JP5587337B2 - 複数層化学機械平坦化パッド - Google Patents

複数層化学機械平坦化パッド Download PDF

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Publication number
JP5587337B2
JP5587337B2 JP2011544649A JP2011544649A JP5587337B2 JP 5587337 B2 JP5587337 B2 JP 5587337B2 JP 2011544649 A JP2011544649 A JP 2011544649A JP 2011544649 A JP2011544649 A JP 2011544649A JP 5587337 B2 JP5587337 B2 JP 5587337B2
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Japan
Prior art keywords
water
component
pad
soluble
composition
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JP2011544649A
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English (en)
Japanese (ja)
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JP2012514857A5 (enExample
JP2012514857A (ja
Inventor
ポール リフブル
アヌープ マシュー
ガンウェイ ウー
スコット シン チャオ
オスカー ケイ． スー
デイヴィッド アダム ウェルズ
ジョン エリック アルデボー
マーク シー． ジン
Original Assignee
イノパッド，インコーポレイテッド
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Publication of JP2012514857A5 publication Critical patent/JP2012514857A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Solid-Sorbent Or Filter-Aiding Compositions (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2011544649A 2009-01-05 2010-01-05 複数層化学機械平坦化パッド Active JP5587337B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14254409P 2009-01-05 2009-01-05
US61/142,544 2009-01-05
PCT/US2010/020081 WO2010078566A1 (en) 2009-01-05 2010-01-05 Multi-layered chemical-mechanical planarization pad

Publications (3)

Publication Number Publication Date
JP2012514857A JP2012514857A (ja) 2012-06-28
JP2012514857A5 JP2012514857A5 (enExample) 2013-02-21
JP5587337B2 true JP5587337B2 (ja) 2014-09-10

Family

ID=42310236

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011544649A Active JP5587337B2 (ja) 2009-01-05 2010-01-05 複数層化学機械平坦化パッド

Country Status (8)

Country Link
US (2) US8790165B2 (enExample)
EP (1) EP2389275A1 (enExample)
JP (1) JP5587337B2 (enExample)
KR (1) KR101674564B1 (enExample)
CN (1) CN102271867B (enExample)
SG (1) SG172850A1 (enExample)
TW (1) TWI520812B (enExample)
WO (1) WO2010078566A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012138705A2 (en) * 2011-04-05 2012-10-11 Universal Photonics, Inc. A self-conditioning polishing pad and a method of making the same
US9050697B2 (en) 2012-03-20 2015-06-09 Jh Rhodes Company, Inc. Self-conditioning polishing pad and a method of making the same
WO2014039575A1 (en) * 2012-09-06 2014-03-13 Hydration Systems, Llc Phase inversion membrane and method for manufacturing same using soluble fibers
JP6408410B2 (ja) * 2015-03-30 2018-10-17 日本碍子株式会社 成形体の製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4257687B2 (ja) 1999-01-11 2009-04-22 株式会社トクヤマ 研磨剤および研磨方法
US6533645B2 (en) 2000-01-18 2003-03-18 Applied Materials, Inc. Substrate polishing article
US6656019B1 (en) * 2000-06-29 2003-12-02 International Business Machines Corporation Grooved polishing pads and methods of use
US6964604B2 (en) * 2000-06-23 2005-11-15 International Business Machines Corporation Fiber embedded polishing pad
US6709981B2 (en) * 2000-08-16 2004-03-23 Memc Electronic Materials, Inc. Method and apparatus for processing a semiconductor wafer using novel final polishing method
JP2002154040A (ja) * 2000-11-20 2002-05-28 Ikegami Kanagata Kogyo Kk 回転工具
US7267607B2 (en) 2002-10-28 2007-09-11 Cabot Microelectronics Corporation Transparent microporous materials for CMP
JP4039214B2 (ja) 2002-11-05 2008-01-30 Ｊｓｒ株式会社 研磨パッド
JP2004343090A (ja) 2003-04-22 2004-12-02 Jsr Corp 研磨パッドおよび半導体ウェハの研磨方法
US7086932B2 (en) * 2004-05-11 2006-08-08 Freudenberg Nonwovens Polishing pad
TWI292730B (en) 2003-07-01 2008-01-21 Applied Materials Inc Method and apparatus for electrochemical mechanical processing
US7384871B2 (en) * 2004-07-01 2008-06-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing compositions and methods relating thereto
US8075372B2 (en) 2004-09-01 2011-12-13 Cabot Microelectronics Corporation Polishing pad with microporous regions
JP5289787B2 (ja) 2007-02-01 2013-09-11 株式会社クラレ 研磨パッド及び研磨パッドの製造方法
EP2123400B1 (en) * 2007-02-01 2012-10-10 Kuraray Co., Ltd. Polishing pad and process for production of polishing pad

Also Published As

Publication number Publication date
KR101674564B1 (ko) 2016-11-09
US9796063B2 (en) 2017-10-24
US20100221983A1 (en) 2010-09-02
US20140311043A1 (en) 2014-10-23
CN102271867B (zh) 2015-07-01
SG172850A1 (en) 2011-08-29
KR20110111298A (ko) 2011-10-10
US8790165B2 (en) 2014-07-29
TW201032952A (en) 2010-09-16
EP2389275A1 (en) 2011-11-30
TWI520812B (zh) 2016-02-11
CN102271867A (zh) 2011-12-07
JP2012514857A (ja) 2012-06-28
WO2010078566A1 (en) 2010-07-08

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