KR101687462B1 - 금속 재료, 표면 처리 방법 및 장치 - Google Patents

금속 재료, 표면 처리 방법 및 장치 Download PDF

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Publication number
KR101687462B1
KR101687462B1 KR1020147022776A KR20147022776A KR101687462B1 KR 101687462 B1 KR101687462 B1 KR 101687462B1 KR 1020147022776 A KR1020147022776 A KR 1020147022776A KR 20147022776 A KR20147022776 A KR 20147022776A KR 101687462 B1 KR101687462 B1 KR 101687462B1
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KR
South Korea
Prior art keywords
metal material
treated
cathode electrode
base
voltage
Prior art date
Application number
KR1020147022776A
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English (en)
Korean (ko)
Other versions
KR20140112559A (ko
Inventor
마사야스 나고시
가오루 사토
히사토 노로
가즈히코 바바
세이이치 와타나베
소우키 요시다
Original Assignee
제이에프이 스틸 가부시키가이샤
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Publication of KR20140112559A publication Critical patent/KR20140112559A/ko
Application granted granted Critical
Publication of KR101687462B1 publication Critical patent/KR101687462B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • C25F3/06—Etching of iron or steel

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Engineering & Computer Science (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • ing And Chemical Polishing (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Electroluminescent Light Sources (AREA)
KR1020147022776A 2012-02-24 2013-02-21 금속 재료, 표면 처리 방법 및 장치 KR101687462B1 (ko)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2012038557 2012-02-24
JP2012038553 2012-02-24
JP2012038555 2012-02-24
JPJP-P-2012-038555 2012-02-24
JPJP-P-2012-038557 2012-02-24
JPJP-P-2012-038553 2012-02-24
PCT/JP2013/054413 WO2013125658A1 (ja) 2012-02-24 2013-02-21 金属材料、表面処理方法及び装置

Publications (2)

Publication Number Publication Date
KR20140112559A KR20140112559A (ko) 2014-09-23
KR101687462B1 true KR101687462B1 (ko) 2016-12-16

Family

ID=49005835

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020147022776A KR101687462B1 (ko) 2012-02-24 2013-02-21 금속 재료, 표면 처리 방법 및 장치

Country Status (7)

Country Link
EP (1) EP2818579A4 (ja)
JP (1) JP5817907B2 (ja)
KR (1) KR101687462B1 (ja)
CN (1) CN104114747A (ja)
IN (1) IN2014KN01697A (ja)
TW (1) TWI472424B (ja)
WO (1) WO2013125658A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6498091B2 (ja) * 2015-09-25 2019-04-10 Ｊｘ金属株式会社 表面処理金属箔、積層体、プリント配線板、半導体パッケージ、電子機器
US11541516B2 (en) * 2019-09-25 2023-01-03 Snap-On Incorporated Fastener retention and anti-camout tool bit
CN111805022A (zh) * 2020-06-04 2020-10-23 南方科技大学 等离子体辅助电解加工方法及实施装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004521186A (ja) * 2000-08-10 2004-07-15 ナトゥール・インコーポレイテッド 外的影響を用いて加工物の頂部表面とキャビティ表面上に付着する添加物の間に差を作り出すめっき方法および装置
EP2133448A1 (en) 2007-03-02 2009-12-16 The Furukawa Electric Co., Ltd. Production method and device of surface roughened copper plate, and surface roughened copper plate

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59227241A (ja) * 1983-06-09 1984-12-20 Taishi Shokuhin Kogyo Kk 乳酸発酵豆乳の製造法
JPH04136198A (ja) * 1990-09-26 1992-05-11 Nau Chem:Yugen 電気めっき方法
JPH06297252A (ja) * 1993-04-09 1994-10-25 Sony Corp 微細加工方法及びその装置
JPH09241865A (ja) * 1996-03-01 1997-09-16 Kawasaki Steel Corp フィルム密着性、耐食性に優れたラミネート鋼板
AUPR129900A0 (en) * 2000-11-08 2000-11-30 Chang, Chak Man Thomas Plasma electroplating
KR100581139B1 (ko) * 2001-03-14 2006-05-16 가부시키 가이샤 닛코 마테리알즈 파티클 발생이 적은 스퍼터링 타겟트, 배킹 플레이트 또는스퍼터링 장치 내의 기기 및 방전 가공에 의한 조화방법
JP2005329451A (ja) * 2004-05-21 2005-12-02 Fuji Photo Film Co Ltd アルミニウム板の表面加工方法及び平版印刷版用支持体並びに平版印刷版
JP5010966B2 (ja) * 2006-08-21 2012-08-29 株式会社神戸製鋼所 撥水性塗料および撥水金属板
JP5254811B2 (ja) * 2007-02-15 2013-08-07 環境エンジニアリング株式会社 導体微粒子を製造する方法
JP2010287648A (ja) * 2009-06-10 2010-12-24 Seiko Epson Corp 半導体装置の製造方法
JP5569259B2 (ja) * 2010-08-26 2014-08-13 Ｊｆｅスチール株式会社 表面改質された導電性材料の製造方法
CN102041540A (zh) * 2011-01-13 2011-05-04 中国科学院苏州纳米技术与纳米仿生研究所 三维渐变孔阵列纳米结构阳极氧化铝模板及其制备方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004521186A (ja) * 2000-08-10 2004-07-15 ナトゥール・インコーポレイテッド 外的影響を用いて加工物の頂部表面とキャビティ表面上に付着する添加物の間に差を作り出すめっき方法および装置
EP2133448A1 (en) 2007-03-02 2009-12-16 The Furukawa Electric Co., Ltd. Production method and device of surface roughened copper plate, and surface roughened copper plate

Also Published As

Publication number Publication date
CN104114747A (zh) 2014-10-22
EP2818579A4 (en) 2015-11-11
TW201341176A (zh) 2013-10-16
TWI472424B (zh) 2015-02-11
JP5817907B2 (ja) 2015-11-18
EP2818579A1 (en) 2014-12-31
JPWO2013125658A1 (ja) 2015-07-30
WO2013125658A1 (ja) 2013-08-29
IN2014KN01697A (ja) 2015-10-23
KR20140112559A (ko) 2014-09-23

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