SG172850A1 - Multi-layered chemical-mechanical planarization pad - Google Patents

Multi-layered chemical-mechanical planarization pad Download PDF

Info

Publication number
SG172850A1
SG172850A1 SG2011048949A SG2011048949A SG172850A1 SG 172850 A1 SG172850 A1 SG 172850A1 SG 2011048949 A SG2011048949 A SG 2011048949A SG 2011048949 A SG2011048949 A SG 2011048949A SG 172850 A1 SG172850 A1 SG 172850A1
Authority
SG
Singapore
Prior art keywords
component
water soluble
pad
water
water insoluble
Prior art date
Application number
SG2011048949A
Other languages
English (en)
Inventor
Paul Lefevre
Anoop Mathew
Guangwei Wu
Scott Xin Qiao
Oscar K Hsu
David Adam Wells
John Erik Aldeborgh
Marc C Jin
Original Assignee
Innopad Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Innopad Inc filed Critical Innopad Inc
Publication of SG172850A1 publication Critical patent/SG172850A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Solid-Sorbent Or Filter-Aiding Compositions (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
SG2011048949A 2009-01-05 2010-01-05 Multi-layered chemical-mechanical planarization pad SG172850A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14254409P 2009-01-05 2009-01-05
PCT/US2010/020081 WO2010078566A1 (en) 2009-01-05 2010-01-05 Multi-layered chemical-mechanical planarization pad

Publications (1)

Publication Number Publication Date
SG172850A1 true SG172850A1 (en) 2011-08-29

Family

ID=42310236

Family Applications (1)

Application Number Title Priority Date Filing Date
SG2011048949A SG172850A1 (en) 2009-01-05 2010-01-05 Multi-layered chemical-mechanical planarization pad

Country Status (8)

Country Link
US (2) US8790165B2 (enExample)
EP (1) EP2389275A1 (enExample)
JP (1) JP5587337B2 (enExample)
KR (1) KR101674564B1 (enExample)
CN (1) CN102271867B (enExample)
SG (1) SG172850A1 (enExample)
TW (1) TWI520812B (enExample)
WO (1) WO2010078566A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012138705A2 (en) * 2011-04-05 2012-10-11 Universal Photonics, Inc. A self-conditioning polishing pad and a method of making the same
US9050697B2 (en) 2012-03-20 2015-06-09 Jh Rhodes Company, Inc. Self-conditioning polishing pad and a method of making the same
WO2014039575A1 (en) * 2012-09-06 2014-03-13 Hydration Systems, Llc Phase inversion membrane and method for manufacturing same using soluble fibers
JP6408410B2 (ja) * 2015-03-30 2018-10-17 日本碍子株式会社 成形体の製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4257687B2 (ja) 1999-01-11 2009-04-22 株式会社トクヤマ 研磨剤および研磨方法
US6533645B2 (en) 2000-01-18 2003-03-18 Applied Materials, Inc. Substrate polishing article
US6656019B1 (en) * 2000-06-29 2003-12-02 International Business Machines Corporation Grooved polishing pads and methods of use
US6964604B2 (en) * 2000-06-23 2005-11-15 International Business Machines Corporation Fiber embedded polishing pad
US6709981B2 (en) * 2000-08-16 2004-03-23 Memc Electronic Materials, Inc. Method and apparatus for processing a semiconductor wafer using novel final polishing method
JP2002154040A (ja) * 2000-11-20 2002-05-28 Ikegami Kanagata Kogyo Kk 回転工具
US7267607B2 (en) 2002-10-28 2007-09-11 Cabot Microelectronics Corporation Transparent microporous materials for CMP
JP4039214B2 (ja) 2002-11-05 2008-01-30 Ｊｓｒ株式会社 研磨パッド
JP2004343090A (ja) 2003-04-22 2004-12-02 Jsr Corp 研磨パッドおよび半導体ウェハの研磨方法
US7086932B2 (en) * 2004-05-11 2006-08-08 Freudenberg Nonwovens Polishing pad
TWI292730B (en) 2003-07-01 2008-01-21 Applied Materials Inc Method and apparatus for electrochemical mechanical processing
US7384871B2 (en) * 2004-07-01 2008-06-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing compositions and methods relating thereto
US8075372B2 (en) 2004-09-01 2011-12-13 Cabot Microelectronics Corporation Polishing pad with microporous regions
JP5289787B2 (ja) 2007-02-01 2013-09-11 株式会社クラレ 研磨パッド及び研磨パッドの製造方法
EP2123400B1 (en) * 2007-02-01 2012-10-10 Kuraray Co., Ltd. Polishing pad and process for production of polishing pad

Also Published As

Publication number Publication date
KR101674564B1 (ko) 2016-11-09
US9796063B2 (en) 2017-10-24
US20100221983A1 (en) 2010-09-02
JP5587337B2 (ja) 2014-09-10
US20140311043A1 (en) 2014-10-23
CN102271867B (zh) 2015-07-01
KR20110111298A (ko) 2011-10-10
US8790165B2 (en) 2014-07-29
TW201032952A (en) 2010-09-16
EP2389275A1 (en) 2011-11-30
TWI520812B (zh) 2016-02-11
CN102271867A (zh) 2011-12-07
JP2012514857A (ja) 2012-06-28
WO2010078566A1 (en) 2010-07-08

Similar Documents

Publication Publication Date Title
TWI268831B (en) Integral polishing pad and manufacturing method thereof
JP5543494B2 (ja) パターン化された構造ドメインを含む化学機械平坦化パッド
US9796063B2 (en) Multi-layered chemical-mechanical planarization pad
CN1269615C (zh) 含有被埋入的液态微量成分的研磨垫及其制造方法
JP5460316B2 (ja) パッド表面上にマイクロ溝を有する研磨パッド
JP5749420B2 (ja) 制御された細孔径を有する微孔質ｃｍｐ材料の製造方法
TWI385050B (zh) 用於ｃｍｐ之特製拋光墊及其製造方法及其用途
US6953388B2 (en) Polishing pad, and method and apparatus for polishing
CN102083586B (zh) 抛光垫片组合物与制造和使用方法
KR20130138841A (ko) 분리된 돌출부들을 그 위에 가지는 균일체를 가진 연마 패드
KR101577988B1 (ko) 화학-기계적 평탄화 패드
TWI766447B (zh) 研磨墊、其製備方法及使用其之半導體裝置的製備方法
KR20230005760A (ko) Cmp 폴리싱 패드
TW202328257A (zh) 可壓縮非網狀聚脲拋光墊
JP5777816B2 (ja) 支持パッド用ポリウレタン樹脂組成物及びこれを用いたポリウレタン支持パッド
US9862071B2 (en) Method for manufacturing polishing pad and polishing pad
TW202206513A (zh) 研磨墊、製備該研磨墊之方法及使用該研磨墊以製備半導體裝置之方法
CN113977453B (zh) 提高抛光平坦度的化学机械抛光垫及其应用
TW202112864A (zh) 拋光墊、其製造方法以及使用其之拋光方法
JP2002158197A (ja) 研磨用パッドおよびそれを用いた研磨装置ならびに研磨方法
KR102679468B1 (ko) 균일하게 분포된 액상 포어를 포함하는 연마 패드 및 이의 제조방법
CN112571303B (zh) 抛光垫、该抛光垫的制造方法及使用该抛光垫的抛光方法
CN112571273B (zh) 抛光垫、该抛光垫的制造方法及使用该抛光垫的抛光方法
JP5916982B2 (ja) 被加工物保持材
TW201200548A (en) A chemical mechanical polishing pad having a low defect integral window