KR101699773B1 - 경화성 수지 조성물 및 그 경화물 - Google Patents

경화성 수지 조성물 및 그 경화물 Download PDF

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Publication number
KR101699773B1
KR101699773B1 KR1020127031434A KR20127031434A KR101699773B1 KR 101699773 B1 KR101699773 B1 KR 101699773B1 KR 1020127031434 A KR1020127031434 A KR 1020127031434A KR 20127031434 A KR20127031434 A KR 20127031434A KR 101699773 B1 KR101699773 B1 KR 101699773B1
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KR
South Korea
Prior art keywords
group
resin composition
curable resin
acid
organopolysiloxane
Prior art date
Application number
KR1020127031434A
Other languages
English (en)
Korean (ko)
Other versions
KR20130112694A (ko
Inventor
시즈카 아오키
요시히로 카와다
치에 사사키
Original Assignee
닛뽄 가야쿠 가부시키가이샤
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Publication of KR20130112694A publication Critical patent/KR20130112694A/ko
Application granted granted Critical
Publication of KR101699773B1 publication Critical patent/KR101699773B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
    • C08G59/3263—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C09J183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0091—Complexes with metal-heteroatom-bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C08K5/092—Polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C08K5/098—Metal salts of carboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3432—Six-membered rings
    • C08K5/3435—Piperidines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Epoxy Resins (AREA)
  • Silicon Polymers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
KR1020127031434A 2010-06-11 2011-06-10 경화성 수지 조성물 및 그 경화물 KR101699773B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2010-133745 2010-06-11
JP2010133745A JP5626856B2 (ja) 2010-06-11 2010-06-11 硬化性樹脂組成物およびその硬化物
PCT/JP2011/063312 WO2011155583A1 (ja) 2010-06-11 2011-06-10 硬化性樹脂組成物およびその硬化物

Publications (2)

Publication Number Publication Date
KR20130112694A KR20130112694A (ko) 2013-10-14
KR101699773B1 true KR101699773B1 (ko) 2017-01-25

Family

ID=45098186

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127031434A KR101699773B1 (ko) 2010-06-11 2011-06-10 경화성 수지 조성물 및 그 경화물

Country Status (6)

Country Link
JP (1) JP5626856B2 (ja)
KR (1) KR101699773B1 (ja)
CN (1) CN102939313B (ja)
SG (1) SG186252A1 (ja)
TW (1) TWI494376B (ja)
WO (1) WO2011155583A1 (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5472924B2 (ja) * 2010-10-21 2014-04-16 日本化薬株式会社 硬化性樹脂組成物およびその硬化物
CN103781815A (zh) * 2011-09-09 2014-05-07 日本化药株式会社 光半导体元件密封用固化性树脂组合物及其固化物
JP6064606B2 (ja) 2012-01-31 2017-01-25 日亜化学工業株式会社 発光装置
DE102013201363A1 (de) 2012-01-31 2013-08-01 Nichia Corp. Lichtemittierendes Bauelement
AU2013233958A1 (en) * 2012-03-16 2014-10-02 Basf Se NOR-HALS compounds as flame retardants
JP6143359B2 (ja) * 2013-11-19 2017-06-07 日本化薬株式会社 シリコーン変性エポキシ樹脂およびその組成物
JP6778679B2 (ja) * 2015-06-17 2020-11-04 株式会社ダイセル 硬化性組成物、接着シート、硬化物、積層物、接着シートの製造方法、及び装置
JP2018188626A (ja) * 2017-05-11 2018-11-29 信越化学工業株式会社 シリコーン変性ポリイミド樹脂組成物
CN116162325A (zh) 2017-12-27 2023-05-26 3M创新有限公司 适用于电子器件外罩的固化环氧树脂组合物、制品和方法

Citations (1)

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JP2007169427A (ja) * 2005-12-21 2007-07-05 Jsr Corp 光半導体封止用組成物、その製造法および光半導体封止材

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JPH09213997A (ja) 1996-01-30 1997-08-15 Matsushita Electron Corp 発光ダイオード
JP3618238B2 (ja) 1998-12-25 2005-02-09 日亜化学工業株式会社 発光ダイオード
KR101135833B1 (ko) * 2004-03-02 2012-04-16 가부시키가이샤 아데카 카보네이트 골격을 가진 저염기성 힌더드 아민 화합물,합성수지 조성물 및 도료 조성물
EP1736500A4 (en) * 2004-04-16 2010-03-24 Jsr Corp COMPOSITION FOR SEALING AN OPTICAL SEMICONDUCTOR, OPTICAL SEMICONDUCTOR SEALING MATERIAL, AND PROCESS FOR PRODUCING A COMPOSITION FOR SEALING AN OPTICAL SEMICONDUCTOR
TW200711060A (en) * 2005-02-04 2007-03-16 Jsr Corp Optical semiconductor, sealer for the same and sealing composition
US20080154735A1 (en) * 2006-12-26 2008-06-26 Mark Carlson Mobile vending purchasing
CN101538367B (zh) 2008-01-28 2013-09-04 信越化学工业株式会社 二缩水甘油基异氰尿酸基改性有机聚硅氧烷以及含有该有机聚硅氧烷的组成物
KR101602750B1 (ko) * 2008-03-10 2016-03-11 가부시키가이샤 아데카 합성 수지 조성물 및 그것을 사용한 자동차 내외장재
EP2467424A1 (en) * 2009-08-18 2012-06-27 Basf Se Photovoltaic module with stabilized polymeric encapsulant
CN102648244B (zh) * 2009-10-06 2014-05-07 日本化药株式会社 多元羧酸组合物及其制造方法以及含有该多元羧酸组合物的可固化树脂组合物
TWI485202B (zh) * 2009-11-30 2015-05-21 Nippon Kayaku Kk Hardened resin composition and hardened product thereof
TWI538959B (zh) * 2010-03-02 2016-06-21 Nippon Kayaku Kk Hardened resin composition and hardened product thereof

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007169427A (ja) * 2005-12-21 2007-07-05 Jsr Corp 光半導体封止用組成物、その製造法および光半導体封止材

Also Published As

Publication number Publication date
JP5626856B2 (ja) 2014-11-19
CN102939313A (zh) 2013-02-20
TWI494376B (zh) 2015-08-01
TW201207043A (en) 2012-02-16
SG186252A1 (en) 2013-01-30
KR20130112694A (ko) 2013-10-14
CN102939313B (zh) 2016-03-16
WO2011155583A1 (ja) 2011-12-15
JP2011256326A (ja) 2011-12-22

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