KR101662353B1 - 감광성 수지 조성물, 그의 경화 피막 및 인쇄 배선판 - Google Patents

감광성 수지 조성물, 그의 경화 피막 및 인쇄 배선판 Download PDF

Info

Publication number
KR101662353B1
KR101662353B1 KR1020120108867A KR20120108867A KR101662353B1 KR 101662353 B1 KR101662353 B1 KR 101662353B1 KR 1020120108867 A KR1020120108867 A KR 1020120108867A KR 20120108867 A KR20120108867 A KR 20120108867A KR 101662353 B1 KR101662353 B1 KR 101662353B1
Authority
KR
South Korea
Prior art keywords
photosensitive
manufactured
resin
acid
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020120108867A
Other languages
English (en)
Korean (ko)
Other versions
KR20130035951A (ko
Inventor
아끼오 노리꼬시
마사오 아리마
Original Assignee
다이요 잉키 세이조 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다이요 잉키 세이조 가부시키가이샤 filed Critical 다이요 잉키 세이조 가부시키가이샤
Publication of KR20130035951A publication Critical patent/KR20130035951A/ko
Application granted granted Critical
Publication of KR101662353B1 publication Critical patent/KR101662353B1/ko
Assigned to 다이요 홀딩스 가부시키가이샤 reassignment 다이요 홀딩스 가부시키가이샤 권리의 전부이전등록 Assignors: 다이요 잉키 세이조 가부시키가이샤
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/28Nitrogen-containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/34Silicon-containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/02Homopolymers or copolymers of acids; Metal or ammonium salts thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/285Permanent coating compositions
    • H05K3/287Photosensitive compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Epoxy Resins (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
KR1020120108867A 2011-09-30 2012-09-28 감광성 수지 조성물, 그의 경화 피막 및 인쇄 배선판 Active KR101662353B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011218750 2011-09-30
JPJP-P-2011-218750 2011-09-30

Publications (2)

Publication Number Publication Date
KR20130035951A KR20130035951A (ko) 2013-04-09
KR101662353B1 true KR101662353B1 (ko) 2016-10-04

Family

ID=47993195

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020120108867A Active KR101662353B1 (ko) 2011-09-30 2012-09-28 감광성 수지 조성물, 그의 경화 피막 및 인쇄 배선판

Country Status (5)

Country Link
US (1) US20130085208A1 (https=)
JP (1) JP6185227B2 (https=)
KR (1) KR101662353B1 (https=)
CN (2) CN103034053B (https=)
TW (2) TWI537678B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026071664A1 (ko) * 2024-09-30 2026-04-02 코오롱인더스트리 주식회사 감광성 수지 조성물, 이를 이용한 드라이 필름 포토레지스트 및 그 제조방법, 레지스트 패턴 및 장치

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9868873B2 (en) 2012-05-17 2018-01-16 Xerox Corporation Photochromic security enabled ink for digital offset printing applications
US20130310517A1 (en) 2012-05-17 2013-11-21 Xerox Corporation Methods for manufacturing curable inks for digital offset printing applications and the inks made therefrom
US10113076B2 (en) 2014-09-30 2018-10-30 Xerox Corporation Inverse emulsion acrylate ink compositions for ink-based digital lithographic printing
US9815992B2 (en) 2015-01-30 2017-11-14 Xerox Corporation Acrylate ink compositions for ink-based digital lithographic printing
US9890291B2 (en) 2015-01-30 2018-02-13 Xerox Corporation Acrylate ink compositions for ink-based digital lithographic printing
US10323154B2 (en) * 2015-02-11 2019-06-18 Xerox Corporation White ink composition for ink-based digital printing
US9751326B2 (en) 2015-02-12 2017-09-05 Xerox Corporation Hyperbranched ink compositions for controlled dimensional change and low energy curing
US9956757B2 (en) 2015-03-11 2018-05-01 Xerox Corporation Acrylate ink compositions for ink-based digital lithographic printing
JP6785551B2 (ja) * 2015-04-03 2020-11-18 三菱製紙株式会社 エッチング方法
CN105038194A (zh) * 2015-06-05 2015-11-11 苏州珍展科技材料有限公司 一种用于人造大理石的聚氨酯丙烯酸酯复合材料及其制备方法
TWI591119B (zh) 2016-06-16 2017-07-11 臻鼎科技股份有限公司 感光性樹脂組合物、覆蓋膜及電路板
US9744757B1 (en) 2016-08-18 2017-08-29 Xerox Corporation Methods for rejuvenating an imaging member of an ink-based digital printing system
CN108628093A (zh) * 2017-03-23 2018-10-09 株式会社田村制作所 感光性树脂组合物
US11939478B2 (en) 2020-03-10 2024-03-26 Xerox Corporation Metallic inks composition for digital offset lithographic printing

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003162921A (ja) 2001-11-28 2003-06-06 Taiyo Ink Mfg Ltd 光硬化性熱硬化性導電組成物及びそれを用いた導電回路の形成方法

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61243869A (ja) 1985-04-19 1986-10-30 Taiyo Ink Seizo Kk レジストインキ組成物
JP2862313B2 (ja) 1990-02-28 1999-03-03 山栄化学株式会社 ソルダーレジストインキ組成物及びその硬化物
JP3276833B2 (ja) * 1995-12-13 2002-04-22 太陽インキ製造株式会社 光硬化性・熱硬化性艶消しレジストインキ組成物
JP3247091B2 (ja) * 1997-11-28 2002-01-15 日立化成工業株式会社 光硬化性樹脂組成物及びこれを用いた感光性エレメント
US6583198B2 (en) * 1997-11-28 2003-06-24 Hitachi Chemical Company, Ltd. Photo curable resin composition and photosensitive element
DE60017470T2 (de) * 2000-02-14 2005-12-29 Taiyo Ink Mfg. Co. Ltd. Phot0- oder wärmehärtende zusammensetzungen zur herstellung matter filme
KR100522738B1 (ko) * 2002-11-29 2005-10-20 엘에스전선 주식회사 우수한 저장안정성과 가공성을 갖는 무연계에피클로로히드린 고무 조성물
JP4501662B2 (ja) * 2004-12-06 2010-07-14 東亞合成株式会社 感光性組成物及びソルダーレジスト
JP2007279489A (ja) * 2006-04-10 2007-10-25 Hitachi Chem Co Ltd 感光性樹脂組成物、レジストパターンの製造方法、フレキシブル基板及び電子部品
WO2007119651A1 (ja) * 2006-04-13 2007-10-25 Taiyo Ink Mfg. Co., Ltd. アルカリ現像型ソルダーレジスト及びその硬化物並びにそれを用いて得られるプリント配線板
CN101105626A (zh) * 2006-07-10 2008-01-16 太阳油墨制造株式会社 光固化性·热固化性树脂组合物、其固化物及印刷电路板
JP5291893B2 (ja) * 2007-05-08 2013-09-18 太陽ホールディングス株式会社 光硬化性樹脂組成物およびその硬化物
JP5285257B2 (ja) * 2007-09-21 2013-09-11 太陽ホールディングス株式会社 光硬化性・熱硬化性樹脂組成物及びその硬化物
CN100566540C (zh) * 2007-10-17 2009-12-02 太阳油墨(苏州)有限公司 印刷电路板的外观检查方法
KR20090068158A (ko) * 2007-12-21 2009-06-25 다이요 잉키 세이조 가부시키가이샤 광경화성 열경화성 수지 조성물 및 드라이 필름과 이들을 이용한 인쇄 배선판
CN102138104B (zh) * 2008-09-04 2013-01-23 日立化成工业株式会社 半导体封装用印刷电路板的保护膜用感光性树脂组合物
JP5239786B2 (ja) * 2008-11-28 2013-07-17 日立化成株式会社 感光性樹脂組成物、並びにこれを用いた感光性フィルム、レジストパターンの形成方法、ソルダーレジスト、層間絶縁膜、プリント配線板の製造方法及びプリント配線板
JP5377020B2 (ja) * 2009-03-23 2013-12-25 太陽ホールディングス株式会社 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JP5183540B2 (ja) * 2009-03-23 2013-04-17 太陽ホールディングス株式会社 硬化性樹脂組成物、それを用いたドライフィルム及びプリント配線板
JP5465453B2 (ja) * 2009-03-26 2014-04-09 パナソニック株式会社 光導波路形成用エポキシ樹脂組成物、光導波路形成用硬化性フィルム、光伝送用フレキシブルプリント配線板、及び電子情報機器
JP2011075787A (ja) * 2009-09-30 2011-04-14 Sekisui Chem Co Ltd 感光性組成物
JP2011164516A (ja) * 2010-02-15 2011-08-25 Hitachi Chem Co Ltd 感光性樹脂組成物及びこれを用いた感光性エレメント
JP5744528B2 (ja) * 2011-01-11 2015-07-08 東京応化工業株式会社 タッチパネル用着色感光性樹脂組成物、タッチパネル、及び表示装置
JP6061449B2 (ja) * 2011-03-31 2017-01-18 太陽インキ製造株式会社 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003162921A (ja) 2001-11-28 2003-06-06 Taiyo Ink Mfg Ltd 光硬化性熱硬化性導電組成物及びそれを用いた導電回路の形成方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026071664A1 (ko) * 2024-09-30 2026-04-02 코오롱인더스트리 주식회사 감광성 수지 조성물, 이를 이용한 드라이 필름 포토레지스트 및 그 제조방법, 레지스트 패턴 및 장치

Also Published As

Publication number Publication date
JP2013083960A (ja) 2013-05-09
KR20130035951A (ko) 2013-04-09
CN104035280A (zh) 2014-09-10
TWI537678B (zh) 2016-06-11
US20130085208A1 (en) 2013-04-04
CN103034053B (zh) 2015-08-05
CN103034053A (zh) 2013-04-10
CN104035280B (zh) 2017-10-24
JP6185227B2 (ja) 2017-08-23
TW201435495A (zh) 2014-09-16
TW201324036A (zh) 2013-06-16

Similar Documents

Publication Publication Date Title
KR101662353B1 (ko) 감광성 수지 조성물, 그의 경화 피막 및 인쇄 배선판
KR101322582B1 (ko) 감광성 수지 조성물, 그의 드라이 필름 및 그들을 이용한 인쇄 배선판
JP6417430B2 (ja) 光硬化性樹脂組成物、ドライフィルム、硬化物及びプリント配線板
KR101406441B1 (ko) 감광성 수지 조성물
JP5349113B2 (ja) 感光性樹脂組成物、それを用いたドライフィルム及びプリント配線板
KR101345066B1 (ko) 광경화성 열경화성 수지 조성물
KR101419161B1 (ko) 광경화성 열경화성 수지 조성물, 그의 드라이 필름 및 경화물, 및 이들을 이용한 인쇄 배선판
KR101419129B1 (ko) 감광성 수지 조성물, 그의 경화 피막 및 인쇄 배선판
KR101493567B1 (ko) 감광성 수지 조성물, 그의 경화 피막 및 인쇄 배선판
JP5829035B2 (ja) 光硬化性樹脂組成物、ドライフィルム、硬化物及びプリント配線板
KR101730682B1 (ko) 광경화성 열경화성 수지 조성물
JP2017522580A (ja) プリント配線板の製造用光硬化性熱硬化性樹脂組成物、ドライフィルム、硬化物、及びプリント配線板
JP2011043565A (ja) 光硬化性樹脂組成物
JP5091353B2 (ja) 光硬化性樹脂組成物
JP5951820B2 (ja) 光硬化性樹脂組成物
KR101464926B1 (ko) 감광성 수지 조성물, 그의 드라이 필름 및 경화물, 및 이들을 이용한 인쇄 배선판
JP5107960B2 (ja) ソルダーレジスト組成物、それを用いたドライフィルム及びプリント配線板
KR101690811B1 (ko) 경화성 수지 조성물 및 인쇄 배선판
JP2013047818A (ja) 光硬化性樹脂組成物
JP5864524B2 (ja) 光硬化性樹脂組成物
JP5536167B2 (ja) ソルダーレジスト用光硬化性樹脂組成物
JP2013047816A (ja) プリント配線板用光硬化性樹脂組成物

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

J201 Request for trial against refusal decision
PJ0201 Trial against decision of rejection

St.27 status event code: A-3-3-V10-V11-apl-PJ0201

J301 Trial decision

Free format text: TRIAL DECISION FOR APPEAL AGAINST DECISION TO DECLINE REFUSAL REQUESTED 20140723

Effective date: 20150821

PJ1301 Trial decision

St.27 status event code: A-3-3-V10-V15-crt-PJ1301

Decision date: 20150821

Appeal event data comment text: Appeal Kind Category : Appeal against decision to decline refusal, Appeal Ground Text : 2012 0108867

Appeal request date: 20140723

Appellate body name: Patent Examination Board

Decision authority category: Office appeal board

Decision identifier: 2014101004560

PS0901 Examination by remand of revocation

St.27 status event code: A-6-3-E10-E12-rex-PS0901

S901 Examination by remand of revocation
E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

GRNO Decision to grant (after opposition)
PS0701 Decision of registration after remand of revocation

St.27 status event code: A-3-4-F10-F13-rex-PS0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R14-asn-PN2301

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000