KR101703718B1 - 감광성 수지 조성물, 경화막의 형성 방법, 경화막, 유기 ｅｌ 표시 장치, 및, 액정 표시 장치 - Google Patents

감광성 수지 조성물, 경화막의 형성 방법, 경화막, 유기 ｅｌ 표시 장치, 및, 액정 표시 장치 Download PDF

Info

Publication number
KR101703718B1
KR101703718B1 KR1020100099796A KR20100099796A KR101703718B1 KR 101703718 B1 KR101703718 B1 KR 101703718B1 KR 1020100099796 A KR1020100099796 A KR 1020100099796A KR 20100099796 A KR20100099796 A KR 20100099796A KR 101703718 B1 KR101703718 B1 KR 101703718B1
Authority
KR
South Korea
Prior art keywords
group
monomer unit
formula
acid
resin composition
Prior art date
Application number
KR1020100099796A
Other languages
English (en)
Korean (ko)
Other versions
KR20110042006A (ko
Inventor
고이치 스기하라
야스마사 가와베
사토루 야마다
Original Assignee
후지필름 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 후지필름 가부시키가이샤 filed Critical 후지필름 가부시키가이샤
Publication of KR20110042006A publication Critical patent/KR20110042006A/ko
Application granted granted Critical
Publication of KR101703718B1 publication Critical patent/KR101703718B1/ko

Links

Images

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials For Photolithography (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Electroluminescent Light Sources (AREA)
  • Liquid Crystal (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Epoxy Resins (AREA)
KR1020100099796A 2009-10-16 2010-10-13 감광성 수지 조성물, 경화막의 형성 방법, 경화막, 유기 ｅｌ 표시 장치, 및, 액정 표시 장치 KR101703718B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2009239871 2009-10-16
JPJP-P-2009-239871 2009-10-16
JP2010050561 2010-03-08
JPJP-P-2010-050561 2010-03-08

Publications (2)

Publication Number Publication Date
KR20110042006A KR20110042006A (ko) 2011-04-22
KR101703718B1 true KR101703718B1 (ko) 2017-02-07

Family

ID=43980752

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100099796A KR101703718B1 (ko) 2009-10-16 2010-10-13 감광성 수지 조성물, 경화막의 형성 방법, 경화막, 유기 ｅｌ 표시 장치, 및, 액정 표시 장치

Country Status (3)

Country Link
JP (1) JP5451570B2 (zh)
KR (1) KR101703718B1 (zh)
CN (1) CN102043333B (zh)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5505066B2 (ja) * 2010-04-28 2014-05-28 Ｊｓｒ株式会社 感放射線性樹脂組成物、表示素子の層間絶縁膜、保護膜及びスペーサーならびにそれらの形成方法
CN102955361B (zh) * 2011-08-19 2018-04-06 富士胶片株式会社 正型感光性树脂组成物、硬化膜的形成方法、硬化膜、液晶显示装置及有机el显示装置
JP5741331B2 (ja) * 2011-09-01 2015-07-01 Jsr株式会社 アレイ基板、液晶表示素子およびアレイ基板の製造方法
KR102000492B1 (ko) * 2012-03-30 2019-07-16 후지필름 가부시키가이샤 감광성 수지 조성물, 이것을 사용한 패턴의 제조 방법
JP6136491B2 (ja) * 2012-04-24 2017-05-31 Jsr株式会社 感放射線性樹脂組成物、表示素子用層間絶縁膜及びその形成方法
CN103454857B (zh) * 2012-05-31 2020-01-03 住友化学株式会社 光致抗蚀剂组合物
WO2013191155A1 (ja) * 2012-06-20 2013-12-27 富士フイルム株式会社 感光性樹脂組成物、硬化膜の製造方法、硬化膜、有機ｅｌ表示装置および液晶表示装置
TW201415161A (zh) 2012-09-28 2014-04-16 Fujifilm Corp 感光性樹脂組成物、使用其的硬化膜的製造方法、硬化膜、液晶顯示裝置及有機ｅｌ顯示裝置
KR20150080557A (ko) * 2012-12-07 2015-07-09 후지필름 가부시키가이샤 경화막의 제조 방법, 경화막, 액정 표시 장치 및 유기 el 표시 장치
CN105324718B (zh) 2013-06-27 2019-11-05 富士胶片株式会社 感光性树脂组合物、硬化膜的制造方法、硬化膜、液晶显示装置及有机el显示装置
JP6492444B2 (ja) * 2013-09-04 2019-04-03 Jsr株式会社 感放射線性樹脂組成物、硬化膜、その形成方法、及び電子デバイス
TWI649615B (zh) 2013-09-25 2019-02-01 富士軟片股份有限公司 感光性樹脂組成物、硬化膜的製造方法、硬化膜、液晶顯示裝置及有機ｅｌ顯示裝置
CN103811665A (zh) * 2013-11-06 2014-05-21 溧阳市江大技术转移中心有限公司 一种高效率有机发光二极管
KR101807630B1 (ko) 2013-12-11 2017-12-11 후지필름 가부시키가이샤 감광성 수지 조성물, 경화막의 제조 방법, 경화막, 액정 표시 장치 및 유기 el 표시 장치
JPWO2015087830A1 (ja) 2013-12-11 2017-03-16 富士フイルム株式会社 感光性樹脂組成物、硬化膜の製造方法、硬化膜、液晶表示装置および有機ｅｌ表示装置
KR102539889B1 (ko) * 2016-08-11 2023-06-05 동우 화인켐 주식회사 화학증폭형 감광성 수지 조성물 및 이로부터 제조된 절연막
KR20190087173A (ko) * 2018-01-16 2019-07-24 동우 화인켐 주식회사 네가티브형 감광성 수지 조성물
KR102674721B1 (ko) * 2018-11-29 2024-06-14 듀폰스페셜티머터리얼스코리아 유한회사 포지티브형 감광성 수지 조성물 및 이로부터 제조된 경화막

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009098616A (ja) 2007-06-05 2009-05-07 Fujifilm Corp ポジ型感光性樹脂組成物及びそれを用いた硬化膜形成方法
JP2009098673A (ja) 2007-09-28 2009-05-07 Fujifilm Corp ポジ型感光性樹脂組成物及びそれを用いた硬化膜形成方法
JP2009168992A (ja) 2008-01-15 2009-07-30 Chisso Corp ポジ型感光性重合体組成物

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2961722B2 (ja) 1991-12-11 1999-10-12 ジェイエスアール株式会社 感放射線性樹脂組成物
JP2715881B2 (ja) * 1993-12-28 1998-02-18 日本電気株式会社 感光性樹脂組成物およびパターン形成方法
JP4544550B2 (ja) * 1999-07-12 2010-09-15 三菱レイヨン株式会社 レジスト用樹脂、化学増幅型レジスト組成物およびレジストパターン形成方法
JP4028272B2 (ja) * 2002-03-20 2007-12-26 富士フイルム株式会社 感赤外線感光性組成物
JP4207604B2 (ja) 2003-03-03 2009-01-14 Ｊｓｒ株式会社 感放射線性樹脂組成物、層間絶縁膜およびマイクロレンズ、ならびにそれらの形成方法
WO2004109403A1 (ja) * 2003-06-02 2004-12-16 Toray Industries, Inc. 感光性樹脂組成物およびそれを用いた電子部品ならびに表示装置
TWI390350B (zh) * 2004-10-29 2013-03-21 Jsr Corp Positive photosensitive insulating resin composition and hardened product thereof
JP5256647B2 (ja) * 2006-05-31 2013-08-07 三菱化学株式会社 保護膜用熱硬化性組成物、硬化物、及び液晶表示装置
CN102445853B (zh) * 2010-10-12 2013-10-16 京东方科技集团股份有限公司 感光树脂组合物、彩色滤光片及其制备方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009098616A (ja) 2007-06-05 2009-05-07 Fujifilm Corp ポジ型感光性樹脂組成物及びそれを用いた硬化膜形成方法
JP2009098673A (ja) 2007-09-28 2009-05-07 Fujifilm Corp ポジ型感光性樹脂組成物及びそれを用いた硬化膜形成方法
JP2009168992A (ja) 2008-01-15 2009-07-30 Chisso Corp ポジ型感光性重合体組成物

Also Published As

Publication number Publication date
CN102043333A (zh) 2011-05-04
JP5451570B2 (ja) 2014-03-26
CN102043333B (zh) 2014-02-26
JP2011209681A (ja) 2011-10-20
KR20110042006A (ko) 2011-04-22

Similar Documents

Publication Publication Date Title
KR101703718B1 (ko) 감광성 수지 조성물, 경화막의 형성 방법, 경화막, 유기 ｅｌ 표시 장치, 및, 액정 표시 장치
KR101650903B1 (ko) 감광성 수지 조성물, 경화막의 형성 방법, 경화막, 유기 ｅｌ 표시 장치, 및 액정 표시 장치
JP5524037B2 (ja) 感光性樹脂組成物、硬化膜、硬化膜の形成方法、有機ｅｌ表示装置、及び、液晶表示装置
KR101772945B1 (ko) 감광성 수지 조성물, 경화막, 경화막의 형성 방법, 유기 ｅｌ 표시 장치, 및, 액정 표시 장치
KR101789813B1 (ko) 감광성 수지 조성물, 경화막의 형성 방법, 경화막, 유기 ｅｌ 표시 장치 및 액정 표시 장치
KR101570447B1 (ko) 포지티브형 감광성 수지 조성물, 경화막의 형성 방법, 경화막, 액정 표시 장치, 및 유기 ｅｌ 표시 장치
US8728708B2 (en) Photosensitive resin composition, oxime sulfonate compound, method for forming cured film, cured film, organic EL display device, and liquid crystal display device
JP5846622B2 (ja) 感光性樹脂組成物、硬化膜、硬化膜の形成方法、有機ｅｌ表示装置、及び、液晶表示装置
KR101806822B1 (ko) 포지티브형 감광성 수지 조성물, 경화막 형성방법, 경화막, 유기 ｅｌ 표시 장치, 및 액정 표시 장치
KR101882722B1 (ko) 포지티브형 감광성 수지 조성물
JP5623897B2 (ja) ポジ型感光性樹脂組成物、硬化膜の形成方法、硬化膜、有機ｅｌ表示装置、及び、液晶表示装置
KR20110042011A (ko) 감광성 수지 조성물, 경화막, 경화막의 형성 방법, 유기 ｅｌ 표시 장치, 및, 액정 표시 장치
KR102099092B1 (ko) 감광성 수지 조성물, 이것을 사용한 경화막의 제조 방법, 경화막, 액정 표시 장치 및 유기 ｅｌ 표시 장치
KR101732392B1 (ko) 포지티브형 감광성 수지 조성물, 경화막의 형성 방법, 경화막, 액정 표시 장치, 및, 유기 ｅｌ 표시 장치
JP5517860B2 (ja) 感光性樹脂組成物、硬化膜の形成方法、硬化膜、有機ｅｌ表示装置、及び、液晶表示装置
JP5885802B2 (ja) 感光性樹脂組成物、オキシムスルホネート化合物、硬化膜の形成方法、硬化膜、有機ｅｌ表示装置、及び、液晶表示装置
KR101865632B1 (ko) 감광성 수지 조성물, 옥심설포네이트 화합물, 경화막의 형성 방법, 경화막, 유기 ｅｌ 표시 장치, 및, 액정 표시 장치
KR101964685B1 (ko) 포지티브형 감광성 수지 조성물, 경화막의 형성 방법, 경화막, 유기 ｅｌ 표시 장치, 및, 액정 표시 장치
KR102098125B1 (ko) 감광성 수지 조성물, 경화막의 제조 방법, 경화막, 유기 ｅｌ 표시 장치 및 액정 표시 장치
JP5734152B2 (ja) 感光性樹脂組成物、硬化膜並びにその製造方法
KR20110087208A (ko) 포지티브형 감광성 수지 조성물, 경화막의 형성 방법, 경화막, 액정 표시 장치, 및, 유기 ｅｌ 표시 장치

Legal Events

Date Code Title Description
E701 Decision to grant or registration of patent right
GRNT Written decision to grant