KR101663870B1 - 다이 본더 - Google Patents

다이 본더 Download PDF

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Publication number
KR101663870B1
KR101663870B1 KR1020140116035A KR20140116035A KR101663870B1 KR 101663870 B1 KR101663870 B1 KR 101663870B1 KR 1020140116035 A KR1020140116035 A KR 1020140116035A KR 20140116035 A KR20140116035 A KR 20140116035A KR 101663870 B1 KR101663870 B1 KR 101663870B1
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KR
South Korea
Prior art keywords
die
bonding head
damper
vibration
bonding
Prior art date
Application number
KR1020140116035A
Other languages
English (en)
Korean (ko)
Other versions
KR20150032466A (ko
Inventor
요시히데 이시이
Original Assignee
파스포드 테크놀로지 주식회사
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Application filed by 파스포드 테크놀로지 주식회사 filed Critical 파스포드 테크놀로지 주식회사
Publication of KR20150032466A publication Critical patent/KR20150032466A/ko
Application granted granted Critical
Publication of KR101663870B1 publication Critical patent/KR101663870B1/ko

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  • Engineering & Computer Science (AREA)
  • Die Bonding (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
KR1020140116035A 2013-09-18 2014-09-02 다이 본더 KR101663870B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2013-193155 2013-09-18
JP2013193155A JP6276545B2 (ja) 2013-09-18 2013-09-18 ダイボンダ

Publications (2)

Publication Number Publication Date
KR20150032466A KR20150032466A (ko) 2015-03-26
KR101663870B1 true KR101663870B1 (ko) 2016-10-07

Family

ID=52818224

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140116035A KR101663870B1 (ko) 2013-09-18 2014-09-02 다이 본더

Country Status (4)

Country Link
JP (1) JP6276545B2 (ja)
KR (1) KR101663870B1 (ja)
CN (1) CN104465413B (ja)
TW (1) TWI591746B (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106409746A (zh) * 2016-10-21 2017-02-15 合肥矽迈微电子科技有限公司 芯片正装贴片设备
JP6846958B2 (ja) * 2017-03-09 2021-03-24 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
JP7018341B2 (ja) * 2018-03-26 2022-02-10 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
KR102037972B1 (ko) * 2018-05-30 2019-10-29 세메스 주식회사 다이 본딩 방법
CN110571160A (zh) * 2018-07-20 2019-12-13 安徽博辰电力科技有限公司 一种半导体封装芯片粘结工艺
JP7128697B2 (ja) * 2018-09-19 2022-08-31 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
SG11202104308TA (en) * 2018-11-01 2021-05-28 Yamaha Motor Robotics Holdings Co Ltd Electronic component mounting apparatus
TWI730506B (zh) * 2019-11-21 2021-06-11 日商新川股份有限公司 電子零件封裝裝置
CN113682819B (zh) * 2021-10-27 2021-12-17 江苏和睿半导体科技有限公司 一种半导体封装用智能输送机系统
CN115623697B (zh) * 2022-12-06 2023-04-07 常州铭赛机器人科技股份有限公司 芯片贴装机构

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013100917A (ja) * 2013-02-14 2013-05-23 Hitachi High-Tech Instruments Co Ltd 反動吸収装置及び半導体組立装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2630696B2 (ja) * 1991-09-19 1997-07-16 株式会社カイジョー ボンディング装置
JP2845161B2 (ja) * 1995-04-28 1999-01-13 ニチデン機械株式会社 コレット及びそれを用いたダイボンダ
JP2001290541A (ja) * 2000-04-11 2001-10-19 Yaskawa Electric Corp 産業用機械の加減速方法
JP4309680B2 (ja) * 2003-03-04 2009-08-05 キヤノンマシナリー株式会社 反力減衰駆動装置
JP2007027533A (ja) * 2005-07-20 2007-02-01 Nsk Ltd 電子部品実装装置
CN101043198A (zh) * 2006-03-22 2007-09-26 Juki株式会社 电子部件搭载装置
KR20100056789A (ko) * 2008-11-20 2010-05-28 주식회사 탑 엔지니어링 반력 상쇄 장치, 그것의 질량체 설정 방법, 그것을 이용한 반력 상쇄 방법 및 그것을 구비한 디스펜서
JP2011233578A (ja) * 2010-04-23 2011-11-17 Hitachi High-Tech Instruments Co Ltd 反動吸収装置及び半導体組立装置
JP5941705B2 (ja) * 2012-02-29 2016-06-29 ファスフォードテクノロジ株式会社 ２軸駆動機構及びダイボンダ

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013100917A (ja) * 2013-02-14 2013-05-23 Hitachi High-Tech Instruments Co Ltd 反動吸収装置及び半導体組立装置

Also Published As

Publication number Publication date
CN104465413A (zh) 2015-03-25
JP6276545B2 (ja) 2018-02-07
TWI591746B (zh) 2017-07-11
CN104465413B (zh) 2017-08-25
TW201533826A (zh) 2015-09-01
KR20150032466A (ko) 2015-03-26
JP2015060926A (ja) 2015-03-30

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