JP6049916B2 - プリント回路基板アセンブリにおける熱的分離 - Google Patents

プリント回路基板アセンブリにおける熱的分離 Download PDF

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Publication number
JP6049916B2
JP6049916B2 JP2015561665A JP2015561665A JP6049916B2 JP 6049916 B2 JP6049916 B2 JP 6049916B2 JP 2015561665 A JP2015561665 A JP 2015561665A JP 2015561665 A JP2015561665 A JP 2015561665A JP 6049916 B2 JP6049916 B2 JP 6049916B2
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Japan
Prior art keywords
circuit board
printed circuit
board assembly
conductive
ground plane
Prior art date
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Application number
JP2015561665A
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English (en)
Japanese (ja)
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JP2016510951A (ja
JP2016510951A5 (enExample
Inventor
ジャン、ヤン
スティーンストラ、ジャック・ビー．
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qualcomm Inc
Original Assignee
Qualcomm Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qualcomm Inc filed Critical Qualcomm Inc
Publication of JP2016510951A publication Critical patent/JP2016510951A/ja
Publication of JP2016510951A5 publication Critical patent/JP2016510951A5/ja
Application granted granted Critical
Publication of JP6049916B2 publication Critical patent/JP6049916B2/ja
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Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09709—Staggered pads, lands or terminals; Parallel conductors in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing & Machinery (AREA)
JP2015561665A 2013-03-10 2014-03-06 プリント回路基板アセンブリにおける熱的分離 Active JP6049916B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/792,092 2013-03-10
US13/792,092 US9232640B2 (en) 2013-03-10 2013-03-10 Thermal isolation in printed circuit board assemblies
PCT/US2014/021293 WO2014164215A1 (en) 2013-03-10 2014-03-06 Thermal isolation in printed circuit board assemblies

Publications (3)

Publication Number Publication Date
JP2016510951A JP2016510951A (ja) 2016-04-11
JP2016510951A5 JP2016510951A5 (enExample) 2016-05-26
JP6049916B2 true JP6049916B2 (ja) 2016-12-21

Family

ID=50440817

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015561665A Active JP6049916B2 (ja) 2013-03-10 2014-03-06 プリント回路基板アセンブリにおける熱的分離

Country Status (6)

Country Link
US (1) US9232640B2 (enExample)
EP (1) EP2974562B1 (enExample)
JP (1) JP6049916B2 (enExample)
KR (1) KR101722586B1 (enExample)
CN (1) CN105009694B (enExample)
WO (1) WO2014164215A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9664569B2 (en) * 2015-05-15 2017-05-30 Google Inc. Circuit board configurations facilitating operation of heat sensitive sensor components
US11006513B1 (en) * 2019-10-30 2021-05-11 Deere & Company Electronic assembly having sectional thermal management

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5652042A (en) 1993-10-29 1997-07-29 Matsushita Electric Industrial Co., Ltd. Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste
US8280682B2 (en) * 2000-12-15 2012-10-02 Tvipr, Llc Device for monitoring movement of shipped goods
DE10013936A1 (de) * 2000-03-21 2001-09-27 Bodenseewerk Geraetetech Filteranordnung
US6646886B1 (en) 2002-04-12 2003-11-11 Cisco Technology, Inc. Power connection structure
US7545272B2 (en) 2005-02-08 2009-06-09 Therasense, Inc. RF tag on test strips, test strip vials and boxes
US20080170378A1 (en) * 2007-01-17 2008-07-17 Cheng-Yi Ou-Yang Circuit structure having independent ground plane layouts implemented in circuit board
FR2913173B1 (fr) 2007-02-22 2009-05-15 Airbus France Sa Carte electronique et aeronef la comportant
US8073503B2 (en) 2007-11-06 2011-12-06 Qualcomm Incorporated Personal health modules supported by portable communication devices
US8411442B2 (en) 2010-09-09 2013-04-02 Texas Instruments Incorporated Vias in substrate between IC seat and peripheral thermal cage

Also Published As

Publication number Publication date
WO2014164215A1 (en) 2014-10-09
KR101722586B1 (ko) 2017-04-03
US9232640B2 (en) 2016-01-05
JP2016510951A (ja) 2016-04-11
CN105009694B (zh) 2018-01-09
KR20150127186A (ko) 2015-11-16
CN105009694A (zh) 2015-10-28
US20140254108A1 (en) 2014-09-11
EP2974562B1 (en) 2016-12-21
EP2974562A1 (en) 2016-01-20

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