TWI520812B - 化學機械平面化墊體及其製造方法、以及拋光一基板之方法 - Google Patents
化學機械平面化墊體及其製造方法、以及拋光一基板之方法 Download PDFInfo
- Publication number
- TWI520812B TWI520812B TW099100071A TW99100071A TWI520812B TW I520812 B TWI520812 B TW I520812B TW 099100071 A TW099100071 A TW 099100071A TW 99100071 A TW99100071 A TW 99100071A TW I520812 B TWI520812 B TW I520812B
- Authority
- TW
- Taiwan
- Prior art keywords
- component
- water
- fiber
- fabric
- insoluble
- Prior art date
Links
- 239000000126 substance Substances 0.000 title claims description 37
- 238000000034 method Methods 0.000 title claims description 35
- 239000000758 substrate Substances 0.000 title claims description 21
- 238000007517 polishing process Methods 0.000 title claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 130
- 239000000835 fiber Substances 0.000 claims description 38
- 239000000463 material Substances 0.000 claims description 25
- 239000004744 fabric Substances 0.000 claims description 21
- 239000011148 porous material Substances 0.000 claims description 20
- 239000002245 particle Substances 0.000 claims description 16
- 239000011159 matrix material Substances 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 9
- -1 poly(vinyl alcohol) Polymers 0.000 claims description 9
- 239000002002 slurry Substances 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 7
- 229920000728 polyester Polymers 0.000 claims description 7
- 229920000098 polyolefin Polymers 0.000 claims description 7
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 7
- 229920001577 copolymer Polymers 0.000 claims description 6
- 239000004745 nonwoven fabric Substances 0.000 claims description 6
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 5
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 5
- 235000019422 polyvinyl alcohol Nutrition 0.000 claims description 5
- 239000002243 precursor Substances 0.000 claims description 5
- 239000004593 Epoxy Substances 0.000 claims description 4
- 239000004952 Polyamide Substances 0.000 claims description 4
- 239000004642 Polyimide Substances 0.000 claims description 4
- 229920000297 Rayon Polymers 0.000 claims description 4
- 229920002125 Sokalan® Polymers 0.000 claims description 4
- 229920002647 polyamide Polymers 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- 239000002964 rayon Substances 0.000 claims description 4
- FHVDTGUDJYJELY-UHFFFAOYSA-N 6-{[2-carboxy-4,5-dihydroxy-6-(phosphanyloxy)oxan-3-yl]oxy}-4,5-dihydroxy-3-phosphanyloxane-2-carboxylic acid Chemical compound O1C(C(O)=O)C(P)C(O)C(O)C1OC1C(C(O)=O)OC(OP)C(O)C1O FHVDTGUDJYJELY-UHFFFAOYSA-N 0.000 claims description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 3
- 229940072056 alginate Drugs 0.000 claims description 3
- 229920000615 alginic acid Polymers 0.000 claims description 3
- 235000010443 alginic acid Nutrition 0.000 claims description 3
- 230000001747 exhibiting effect Effects 0.000 claims description 3
- 150000004676 glycans Chemical class 0.000 claims description 3
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 claims description 3
- 239000011976 maleic acid Substances 0.000 claims description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 3
- 229920000058 polyacrylate Polymers 0.000 claims description 3
- 229920000515 polycarbonate Polymers 0.000 claims description 3
- 239000004417 polycarbonate Substances 0.000 claims description 3
- 229920001282 polysaccharide Polymers 0.000 claims description 3
- 239000005017 polysaccharide Substances 0.000 claims description 3
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 3
- 150000003839 salts Chemical class 0.000 claims description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims description 3
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 claims description 2
- 229920002492 poly(sulfone) Polymers 0.000 claims description 2
- 229920006389 polyphenyl polymer Polymers 0.000 claims description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 claims 3
- 229920000768 polyamine Polymers 0.000 claims 3
- 238000002844 melting Methods 0.000 claims 2
- 230000008018 melting Effects 0.000 claims 2
- 239000004584 polyacrylic acid Substances 0.000 claims 2
- 238000005266 casting Methods 0.000 claims 1
- 229920002098 polyfluorene Polymers 0.000 claims 1
- 239000004926 polymethyl methacrylate Substances 0.000 claims 1
- 239000004800 polyvinyl chloride Substances 0.000 claims 1
- 239000002198 insoluble material Substances 0.000 description 37
- 239000002195 soluble material Substances 0.000 description 25
- 238000005498 polishing Methods 0.000 description 17
- 229920002635 polyurethane Polymers 0.000 description 7
- 239000004814 polyurethane Substances 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 7
- 235000012431 wafers Nutrition 0.000 description 6
- 230000000704 physical effect Effects 0.000 description 5
- 238000004090 dissolution Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 239000008240 homogeneous mixture Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000000470 constituent Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000004377 microelectronic Methods 0.000 description 2
- 239000005304 optical glass Substances 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 230000000717 retained effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241000195493 Cryptophyta Species 0.000 description 1
- 229920001730 Moisture cure polyurethane Polymers 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000012736 aqueous medium Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000000071 blow moulding Methods 0.000 description 1
- 238000009125 cardiac resynchronization therapy Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000002609 medium Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000012704 polymeric precursor Substances 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004634 thermosetting polymer Substances 0.000 description 1
- 238000002525 ultrasonication Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Solid-Sorbent Or Filter-Aiding Compositions (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14254409P | 2009-01-05 | 2009-01-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201032952A TW201032952A (en) | 2010-09-16 |
| TWI520812B true TWI520812B (zh) | 2016-02-11 |
Family
ID=42310236
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW099100071A TWI520812B (zh) | 2009-01-05 | 2010-01-05 | 化學機械平面化墊體及其製造方法、以及拋光一基板之方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US8790165B2 (enExample) |
| EP (1) | EP2389275A1 (enExample) |
| JP (1) | JP5587337B2 (enExample) |
| KR (1) | KR101674564B1 (enExample) |
| CN (1) | CN102271867B (enExample) |
| SG (1) | SG172850A1 (enExample) |
| TW (1) | TWI520812B (enExample) |
| WO (1) | WO2010078566A1 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012138705A2 (en) * | 2011-04-05 | 2012-10-11 | Universal Photonics, Inc. | A self-conditioning polishing pad and a method of making the same |
| US9050697B2 (en) | 2012-03-20 | 2015-06-09 | Jh Rhodes Company, Inc. | Self-conditioning polishing pad and a method of making the same |
| WO2014039575A1 (en) * | 2012-09-06 | 2014-03-13 | Hydration Systems, Llc | Phase inversion membrane and method for manufacturing same using soluble fibers |
| JP6408410B2 (ja) * | 2015-03-30 | 2018-10-17 | 日本碍子株式会社 | 成形体の製造方法 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4257687B2 (ja) | 1999-01-11 | 2009-04-22 | 株式会社トクヤマ | 研磨剤および研磨方法 |
| US6533645B2 (en) | 2000-01-18 | 2003-03-18 | Applied Materials, Inc. | Substrate polishing article |
| US6656019B1 (en) * | 2000-06-29 | 2003-12-02 | International Business Machines Corporation | Grooved polishing pads and methods of use |
| US6964604B2 (en) * | 2000-06-23 | 2005-11-15 | International Business Machines Corporation | Fiber embedded polishing pad |
| US6709981B2 (en) * | 2000-08-16 | 2004-03-23 | Memc Electronic Materials, Inc. | Method and apparatus for processing a semiconductor wafer using novel final polishing method |
| JP2002154040A (ja) * | 2000-11-20 | 2002-05-28 | Ikegami Kanagata Kogyo Kk | 回転工具 |
| US7267607B2 (en) | 2002-10-28 | 2007-09-11 | Cabot Microelectronics Corporation | Transparent microporous materials for CMP |
| JP4039214B2 (ja) | 2002-11-05 | 2008-01-30 | Ｊｓｒ株式会社 | 研磨パッド |
| JP2004343090A (ja) | 2003-04-22 | 2004-12-02 | Jsr Corp | 研磨パッドおよび半導体ウェハの研磨方法 |
| US7086932B2 (en) * | 2004-05-11 | 2006-08-08 | Freudenberg Nonwovens | Polishing pad |
| TWI292730B (en) | 2003-07-01 | 2008-01-21 | Applied Materials Inc | Method and apparatus for electrochemical mechanical processing |
| US7384871B2 (en) * | 2004-07-01 | 2008-06-10 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing compositions and methods relating thereto |
| US8075372B2 (en) | 2004-09-01 | 2011-12-13 | Cabot Microelectronics Corporation | Polishing pad with microporous regions |
| JP5289787B2 (ja) | 2007-02-01 | 2013-09-11 | 株式会社クラレ | 研磨パッド及び研磨パッドの製造方法 |
| EP2123400B1 (en) * | 2007-02-01 | 2012-10-10 | Kuraray Co., Ltd. | Polishing pad and process for production of polishing pad |
-
2010
- 2010-01-05 WO PCT/US2010/020081 patent/WO2010078566A1/en not_active Ceased
- 2010-01-05 KR KR1020117018035A patent/KR101674564B1/ko active Active
- 2010-01-05 JP JP2011544649A patent/JP5587337B2/ja active Active
- 2010-01-05 US US12/652,143 patent/US8790165B2/en active Active
- 2010-01-05 TW TW099100071A patent/TWI520812B/zh active
- 2010-01-05 CN CN201080004238.1A patent/CN102271867B/zh active Active
- 2010-01-05 EP EP10726832A patent/EP2389275A1/en not_active Withdrawn
- 2010-01-05 SG SG2011048949A patent/SG172850A1/en unknown
-
2014
- 2014-06-30 US US14/318,894 patent/US9796063B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| KR101674564B1 (ko) | 2016-11-09 |
| US9796063B2 (en) | 2017-10-24 |
| US20100221983A1 (en) | 2010-09-02 |
| JP5587337B2 (ja) | 2014-09-10 |
| US20140311043A1 (en) | 2014-10-23 |
| CN102271867B (zh) | 2015-07-01 |
| SG172850A1 (en) | 2011-08-29 |
| KR20110111298A (ko) | 2011-10-10 |
| US8790165B2 (en) | 2014-07-29 |
| TW201032952A (en) | 2010-09-16 |
| EP2389275A1 (en) | 2011-11-30 |
| CN102271867A (zh) | 2011-12-07 |
| JP2012514857A (ja) | 2012-06-28 |
| WO2010078566A1 (en) | 2010-07-08 |
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