JP2016510951A5 - - Google Patents
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- Publication number
- JP2016510951A5 JP2016510951A5 JP2015561665A JP2015561665A JP2016510951A5 JP 2016510951 A5 JP2016510951 A5 JP 2016510951A5 JP 2015561665 A JP2015561665 A JP 2015561665A JP 2015561665 A JP2015561665 A JP 2015561665A JP 2016510951 A5 JP2016510951 A5 JP 2016510951A5
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- board assembly
- functional area
- ground plane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004891 communication Methods 0.000 claims 12
- 238000000034 method Methods 0.000 claims 10
- 239000003990 capacitor Substances 0.000 claims 9
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 claims 6
- 239000008280 blood Substances 0.000 claims 6
- 210000004369 blood Anatomy 0.000 claims 6
- 238000013480 data collection Methods 0.000 claims 6
- 239000008103 glucose Substances 0.000 claims 6
- 230000008878 coupling Effects 0.000 claims 3
- 238000010168 coupling process Methods 0.000 claims 3
- 238000005859 coupling reaction Methods 0.000 claims 3
- 239000002184 metal Substances 0.000 claims 3
- 238000004519 manufacturing process Methods 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/792,092 | 2013-03-10 | ||
| US13/792,092 US9232640B2 (en) | 2013-03-10 | 2013-03-10 | Thermal isolation in printed circuit board assemblies |
| PCT/US2014/021293 WO2014164215A1 (en) | 2013-03-10 | 2014-03-06 | Thermal isolation in printed circuit board assemblies |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016510951A JP2016510951A (ja) | 2016-04-11 |
| JP2016510951A5 true JP2016510951A5 (enExample) | 2016-05-26 |
| JP6049916B2 JP6049916B2 (ja) | 2016-12-21 |
Family
ID=50440817
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015561665A Active JP6049916B2 (ja) | 2013-03-10 | 2014-03-06 | プリント回路基板アセンブリにおける熱的分離 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9232640B2 (enExample) |
| EP (1) | EP2974562B1 (enExample) |
| JP (1) | JP6049916B2 (enExample) |
| KR (1) | KR101722586B1 (enExample) |
| CN (1) | CN105009694B (enExample) |
| WO (1) | WO2014164215A1 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9664569B2 (en) * | 2015-05-15 | 2017-05-30 | Google Inc. | Circuit board configurations facilitating operation of heat sensitive sensor components |
| US11006513B1 (en) * | 2019-10-30 | 2021-05-11 | Deere & Company | Electronic assembly having sectional thermal management |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5652042A (en) | 1993-10-29 | 1997-07-29 | Matsushita Electric Industrial Co., Ltd. | Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste |
| US8280682B2 (en) * | 2000-12-15 | 2012-10-02 | Tvipr, Llc | Device for monitoring movement of shipped goods |
| DE10013936A1 (de) * | 2000-03-21 | 2001-09-27 | Bodenseewerk Geraetetech | Filteranordnung |
| US6646886B1 (en) | 2002-04-12 | 2003-11-11 | Cisco Technology, Inc. | Power connection structure |
| US7545272B2 (en) | 2005-02-08 | 2009-06-09 | Therasense, Inc. | RF tag on test strips, test strip vials and boxes |
| US20080170378A1 (en) * | 2007-01-17 | 2008-07-17 | Cheng-Yi Ou-Yang | Circuit structure having independent ground plane layouts implemented in circuit board |
| FR2913173B1 (fr) | 2007-02-22 | 2009-05-15 | Airbus France Sa | Carte electronique et aeronef la comportant |
| US8073503B2 (en) | 2007-11-06 | 2011-12-06 | Qualcomm Incorporated | Personal health modules supported by portable communication devices |
| US8411442B2 (en) | 2010-09-09 | 2013-04-02 | Texas Instruments Incorporated | Vias in substrate between IC seat and peripheral thermal cage |
-
2013
- 2013-03-10 US US13/792,092 patent/US9232640B2/en active Active
-
2014
- 2014-03-06 WO PCT/US2014/021293 patent/WO2014164215A1/en not_active Ceased
- 2014-03-06 EP EP14715739.0A patent/EP2974562B1/en not_active Not-in-force
- 2014-03-06 CN CN201480012974.XA patent/CN105009694B/zh not_active Expired - Fee Related
- 2014-03-06 KR KR1020157027982A patent/KR101722586B1/ko not_active Expired - Fee Related
- 2014-03-06 JP JP2015561665A patent/JP6049916B2/ja active Active
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