DE112014005201B4 - Leuchtvorrichtung und Leuchtdiode - Google Patents

Leuchtvorrichtung und Leuchtdiode Download PDF

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Publication number
DE112014005201B4
DE112014005201B4 DE112014005201.9T DE112014005201T DE112014005201B4 DE 112014005201 B4 DE112014005201 B4 DE 112014005201B4 DE 112014005201 T DE112014005201 T DE 112014005201T DE 112014005201 B4 DE112014005201 B4 DE 112014005201B4
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Germany
Prior art keywords
phosphor
lighting device
mol
general formula
phosphors
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DE112014005201.9T
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German (de)
English (en)
Inventor
Tim Fiedler
Daniel Bichler
Stefan Lange
Rebecca Römer
Frank Jermann
Frauke Thienel
Barbara Huckenbeck
Alexander Baumgartner
Vera Stöppelkamp
Norbert Bönisch
Hailing Cui
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Osram GmbH
Ams Osram International GmbH
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Osram Opto Semiconductors GmbH
Osram GmbH
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/64—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing aluminium
    • C09K11/646—Silicates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/0883—Arsenides; Nitrides; Phosphides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/59—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing silicon
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/64—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing aluminium
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7715—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing cerium
    • C09K11/7721—Aluminates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/7734—Aluminates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/77348—Silicon Aluminium Nitrides or Silicon Aluminium Oxynitrides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7766—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7766—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
    • C09K11/7774—Aluminates
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0361—Manufacture or treatment of packages of wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H10H20/8513—Wavelength conversion materials having two or more wavelength conversion materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Luminescent Compositions (AREA)
  • Led Device Packages (AREA)
DE112014005201.9T 2013-10-08 2014-10-08 Leuchtvorrichtung und Leuchtdiode Active DE112014005201B4 (de)

Applications Claiming Priority (14)

Application Number Priority Date Filing Date Title
DE102013220315 2013-10-08
DE102013220315.2 2013-10-08
DE102013222144.4 2013-10-30
DE102013222144 2013-10-30
DE102014102853 2014-03-04
DE102014102853.8 2014-03-04
DE102014105589.6 2014-04-17
DE102014105589 2014-04-17
DE102014107984.1 2014-06-05
DE102014107984 2014-06-05
DE102014108759.3 2014-06-23
DE102014108759 2014-06-23
DE102014110058.1 2014-07-17
DE102014110058 2014-07-17

Publications (1)

Publication Number Publication Date
DE112014005201B4 true DE112014005201B4 (de) 2024-01-25

Family

ID=51662138

Family Applications (2)

Application Number Title Priority Date Filing Date
DE112014005201.9T Active DE112014005201B4 (de) 2013-10-08 2014-10-08 Leuchtvorrichtung und Leuchtdiode
DE112014004638.8T Active DE112014004638B4 (de) 2013-10-08 2014-10-08 Leuchtstoff und Verfahren zum Herstellen eines Leuchtstoffs

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE112014004638.8T Active DE112014004638B4 (de) 2013-10-08 2014-10-08 Leuchtstoff und Verfahren zum Herstellen eines Leuchtstoffs

Country Status (11)

Country Link
US (5) US9719013B2 (enExample)
EP (1) EP3055382B1 (enExample)
JP (1) JP2016535800A (enExample)
KR (3) KR101772352B1 (enExample)
CN (3) CN105914287B (enExample)
BR (1) BR112016007234B1 (enExample)
CA (1) CA2925738C (enExample)
DE (2) DE112014005201B4 (enExample)
MY (1) MY176434A (enExample)
RU (1) RU2672747C2 (enExample)
WO (1) WO2015052238A1 (enExample)

Families Citing this family (56)

* Cited by examiner, † Cited by third party
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DE102013217055B4 (de) 2013-05-17 2022-08-25 Tridonic Gmbh & Co Kg Weisslicht-LED-Modul zur Objektbeleuchtung
DE102013106519A1 (de) 2013-06-21 2014-12-24 Osram Opto Semiconductors Gmbh Anordnung zur Erzeugung von Mischlicht und Verfahren zum Betrieb einer Anordnung von Mischlicht
RU2672747C2 (ru) 2013-10-08 2018-11-19 Осрам Опто Семикондакторз Гмбх Люминофор, способ получения люминофора и применение люминофора
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DE102014102256A1 (de) * 2014-02-21 2015-08-27 Osram Oled Gmbh Glasware, Glasware mit Leuchtstoff-Partikeln, Vorrichtung zum Herstellen einer Glasware, Verfahren zum Herstellen einer Glasware und Verfahren zum Herstellen einer Glasware mit Leuchtstoff-Partikeln
JP5878579B2 (ja) * 2014-03-31 2016-03-08 シャープ株式会社 表示装置及びテレビ受信装置
DE102014107972B9 (de) 2014-04-17 2022-07-21 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Leuchtvorrichtung mit einem ersten Leuchtstoff und Filterpartikeln
CZ307024B6 (cs) * 2014-05-05 2017-11-22 Crytur, Spol.S R.O. Světelný zdroj
DE102014117448A1 (de) 2014-11-27 2016-06-02 Osram Gmbh Optoelektronischer Halbleiterchip, Verfahren zur Herstellung eines optoelektronischen Halbleiterchips, Konversionselement und Leuchtstoff für ein Konversionselement
DE102015202159B4 (de) 2015-02-06 2023-06-15 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Halbleiter-Beleuchtungsvorrichtung
DE102015103326A1 (de) 2015-03-06 2016-09-08 Osram Gmbh Leuchtstoffpartikel mit einer Schutzschicht und Verfahren zur Herstellung der Leuchtstoffpartikel mit der Schutzschicht
DE102015113360A1 (de) * 2015-08-13 2017-02-16 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines Konversionselements
JP6696129B2 (ja) * 2015-08-28 2020-05-20 日亜化学工業株式会社 発光装置
DE102015120775B4 (de) * 2015-11-30 2025-04-30 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Bauelement und Hintergrundbeleuchtung für ein Display
DE102016100723B4 (de) 2016-01-18 2022-11-17 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Bauelement
US10217907B2 (en) * 2016-02-29 2019-02-26 Nichia Corporation Method of producing nitride fluorescent material, nitride fluorescent material, and light emitting device using the same
DE102016104194A1 (de) 2016-03-08 2017-09-14 Osram Gmbh Verfahren zur Herstellung von Leuchtstoffpartikeln mit einer Schutzschicht und Leuchtstoffpartikel mit einer Schutzschicht
DE102016206524A1 (de) 2016-04-19 2017-10-19 Osram Gmbh LED zur Emission von Beleuchtungsstrahlung
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EP3893286B1 (en) * 2016-05-26 2023-01-18 Nichia Corporation Light emitting device
US9929321B2 (en) * 2016-08-04 2018-03-27 Kabushiki Kaisha Toshiba Phosphor, producing method thereof and light-emitting device employing the phosphor
KR102531061B1 (ko) 2016-08-12 2023-05-09 에이엠에스-오스람 인터내셔널 게엠베하 조명 장치
US10644206B2 (en) 2016-08-12 2020-05-05 Osram Oled Gmbh Lighting device
DE102016121692A1 (de) 2016-08-12 2018-02-15 Osram Gmbh Leuchtstoff und Verfahren zur Herstellung eines Leuchtstoffs
DE102016121694A1 (de) 2016-08-12 2018-02-15 Osram Gmbh Beleuchtungsvorrichtung
US10711192B2 (en) 2016-08-12 2020-07-14 Osram Oled Gmbh Lighting device
EP3300128B1 (en) * 2016-09-21 2021-03-03 Vestel Elektronik Sanayi ve Ticaret A.S. Phosphor arrangement and method
WO2018073441A1 (en) * 2016-10-21 2018-04-26 Seaborough Ip I. B.V. Converter system
JP6669147B2 (ja) * 2016-10-31 2020-03-18 日亜化学工業株式会社 発光装置
JP2020109850A (ja) * 2016-10-31 2020-07-16 日亜化学工業株式会社 発光装置の製造方法
US10886437B2 (en) 2016-11-03 2021-01-05 Lumileds Llc Devices and structures bonded by inorganic coating
JP7050774B2 (ja) 2016-11-11 2022-04-08 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング 蛍光体、照明装置および照明装置の使用
WO2019029849A1 (de) * 2016-11-11 2019-02-14 Osram Opto Semiconductors Gmbh Dimmbare lichtquelle
CN108690618A (zh) * 2017-04-01 2018-10-23 江苏博睿光电有限公司 一种荧光粉及其制备方法和发光器件
CN107523298B (zh) * 2017-08-07 2021-04-30 温州大学 一种钇铈复合氧化物基上转换发光材料及其制备方法
DE102017120673B4 (de) 2017-09-07 2022-11-24 Ledvance Gmbh Lichtemittierendes Bauelement, Leuchtmittel, Verfahren zum Betrieb eines Leuchtmittels und Konversionselement
DE102017123097B4 (de) * 2017-10-05 2024-03-28 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Konversionsmaterial und Strahlung emittierendes Bauelement
DE102017123269A1 (de) 2017-10-06 2019-04-11 Osram Opto Semiconductors Gmbh Leuchtstoff und Konversions-LED
DE102017123265B4 (de) 2017-10-06 2023-05-11 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Leuchtstoff und Konversions-LED
JP7217709B2 (ja) 2017-10-10 2023-02-03 デンカ株式会社 赤色蛍光体及び発光装置
DE102018205464A1 (de) 2017-11-10 2019-05-16 Osram Opto Semiconductors Gmbh Beleuchtungsvorrichtung und verwendung einer beleuchtungsvorrichtung
KR102444611B1 (ko) * 2017-12-07 2022-09-19 삼성디스플레이 주식회사 표시 장치
JP7185126B2 (ja) 2018-03-14 2022-12-07 日亜化学工業株式会社 照明装置及び植物栽培方法
CN108165266B (zh) * 2018-03-23 2019-01-08 旭宇光电（深圳）股份有限公司 一种氟氮化物荧光粉及包含该荧光粉的发光器件
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