CN102271867B - 多层的化学机械平面化垫体 - Google Patents

多层的化学机械平面化垫体 Download PDF

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Publication number
CN102271867B
CN102271867B CN201080004238.1A CN201080004238A CN102271867B CN 102271867 B CN102271867 B CN 102271867B CN 201080004238 A CN201080004238 A CN 201080004238A CN 102271867 B CN102271867 B CN 102271867B
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CN
China
Prior art keywords
water
water soluble
tissue layer
component
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
CN201080004238.1A
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English (en)
Chinese (zh)
Other versions
CN102271867A (zh
Inventor
P·利菲瑞
A·马修
吴光伟
S·X·乔
O·K·许
D·A·韦尔斯
J·E·奥迪伯
M·C·金
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FNS Technology Co Ltd
Original Assignee
Innopad Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Innopad Inc filed Critical Innopad Inc
Publication of CN102271867A publication Critical patent/CN102271867A/zh
Application granted granted Critical
Publication of CN102271867B publication Critical patent/CN102271867B/zh
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Solid-Sorbent Or Filter-Aiding Compositions (AREA)
CN201080004238.1A 2009-01-05 2010-01-05 多层的化学机械平面化垫体 Active CN102271867B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14254409P 2009-01-05 2009-01-05
US61/142,544 2009-01-05
PCT/US2010/020081 WO2010078566A1 (en) 2009-01-05 2010-01-05 Multi-layered chemical-mechanical planarization pad

Publications (2)

Publication Number Publication Date
CN102271867A CN102271867A (zh) 2011-12-07
CN102271867B true CN102271867B (zh) 2015-07-01

Family

ID=42310236

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201080004238.1A Active CN102271867B (zh) 2009-01-05 2010-01-05 多层的化学机械平面化垫体

Country Status (8)

Country Link
US (2) US8790165B2 (enExample)
EP (1) EP2389275A1 (enExample)
JP (1) JP5587337B2 (enExample)
KR (1) KR101674564B1 (enExample)
CN (1) CN102271867B (enExample)
SG (1) SG172850A1 (enExample)
TW (1) TWI520812B (enExample)
WO (1) WO2010078566A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012138705A2 (en) * 2011-04-05 2012-10-11 Universal Photonics, Inc. A self-conditioning polishing pad and a method of making the same
US9050697B2 (en) 2012-03-20 2015-06-09 Jh Rhodes Company, Inc. Self-conditioning polishing pad and a method of making the same
WO2014039575A1 (en) * 2012-09-06 2014-03-13 Hydration Systems, Llc Phase inversion membrane and method for manufacturing same using soluble fibers
JP6408410B2 (ja) * 2015-03-30 2018-10-17 日本碍子株式会社 成形体の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1325514A2 (en) * 2000-08-16 2003-07-09 MEMC Electronic Materials, Inc. Method and apparatus for processing a semiconductor wafer using novel final polishing method
CN1449322A (zh) * 2000-06-29 2003-10-15 国际商业机器公司 带槽的抛光垫及其使用方法
CN1715310A (zh) * 2004-07-01 2006-01-04 罗门哈斯电子材料Cmp控股股份有限公司 化学机械抛光组合物及有关的方法
WO2008093850A1 (ja) * 2007-02-01 2008-08-07 Kuraray Co., Ltd. 研磨パッド及び研磨パッドの製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4257687B2 (ja) 1999-01-11 2009-04-22 株式会社トクヤマ 研磨剤および研磨方法
US6533645B2 (en) 2000-01-18 2003-03-18 Applied Materials, Inc. Substrate polishing article
US6964604B2 (en) * 2000-06-23 2005-11-15 International Business Machines Corporation Fiber embedded polishing pad
JP2002154040A (ja) * 2000-11-20 2002-05-28 Ikegami Kanagata Kogyo Kk 回転工具
US7267607B2 (en) 2002-10-28 2007-09-11 Cabot Microelectronics Corporation Transparent microporous materials for CMP
JP4039214B2 (ja) 2002-11-05 2008-01-30 Ｊｓｒ株式会社 研磨パッド
JP2004343090A (ja) 2003-04-22 2004-12-02 Jsr Corp 研磨パッドおよび半導体ウェハの研磨方法
US7086932B2 (en) * 2004-05-11 2006-08-08 Freudenberg Nonwovens Polishing pad
TWI292730B (en) 2003-07-01 2008-01-21 Applied Materials Inc Method and apparatus for electrochemical mechanical processing
US8075372B2 (en) 2004-09-01 2011-12-13 Cabot Microelectronics Corporation Polishing pad with microporous regions
JP5289787B2 (ja) 2007-02-01 2013-09-11 株式会社クラレ 研磨パッド及び研磨パッドの製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1449322A (zh) * 2000-06-29 2003-10-15 国际商业机器公司 带槽的抛光垫及其使用方法
EP1325514A2 (en) * 2000-08-16 2003-07-09 MEMC Electronic Materials, Inc. Method and apparatus for processing a semiconductor wafer using novel final polishing method
CN1715310A (zh) * 2004-07-01 2006-01-04 罗门哈斯电子材料Cmp控股股份有限公司 化学机械抛光组合物及有关的方法
WO2008093850A1 (ja) * 2007-02-01 2008-08-07 Kuraray Co., Ltd. 研磨パッド及び研磨パッドの製造方法

Also Published As

Publication number Publication date
KR101674564B1 (ko) 2016-11-09
US9796063B2 (en) 2017-10-24
US20100221983A1 (en) 2010-09-02
JP5587337B2 (ja) 2014-09-10
US20140311043A1 (en) 2014-10-23
SG172850A1 (en) 2011-08-29
KR20110111298A (ko) 2011-10-10
US8790165B2 (en) 2014-07-29
TW201032952A (en) 2010-09-16
EP2389275A1 (en) 2011-11-30
TWI520812B (zh) 2016-02-11
CN102271867A (zh) 2011-12-07
JP2012514857A (ja) 2012-06-28
WO2010078566A1 (en) 2010-07-08

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SE01 Entry into force of request for substantive examination
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TR01 Transfer of patent right

Effective date of registration: 20250902

Address after: Chungnam, South Korea

Patentee after: FNS Tech Co.,Ltd.

Country or region after: Republic of Korea

Address before: Massachusetts, USA

Patentee before: INNOPAD, Inc.

Country or region before: U.S.A.

TR01 Transfer of patent right