KR101759010B1 - 도전성 재료 전구체 및 도전성 재료의 제조 방법 - Google Patents

도전성 재료 전구체 및 도전성 재료의 제조 방법 Download PDF

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Publication number
KR101759010B1
KR101759010B1 KR1020157024665A KR20157024665A KR101759010B1 KR 101759010 B1 KR101759010 B1 KR 101759010B1 KR 1020157024665 A KR1020157024665 A KR 1020157024665A KR 20157024665 A KR20157024665 A KR 20157024665A KR 101759010 B1 KR101759010 B1 KR 101759010B1
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KR
South Korea
Prior art keywords
conductive material
material precursor
layer
pattern
conductive
Prior art date
Application number
KR1020157024665A
Other languages
English (en)
Korean (ko)
Other versions
KR20150119111A (ko
Inventor
쇼지 아카이와
다케노부 요시키
Original Assignee
미쓰비시 세이시 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 미쓰비시 세이시 가부시키가이샤 filed Critical 미쓰비시 세이시 가부시키가이샤
Publication of KR20150119111A publication Critical patent/KR20150119111A/ko
Application granted granted Critical
Publication of KR101759010B1 publication Critical patent/KR101759010B1/ko

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G03F7/0236—Condensation products of carbonyl compounds and phenolic compounds, e.g. novolak resins
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/125—Inorganic compounds, e.g. silver salt
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1407—Applying catalyst before applying plating resist

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
  • Materials For Photolithography (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Laminated Bodies (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
KR1020157024665A 2013-02-20 2014-02-18 도전성 재료 전구체 및 도전성 재료의 제조 방법 KR101759010B1 (ko)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JPJP-P-2013-031153 2013-02-20
JP2013031153 2013-02-20
JPJP-P-2013-041798 2013-03-04
JP2013041798 2013-03-04
JPJP-P-2014-002153 2014-01-09
JP2014002153A JP6266353B2 (ja) 2013-02-20 2014-01-09 導電性材料前駆体および導電性材料の製造方法
PCT/JP2014/053680 WO2014129429A1 (ja) 2013-02-20 2014-02-18 導電性材料前駆体及び導電性材料の製造方法

Publications (2)

Publication Number Publication Date
KR20150119111A KR20150119111A (ko) 2015-10-23
KR101759010B1 true KR101759010B1 (ko) 2017-07-17

Family

ID=51391221

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157024665A KR101759010B1 (ko) 2013-02-20 2014-02-18 도전성 재료 전구체 및 도전성 재료의 제조 방법

Country Status (5)

Country Link
JP (1) JP6266353B2 (ja)
KR (1) KR101759010B1 (ja)
CN (1) CN104995561B (ja)
TW (1) TWI516365B (ja)
WO (1) WO2014129429A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6266474B2 (ja) * 2014-08-28 2018-01-24 三菱製紙株式会社 導電性パタン前駆体および導電性パタンの製造方法
JP6445330B2 (ja) * 2015-01-08 2018-12-26 三菱製紙株式会社 導電性シート
JP6531165B2 (ja) * 2015-03-30 2019-06-12 富士フイルム株式会社 パターン状被めっき層の製造方法、導電性積層体の製造方法、タッチパネルセンサーの製造方法、タッチパネルの製造方法
JP6421077B2 (ja) * 2015-05-19 2018-11-07 富士フイルム株式会社 アンテナの製造方法およびタッチセンサ
JP6463242B2 (ja) * 2015-09-14 2019-01-30 三菱製紙株式会社 導電性パタン前駆体および導電性パタンの製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010078642A (ja) 2008-09-24 2010-04-08 Konica Minolta Opto Inc 反射防止フィルム、偏光板及び画像表示装置

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JPS6345893A (ja) * 1986-08-13 1988-02-26 日立エーアイシー株式会社 印刷配線板の製造方法
JPH02251801A (ja) * 1989-03-24 1990-10-09 Nippon Paint Co Ltd 基板上の機能性パターンの間隙に金属メッキ層を形成する方法
US5213850A (en) * 1989-03-24 1993-05-25 Nippon Paint Co., Ltd. Process for plating a metallic deposit between functional pattern lines on a substrate
JPH04255776A (ja) * 1991-02-07 1992-09-10 Hitachi Chem Co Ltd 紫外線硬化型接着剤シートその製造法その製造法に用いる装置その接着剤シートを用いて配線板用基板を製造する方法およびその接着剤シートを用いて配線板を製造する方法
US5424009A (en) * 1994-05-24 1995-06-13 Monsanto Company Catalytic, crosslinked polymeric films for electroless deposition of metal
JPH08239773A (ja) * 1995-02-28 1996-09-17 Fuji Photo Film Co Ltd 金属パターンの形成方法、感光性シート、無電解めっき層付きシート、及び無電解めっき層形成用シート
JP2000261186A (ja) * 1999-03-11 2000-09-22 Mikuni Color Ltd 透明電磁波シールド部材の作製方法
US20050241951A1 (en) * 2004-04-30 2005-11-03 Kenneth Crouse Selective catalytic activation of non-conductive substrates
DE112007000695T5 (de) * 2006-03-23 2009-01-29 Kanto Gakuin University Surface Engineering Research Institute, Yokosuka-shi Material für das Bilden einer stromlos gebildeten Schicht und Verfahren zur Bildung einer stromlos gebildeten Schicht unter Verwendung dieses Material
WO2008032839A1 (fr) * 2006-09-15 2008-03-20 Ube Nitto Kasei Co., Ltd. Matériau de base recouvert d'une couche métallique et son procédé de production
JP5570928B2 (ja) * 2010-09-28 2014-08-13 三菱製紙株式会社 導電性材料前駆体および導電性材料

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010078642A (ja) 2008-09-24 2010-04-08 Konica Minolta Opto Inc 反射防止フィルム、偏光板及び画像表示装置

Also Published As

Publication number Publication date
WO2014129429A1 (ja) 2014-08-28
TW201441027A (zh) 2014-11-01
JP2014197531A (ja) 2014-10-16
TWI516365B (zh) 2016-01-11
CN104995561B (zh) 2019-09-27
CN104995561A (zh) 2015-10-21
JP6266353B2 (ja) 2018-01-24
KR20150119111A (ko) 2015-10-23

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