KR101674564B1 - 다층 화학-기계적 평탄화 패드 - Google Patents

다층 화학-기계적 평탄화 패드 Download PDF

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Publication number
KR101674564B1
KR101674564B1 KR1020117018035A KR20117018035A KR101674564B1 KR 101674564 B1 KR101674564 B1 KR 101674564B1 KR 1020117018035 A KR1020117018035 A KR 1020117018035A KR 20117018035 A KR20117018035 A KR 20117018035A KR 101674564 B1 KR101674564 B1 KR 101674564B1
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KR
South Korea
Prior art keywords
water
component
chemical mechanical
mechanical planarization
forming
Prior art date
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KR1020117018035A
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English (en)
Korean (ko)
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KR20110111298A (ko
Inventor
폴 르페브르
아눕 매튜
광웨이 유
스콧 신 차오
오스카 케이. 수
데이비드 아담 웰스
존 에릭 알데보르흐
마크 씨. 진
Original Assignee
에프엔에스테크 주식회사
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Publication of KR20110111298A publication Critical patent/KR20110111298A/ko
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Publication of KR101674564B1 publication Critical patent/KR101674564B1/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Solid-Sorbent Or Filter-Aiding Compositions (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020117018035A 2009-01-05 2010-01-05 다층 화학-기계적 평탄화 패드 Active KR101674564B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14254409P 2009-01-05 2009-01-05
US61/142,544 2009-01-05
PCT/US2010/020081 WO2010078566A1 (en) 2009-01-05 2010-01-05 Multi-layered chemical-mechanical planarization pad

Publications (2)

Publication Number Publication Date
KR20110111298A KR20110111298A (ko) 2011-10-10
KR101674564B1 true KR101674564B1 (ko) 2016-11-09

Family

ID=42310236

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020117018035A Active KR101674564B1 (ko) 2009-01-05 2010-01-05 다층 화학-기계적 평탄화 패드

Country Status (8)

Country Link
US (2) US8790165B2 (enExample)
EP (1) EP2389275A1 (enExample)
JP (1) JP5587337B2 (enExample)
KR (1) KR101674564B1 (enExample)
CN (1) CN102271867B (enExample)
SG (1) SG172850A1 (enExample)
TW (1) TWI520812B (enExample)
WO (1) WO2010078566A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012138705A2 (en) * 2011-04-05 2012-10-11 Universal Photonics, Inc. A self-conditioning polishing pad and a method of making the same
US9050697B2 (en) 2012-03-20 2015-06-09 Jh Rhodes Company, Inc. Self-conditioning polishing pad and a method of making the same
WO2014039575A1 (en) * 2012-09-06 2014-03-13 Hydration Systems, Llc Phase inversion membrane and method for manufacturing same using soluble fibers
JP6408410B2 (ja) * 2015-03-30 2018-10-17 日本碍子株式会社 成形体の製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008207325A (ja) 2007-02-01 2008-09-11 Kuraray Co Ltd 研磨パッド及び研磨パッドの製造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4257687B2 (ja) 1999-01-11 2009-04-22 株式会社トクヤマ 研磨剤および研磨方法
US6533645B2 (en) 2000-01-18 2003-03-18 Applied Materials, Inc. Substrate polishing article
US6656019B1 (en) * 2000-06-29 2003-12-02 International Business Machines Corporation Grooved polishing pads and methods of use
US6964604B2 (en) * 2000-06-23 2005-11-15 International Business Machines Corporation Fiber embedded polishing pad
US6709981B2 (en) * 2000-08-16 2004-03-23 Memc Electronic Materials, Inc. Method and apparatus for processing a semiconductor wafer using novel final polishing method
JP2002154040A (ja) * 2000-11-20 2002-05-28 Ikegami Kanagata Kogyo Kk 回転工具
US7267607B2 (en) 2002-10-28 2007-09-11 Cabot Microelectronics Corporation Transparent microporous materials for CMP
JP4039214B2 (ja) 2002-11-05 2008-01-30 Ｊｓｒ株式会社 研磨パッド
JP2004343090A (ja) 2003-04-22 2004-12-02 Jsr Corp 研磨パッドおよび半導体ウェハの研磨方法
US7086932B2 (en) * 2004-05-11 2006-08-08 Freudenberg Nonwovens Polishing pad
TWI292730B (en) 2003-07-01 2008-01-21 Applied Materials Inc Method and apparatus for electrochemical mechanical processing
US7384871B2 (en) * 2004-07-01 2008-06-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing compositions and methods relating thereto
US8075372B2 (en) 2004-09-01 2011-12-13 Cabot Microelectronics Corporation Polishing pad with microporous regions
EP2123400B1 (en) * 2007-02-01 2012-10-10 Kuraray Co., Ltd. Polishing pad and process for production of polishing pad

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008207325A (ja) 2007-02-01 2008-09-11 Kuraray Co Ltd 研磨パッド及び研磨パッドの製造方法

Also Published As

Publication number Publication date
US9796063B2 (en) 2017-10-24
US20100221983A1 (en) 2010-09-02
JP5587337B2 (ja) 2014-09-10
US20140311043A1 (en) 2014-10-23
CN102271867B (zh) 2015-07-01
SG172850A1 (en) 2011-08-29
KR20110111298A (ko) 2011-10-10
US8790165B2 (en) 2014-07-29
TW201032952A (en) 2010-09-16
EP2389275A1 (en) 2011-11-30
TWI520812B (zh) 2016-02-11
CN102271867A (zh) 2011-12-07
JP2012514857A (ja) 2012-06-28
WO2010078566A1 (en) 2010-07-08

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