
    • C09K11/7731Chalcogenides with alkaline earth metals
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    • C09K11/00Luminescent, e.g. electroluminescent, chemiluminescent materials
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    • C09K11/77Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
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    • C09K11/77Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/77348Silicon Aluminium Nitrides or Silicon Aluminium Oxynitrides
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    • C09K11/77Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7766Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00Refractors for light sources
    • F21V5/04Refractors for light sources of lens shape
    • H01L33/502
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/12Light sources with substantially two-dimensional radiating surfaces
    • H05B33/14Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/036Manufacture or treatment of packages
    • H10H20/0361Manufacture or treatment of packages of wavelength conversion means
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    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/851Wavelength conversion means
    • H10H20/8511Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512Wavelength conversion materials
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    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/851Wavelength conversion means
    • H10H20/8511Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512Wavelength conversion materials
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    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30Devices specially adapted for multicolour light emission
    • H10K59/38Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00Point-like light sources
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    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
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    • H01ELECTRIC ELEMENTS
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    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Luminescent Compositions (AREA)
  • Led Device Packages (AREA)
KR1020167012030A 2013-10-08 2014-10-08 발광 재료, 발광 재료의 제조 방법, 및 발광 재료의 용도 Active KR101772352B1 (ko)

Applications Claiming Priority (15)

Application Number Priority Date Filing Date Title
DE102013220315.2 2013-10-08
DE102013220315 2013-10-08
DE102013222144.4 2013-10-30
DE102013222144 2013-10-30
DE102014102853.8 2014-03-04
DE102014102853 2014-03-04
DE102014105589 2014-04-17
DE102014105589.6 2014-04-17
DE102014107984.1 2014-06-05
DE102014107984 2014-06-05
DE102014108759.3 2014-06-23
DE102014108759 2014-06-23
DE102014110058.1 2014-07-17
DE102014110058 2014-07-17
PCT/EP2014/071544 WO2015052238A1 (de) 2013-10-08 2014-10-08 Leuchtstoff, verfahren zum herstellen eines leuchtstoffs und verwendung eines leuchtstoffs

Related Child Applications (2)

Application Number Title Priority Date Filing Date
KR1020177022294A Division KR20170095409A (ko) 2013-10-08 2014-10-08 발광 재료, 발광 재료의 제조 방법, 및 발광 재료의 용도
KR1020167012522A Division KR101772353B1 (ko) 2013-10-08 2014-10-08 발광 재료, 발광 재료의 제조 방법, 및 발광 재료의 용도

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Publication Number Publication Date
KR20160067996A KR20160067996A (ko) 2016-06-14
KR101772352B1 true KR101772352B1 (ko) 2017-08-28

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KR1020167012030A Active KR101772352B1 (ko) 2013-10-08 2014-10-08 발광 재료, 발광 재료의 제조 방법, 및 발광 재료의 용도
KR1020167012522A Active KR101772353B1 (ko) 2013-10-08 2014-10-08 발광 재료, 발광 재료의 제조 방법, 및 발광 재료의 용도
KR1020177022294A Withdrawn KR20170095409A (ko) 2013-10-08 2014-10-08 발광 재료, 발광 재료의 제조 방법, 및 발광 재료의 용도

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KR1020177022294A Withdrawn KR20170095409A (ko) 2013-10-08 2014-10-08 발광 재료, 발광 재료의 제조 방법, 및 발광 재료의 용도

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US (5) US9719013B2 (enExample)
EP (1) EP3055382B1 (enExample)
JP (1) JP2016535800A (enExample)
KR (3) KR101772352B1 (enExample)
CN (3) CN105914287B (enExample)
BR (1) BR112016007234B1 (enExample)
CA (1) CA2925738C (enExample)
DE (2) DE112014005201B4 (enExample)
MY (1) MY176434A (enExample)
RU (1) RU2672747C2 (enExample)
WO (1) WO2015052238A1 (enExample)

Families Citing this family (56)

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DE102013217055B4 (de) 2013-05-17 2022-08-25 Tridonic Gmbh & Co Kg Weisslicht-LED-Modul zur Objektbeleuchtung
DE102013106519A1 (de) 2013-06-21 2014-12-24 Osram Opto Semiconductors Gmbh Anordnung zur Erzeugung von Mischlicht und Verfahren zum Betrieb einer Anordnung von Mischlicht
RU2672747C2 (ru) 2013-10-08 2018-11-19 Осрам Опто Семикондакторз Гмбх Люминофор, способ получения люминофора и применение люминофора
DE102013113382A1 (de) 2013-12-03 2015-06-03 Osram Gmbh Leuchtstoffmischung, Licht emittierendes Halbleiterbauelement mit einer Leuchtstoffmischung und Straßenlaterne mit einer Leuchtstoffmischung
DE102014102256A1 (de) * 2014-02-21 2015-08-27 Osram Oled Gmbh Glasware, Glasware mit Leuchtstoff-Partikeln, Vorrichtung zum Herstellen einer Glasware, Verfahren zum Herstellen einer Glasware und Verfahren zum Herstellen einer Glasware mit Leuchtstoff-Partikeln
JP5878579B2 (ja) * 2014-03-31 2016-03-08 シャープ株式会社 表示装置及びテレビ受信装置
DE102014107972B9 (de) 2014-04-17 2022-07-21 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Leuchtvorrichtung mit einem ersten Leuchtstoff und Filterpartikeln
CZ307024B6 (cs) * 2014-05-05 2017-11-22 Crytur, Spol.S R.O. Světelný zdroj
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