CN105009694B - 印刷电路板组件中的热隔离 - Google Patents

印刷电路板组件中的热隔离 Download PDF

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Publication number
CN105009694B
CN105009694B CN201480012974.XA CN201480012974A CN105009694B CN 105009694 B CN105009694 B CN 105009694B CN 201480012974 A CN201480012974 A CN 201480012974A CN 105009694 B CN105009694 B CN 105009694B
Authority
CN
China
Prior art keywords
printed circuit
circuit board
conductive layer
board assembly
assembly according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201480012974.XA
Other languages
English (en)
Chinese (zh)
Other versions
CN105009694A (zh
Inventor
Y·张
J·B·斯蒂恩斯特拉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qualcomm Inc
Original Assignee
Qualcomm Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qualcomm Inc filed Critical Qualcomm Inc
Publication of CN105009694A publication Critical patent/CN105009694A/zh
Application granted granted Critical
Publication of CN105009694B publication Critical patent/CN105009694B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09709—Staggered pads, lands or terminals; Parallel conductors in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing & Machinery (AREA)
CN201480012974.XA 2013-03-10 2014-03-06 印刷电路板组件中的热隔离 Expired - Fee Related CN105009694B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/792,092 US9232640B2 (en) 2013-03-10 2013-03-10 Thermal isolation in printed circuit board assemblies
US13/792,092 2013-03-10
PCT/US2014/021293 WO2014164215A1 (en) 2013-03-10 2014-03-06 Thermal isolation in printed circuit board assemblies

Publications (2)

Publication Number Publication Date
CN105009694A CN105009694A (zh) 2015-10-28
CN105009694B true CN105009694B (zh) 2018-01-09

Family

ID=50440817

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480012974.XA Expired - Fee Related CN105009694B (zh) 2013-03-10 2014-03-06 印刷电路板组件中的热隔离

Country Status (6)

Country Link
US (1) US9232640B2 (enExample)
EP (1) EP2974562B1 (enExample)
JP (1) JP6049916B2 (enExample)
KR (1) KR101722586B1 (enExample)
CN (1) CN105009694B (enExample)
WO (1) WO2014164215A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9664569B2 (en) * 2015-05-15 2017-05-30 Google Inc. Circuit board configurations facilitating operation of heat sensitive sensor components
US11006513B1 (en) * 2019-10-30 2021-05-11 Deere & Company Electronic assembly having sectional thermal management

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090117861A1 (en) * 2007-11-06 2009-05-07 Qualcomm Incorporated Personal health modules supported by portable communication devices
CN100563403C (zh) * 2007-01-17 2009-11-25 联发科技股份有限公司 电路结构
CN101617571A (zh) * 2007-02-22 2009-12-30 空中客车法国公司 电子卡和装备该卡的飞行器

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5652042A (en) 1993-10-29 1997-07-29 Matsushita Electric Industrial Co., Ltd. Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste
US8280682B2 (en) * 2000-12-15 2012-10-02 Tvipr, Llc Device for monitoring movement of shipped goods
DE10013936A1 (de) * 2000-03-21 2001-09-27 Bodenseewerk Geraetetech Filteranordnung
US6646886B1 (en) 2002-04-12 2003-11-11 Cisco Technology, Inc. Power connection structure
US7545272B2 (en) 2005-02-08 2009-06-09 Therasense, Inc. RF tag on test strips, test strip vials and boxes
US8411442B2 (en) 2010-09-09 2013-04-02 Texas Instruments Incorporated Vias in substrate between IC seat and peripheral thermal cage

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100563403C (zh) * 2007-01-17 2009-11-25 联发科技股份有限公司 电路结构
CN101617571A (zh) * 2007-02-22 2009-12-30 空中客车法国公司 电子卡和装备该卡的飞行器
US20090117861A1 (en) * 2007-11-06 2009-05-07 Qualcomm Incorporated Personal health modules supported by portable communication devices

Also Published As

Publication number Publication date
EP2974562B1 (en) 2016-12-21
WO2014164215A1 (en) 2014-10-09
KR101722586B1 (ko) 2017-04-03
US9232640B2 (en) 2016-01-05
US20140254108A1 (en) 2014-09-11
EP2974562A1 (en) 2016-01-20
JP6049916B2 (ja) 2016-12-21
KR20150127186A (ko) 2015-11-16
JP2016510951A (ja) 2016-04-11
CN105009694A (zh) 2015-10-28

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20180109