KR101722586B1 - 인쇄 회로 기판 어셈블리들에서 열 차단 - Google Patents

인쇄 회로 기판 어셈블리들에서 열 차단 Download PDF

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Publication number
KR101722586B1
KR101722586B1 KR1020157027982A KR20157027982A KR101722586B1 KR 101722586 B1 KR101722586 B1 KR 101722586B1 KR 1020157027982 A KR1020157027982 A KR 1020157027982A KR 20157027982 A KR20157027982 A KR 20157027982A KR 101722586 B1 KR101722586 B1 KR 101722586B1
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KR
South Korea
Prior art keywords
circuit board
printed circuit
board assembly
conductive layers
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020157027982A
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English (en)
Korean (ko)
Other versions
KR20150127186A (ko
Inventor
양 창
잭 비. 스텐스트라
Original Assignee
퀄컴 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 퀄컴 인코포레이티드 filed Critical 퀄컴 인코포레이티드
Publication of KR20150127186A publication Critical patent/KR20150127186A/ko
Application granted granted Critical
Publication of KR101722586B1 publication Critical patent/KR101722586B1/ko
Expired - Fee Related legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09709—Staggered pads, lands or terminals; Parallel conductors in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing & Machinery (AREA)
KR1020157027982A 2013-03-10 2014-03-06 인쇄 회로 기판 어셈블리들에서 열 차단 Expired - Fee Related KR101722586B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/792,092 US9232640B2 (en) 2013-03-10 2013-03-10 Thermal isolation in printed circuit board assemblies
US13/792,092 2013-03-10
PCT/US2014/021293 WO2014164215A1 (en) 2013-03-10 2014-03-06 Thermal isolation in printed circuit board assemblies

Publications (2)

Publication Number Publication Date
KR20150127186A KR20150127186A (ko) 2015-11-16
KR101722586B1 true KR101722586B1 (ko) 2017-04-03

Family

ID=50440817

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157027982A Expired - Fee Related KR101722586B1 (ko) 2013-03-10 2014-03-06 인쇄 회로 기판 어셈블리들에서 열 차단

Country Status (6)

Country Link
US (1) US9232640B2 (enExample)
EP (1) EP2974562B1 (enExample)
JP (1) JP6049916B2 (enExample)
KR (1) KR101722586B1 (enExample)
CN (1) CN105009694B (enExample)
WO (1) WO2014164215A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9664569B2 (en) * 2015-05-15 2017-05-30 Google Inc. Circuit board configurations facilitating operation of heat sensitive sensor components
US11006513B1 (en) * 2019-10-30 2021-05-11 Deere & Company Electronic assembly having sectional thermal management

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080170378A1 (en) 2007-01-17 2008-07-17 Cheng-Yi Ou-Yang Circuit structure having independent ground plane layouts implemented in circuit board
US20090117861A1 (en) 2007-11-06 2009-05-07 Qualcomm Incorporated Personal health modules supported by portable communication devices
US20100319965A1 (en) 2007-02-22 2010-12-23 Stephane Ortet Electronic card and aircraft including same

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5652042A (en) 1993-10-29 1997-07-29 Matsushita Electric Industrial Co., Ltd. Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste
US8280682B2 (en) * 2000-12-15 2012-10-02 Tvipr, Llc Device for monitoring movement of shipped goods
DE10013936A1 (de) * 2000-03-21 2001-09-27 Bodenseewerk Geraetetech Filteranordnung
US6646886B1 (en) 2002-04-12 2003-11-11 Cisco Technology, Inc. Power connection structure
US7545272B2 (en) 2005-02-08 2009-06-09 Therasense, Inc. RF tag on test strips, test strip vials and boxes
US8411442B2 (en) 2010-09-09 2013-04-02 Texas Instruments Incorporated Vias in substrate between IC seat and peripheral thermal cage

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080170378A1 (en) 2007-01-17 2008-07-17 Cheng-Yi Ou-Yang Circuit structure having independent ground plane layouts implemented in circuit board
US20100319965A1 (en) 2007-02-22 2010-12-23 Stephane Ortet Electronic card and aircraft including same
US20090117861A1 (en) 2007-11-06 2009-05-07 Qualcomm Incorporated Personal health modules supported by portable communication devices

Also Published As

Publication number Publication date
US9232640B2 (en) 2016-01-05
KR20150127186A (ko) 2015-11-16
EP2974562B1 (en) 2016-12-21
EP2974562A1 (en) 2016-01-20
JP6049916B2 (ja) 2016-12-21
CN105009694A (zh) 2015-10-28
CN105009694B (zh) 2018-01-09
JP2016510951A (ja) 2016-04-11
WO2014164215A1 (en) 2014-10-09
US20140254108A1 (en) 2014-09-11

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