TWI472424B - A metal material, a surface treatment method of a metal material, a method of manufacturing a water repellent material using a metal material as a substrate, and a manufacturing apparatus for a metal material - Google Patents
A metal material, a surface treatment method of a metal material, a method of manufacturing a water repellent material using a metal material as a substrate, and a manufacturing apparatus for a metal material Download PDFInfo
- Publication number
- TWI472424B TWI472424B TW102106374A TW102106374A TWI472424B TW I472424 B TWI472424 B TW I472424B TW 102106374 A TW102106374 A TW 102106374A TW 102106374 A TW102106374 A TW 102106374A TW I472424 B TWI472424 B TW I472424B
- Authority
- TW
- Taiwan
- Prior art keywords
- metal material
- substrate
- cathode electrode
- treated
- anode electrode
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/02—Etching
- C25F3/06—Etching of iron or steel
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Engineering & Computer Science (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- ing And Chemical Polishing (AREA)
- Electrolytic Production Of Metals (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012038557 | 2012-02-24 | ||
JP2012038553 | 2012-02-24 | ||
JP2012038555 | 2012-02-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201341176A TW201341176A (zh) | 2013-10-16 |
TWI472424B true TWI472424B (zh) | 2015-02-11 |
Family
ID=49005835
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW102106374A TWI472424B (zh) | 2012-02-24 | 2013-02-23 | A metal material, a surface treatment method of a metal material, a method of manufacturing a water repellent material using a metal material as a substrate, and a manufacturing apparatus for a metal material |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP2818579A4 (ja) |
JP (1) | JP5817907B2 (ja) |
KR (1) | KR101687462B1 (ja) |
CN (1) | CN104114747A (ja) |
IN (1) | IN2014KN01697A (ja) |
TW (1) | TWI472424B (ja) |
WO (1) | WO2013125658A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6498091B2 (ja) * | 2015-09-25 | 2019-04-10 | Jx金属株式会社 | 表面処理金属箔、積層体、プリント配線板、半導体パッケージ、電子機器 |
US11541516B2 (en) * | 2019-09-25 | 2023-01-03 | Snap-On Incorporated | Fastener retention and anti-camout tool bit |
CN111805022A (zh) * | 2020-06-04 | 2020-10-23 | 南方科技大学 | 等离子体辅助电解加工方法及实施装置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09241865A (ja) * | 1996-03-01 | 1997-09-16 | Kawasaki Steel Corp | フィルム密着性、耐食性に優れたラミネート鋼板 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59227241A (ja) * | 1983-06-09 | 1984-12-20 | Taishi Shokuhin Kogyo Kk | 乳酸発酵豆乳の製造法 |
JPH04136198A (ja) * | 1990-09-26 | 1992-05-11 | Nau Chem:Yugen | 電気めっき方法 |
JPH06297252A (ja) * | 1993-04-09 | 1994-10-25 | Sony Corp | 微細加工方法及びその装置 |
WO2002015245A2 (en) * | 2000-08-10 | 2002-02-21 | Nutool, Inc. | Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence |
AUPR129900A0 (en) * | 2000-11-08 | 2000-11-30 | Chang, Chak Man Thomas | Plasma electroplating |
KR100581139B1 (ko) * | 2001-03-14 | 2006-05-16 | 가부시키 가이샤 닛코 마테리알즈 | 파티클 발생이 적은 스퍼터링 타겟트, 배킹 플레이트 또는스퍼터링 장치 내의 기기 및 방전 가공에 의한 조화방법 |
JP2005329451A (ja) * | 2004-05-21 | 2005-12-02 | Fuji Photo Film Co Ltd | アルミニウム板の表面加工方法及び平版印刷版用支持体並びに平版印刷版 |
JP5010966B2 (ja) * | 2006-08-21 | 2012-08-29 | 株式会社神戸製鋼所 | 撥水性塗料および撥水金属板 |
JP5254811B2 (ja) * | 2007-02-15 | 2013-08-07 | 環境エンジニアリング株式会社 | 導体微粒子を製造する方法 |
JP5323677B2 (ja) | 2007-03-02 | 2013-10-23 | 古河電気工業株式会社 | 表面粗化銅板の製造方法及び装置、並びに表面粗化銅板 |
JP2010287648A (ja) * | 2009-06-10 | 2010-12-24 | Seiko Epson Corp | 半導体装置の製造方法 |
JP5569259B2 (ja) * | 2010-08-26 | 2014-08-13 | Jfeスチール株式会社 | 表面改質された導電性材料の製造方法 |
CN102041540A (zh) * | 2011-01-13 | 2011-05-04 | 中国科学院苏州纳米技术与纳米仿生研究所 | 三维渐变孔阵列纳米结构阳极氧化铝模板及其制备方法 |
-
2013
- 2013-02-21 EP EP13752521.8A patent/EP2818579A4/en not_active Withdrawn
- 2013-02-21 KR KR1020147022776A patent/KR101687462B1/ko active IP Right Grant
- 2013-02-21 CN CN201380009686.4A patent/CN104114747A/zh active Pending
- 2013-02-21 IN IN1697KON2014 patent/IN2014KN01697A/en unknown
- 2013-02-21 WO PCT/JP2013/054413 patent/WO2013125658A1/ja active Application Filing
- 2013-02-21 JP JP2014500933A patent/JP5817907B2/ja active Active
- 2013-02-23 TW TW102106374A patent/TWI472424B/zh not_active IP Right Cessation
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09241865A (ja) * | 1996-03-01 | 1997-09-16 | Kawasaki Steel Corp | フィルム密着性、耐食性に優れたラミネート鋼板 |
Also Published As
Publication number | Publication date |
---|---|
KR101687462B1 (ko) | 2016-12-16 |
CN104114747A (zh) | 2014-10-22 |
EP2818579A4 (en) | 2015-11-11 |
TW201341176A (zh) | 2013-10-16 |
JP5817907B2 (ja) | 2015-11-18 |
EP2818579A1 (en) | 2014-12-31 |
JPWO2013125658A1 (ja) | 2015-07-30 |
WO2013125658A1 (ja) | 2013-08-29 |
IN2014KN01697A (ja) | 2015-10-23 |
KR20140112559A (ko) | 2014-09-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |