KR101677864B1 - 중첩 장치 및 중첩 방법 - Google Patents

중첩 장치 및 중첩 방법 Download PDF

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Publication number
KR101677864B1
KR101677864B1 KR1020157001241A KR20157001241A KR101677864B1 KR 101677864 B1 KR101677864 B1 KR 101677864B1 KR 1020157001241 A KR1020157001241 A KR 1020157001241A KR 20157001241 A KR20157001241 A KR 20157001241A KR 101677864 B1 KR101677864 B1 KR 101677864B1
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South Korea
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substrate
support
center position
support plate
overlapping
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Korean (ko)
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KR20150034179A (ko
Inventor
준이치 가츠라가와
사토시 고바리
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도오꾜오까고오교 가부시끼가이샤
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Assigned to 아이메카테크 가부시키가이샤 reassignment 아이메카테크 가부시키가이샤 권리의 전부이전등록 Assignors: 도오꾜오까고오교 가부시끼가이샤
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    • H01L21/681—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T11/00—Two-dimensional [2D] image generation
    • G06T11/60—Creating or editing images; Combining images with text
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • H01L22/34—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7448—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the bond interface between the auxiliary support and the wafer comprising two or more, e.g. multilayer adhesive or adhesive and release layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7412—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H10P72/7418—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding of passive members, e.g. a chip mounting substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7422—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/744—Details of chemical or physical process used for separating the auxiliary support from a device or a wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Automation & Control Theory (AREA)
  • Manufacturing & Machinery (AREA)
KR1020157001241A 2012-06-25 2013-04-30 중첩 장치 및 중첩 방법 Active KR101677864B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2012-142389 2012-06-25
JP2012142389A JP6001934B2 (ja) 2012-06-25 2012-06-25 重ね合わせ装置および重ね合わせ方法
PCT/JP2013/062572 WO2014002609A1 (ja) 2012-06-25 2013-04-30 重ね合わせ装置および重ね合わせ方法

Publications (2)

Publication Number Publication Date
KR20150034179A KR20150034179A (ko) 2015-04-02
KR101677864B1 true KR101677864B1 (ko) 2016-11-18

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157001241A Active KR101677864B1 (ko) 2012-06-25 2013-04-30 중첩 장치 및 중첩 방법

Country Status (5)

Country Link
US (1) US9911637B2 (https=)
JP (1) JP6001934B2 (https=)
KR (1) KR101677864B1 (https=)
TW (1) TWI524463B (https=)
WO (1) WO2014002609A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG11201504793TA (en) * 2012-12-21 2015-07-30 Shinkawa Kk Flip chip bonder and method for correcting flatness and deformation amount of bonding stage
JP6412786B2 (ja) * 2014-12-03 2018-10-24 東京応化工業株式会社 搬送方法
US10825705B2 (en) * 2015-05-15 2020-11-03 Suss Microtec Lithography Gmbh Apparatus, system, and method for handling aligned wafer pairs
JP6756600B2 (ja) * 2016-12-14 2020-09-16 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP7291577B2 (ja) * 2019-08-28 2023-06-15 芝浦メカトロニクス株式会社 移送装置および実装装置
JP7580811B2 (ja) * 2022-03-29 2024-11-12 Ａｉメカテック株式会社 基板貼り合わせ装置及び基板貼り合わせ方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007158122A (ja) * 2005-12-06 2007-06-21 Tokyo Ohka Kogyo Co Ltd サポートプレートの貼り合わせ手段及び貼り合わせ装置、並びにサポートプレートの貼り合わせ方法
WO2009057710A1 (ja) 2007-10-30 2009-05-07 Nikon Corporation 基板保持部材、基板接合装置、積層基板製造装置、基板接合方法、積層基板製造方法および積層型半導体装置製造方法
JP2011181755A (ja) * 2010-03-02 2011-09-15 Nikon Corp 重ね合わせ装置、基板ホルダ、位置検出方法およびデバイスの製造方法
JP2012059758A (ja) * 2010-09-06 2012-03-22 Tokyo Ohka Kogyo Co Ltd 貼り合わせ装置および貼り合わせ方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4535907B2 (ja) * 2005-03-03 2010-09-01 日東電工株式会社 判別機能付き位置決め装置
JP4750724B2 (ja) 2007-01-25 2011-08-17 東京応化工業株式会社 重ね合わせユニット及び貼り合わせ装置
JP4744458B2 (ja) * 2007-01-31 2011-08-10 東京エレクトロン株式会社 基板位置決め装置および基板位置決め方法
US8060330B2 (en) 2008-12-12 2011-11-15 Lam Research Corporation Method and system for centering wafer on chuck
JP2013033809A (ja) * 2011-08-01 2013-02-14 Tokyo Electron Ltd ウエハ搬送装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007158122A (ja) * 2005-12-06 2007-06-21 Tokyo Ohka Kogyo Co Ltd サポートプレートの貼り合わせ手段及び貼り合わせ装置、並びにサポートプレートの貼り合わせ方法
WO2009057710A1 (ja) 2007-10-30 2009-05-07 Nikon Corporation 基板保持部材、基板接合装置、積層基板製造装置、基板接合方法、積層基板製造方法および積層型半導体装置製造方法
JP2011181755A (ja) * 2010-03-02 2011-09-15 Nikon Corp 重ね合わせ装置、基板ホルダ、位置検出方法およびデバイスの製造方法
JP2012059758A (ja) * 2010-09-06 2012-03-22 Tokyo Ohka Kogyo Co Ltd 貼り合わせ装置および貼り合わせ方法

Also Published As

Publication number Publication date
JP6001934B2 (ja) 2016-10-05
US20150194329A1 (en) 2015-07-09
KR20150034179A (ko) 2015-04-02
TW201413863A (zh) 2014-04-01
JP2014007299A (ja) 2014-01-16
US9911637B2 (en) 2018-03-06
WO2014002609A1 (ja) 2014-01-03
TWI524463B (zh) 2016-03-01

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