KR101660583B1 - 감광성 수지 조성물, 드라이 필름, 경화물 및 프린트 배선판 - Google Patents

감광성 수지 조성물, 드라이 필름, 경화물 및 프린트 배선판 Download PDF

Info

Publication number
KR101660583B1
KR101660583B1 KR1020140088911A KR20140088911A KR101660583B1 KR 101660583 B1 KR101660583 B1 KR 101660583B1 KR 1020140088911 A KR1020140088911 A KR 1020140088911A KR 20140088911 A KR20140088911 A KR 20140088911A KR 101660583 B1 KR101660583 B1 KR 101660583B1
Authority
KR
South Korea
Prior art keywords
alkali
group
resin composition
photosensitive resin
epoxy resin
Prior art date
Application number
KR1020140088911A
Other languages
English (en)
Korean (ko)
Other versions
KR20150026795A (ko
Inventor
츠요시 미타니
시노부 곤도
에이지 하리마
신이치로 후쿠다
Original Assignee
다이요 잉키 세이조 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다이요 잉키 세이조 가부시키가이샤 filed Critical 다이요 잉키 세이조 가부시키가이샤
Publication of KR20150026795A publication Critical patent/KR20150026795A/ko
Application granted granted Critical
Publication of KR101660583B1 publication Critical patent/KR101660583B1/ko

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C08F290/062—Polyethers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0385—Macromolecular compounds which are rendered insoluble or differentially wettable using epoxidised novolak resin
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Epoxy Resins (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
KR1020140088911A 2013-08-28 2014-07-15 감광성 수지 조성물, 드라이 필름, 경화물 및 프린트 배선판 KR101660583B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2013-176303 2013-08-28
JP2013176303 2013-08-28
JP2014001839A JP5507023B1 (ja) 2013-08-28 2014-01-08 感光性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JPJP-P-2014-001839 2014-01-08

Publications (2)

Publication Number Publication Date
KR20150026795A KR20150026795A (ko) 2015-03-11
KR101660583B1 true KR101660583B1 (ko) 2016-09-27

Family

ID=50941907

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140088911A KR101660583B1 (ko) 2013-08-28 2014-07-15 감광성 수지 조성물, 드라이 필름, 경화물 및 프린트 배선판

Country Status (4)

Country Link
JP (1) JP5507023B1 (ja)
KR (1) KR101660583B1 (ja)
CN (1) CN104423160B (ja)
TW (1) TWI481653B (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017126536A1 (ja) * 2016-01-20 2017-07-27 三菱瓦斯化学株式会社 樹脂組成物、支持体付き樹脂シート、多層プリント配線板及び半導体装置
JP7028828B2 (ja) * 2019-05-28 2022-03-02 株式会社タムラ製作所 保護被膜を有する配線板の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003183401A (ja) * 2001-12-20 2003-07-03 Showa Denko Kk 硬化性樹脂組成物およびその硬化物
JP2011026370A (ja) 2009-07-21 2011-02-10 Taiyo Holdings Co Ltd 光硬化性樹脂組成物
JP2012214557A (ja) 2011-03-31 2012-11-08 Taiyo Holdings Co Ltd 白色硬化性樹脂組成物及びその樹脂組成物の硬化物、並びに当該硬化物を有する反射板

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005336314A (ja) 2004-05-26 2005-12-08 Sekisui Chem Co Ltd 光硬化性樹脂組成物
JP5261242B2 (ja) * 2009-03-23 2013-08-14 太陽ホールディングス株式会社 硬化性樹脂組成物、それを用いたドライフィルム及びプリント配線板
JP5377020B2 (ja) * 2009-03-23 2013-12-25 太陽ホールディングス株式会社 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JP5325805B2 (ja) * 2010-01-29 2013-10-23 株式会社タムラ製作所 感光性樹脂組成物およびその硬化膜を用いたプリント配線板
JP5466522B2 (ja) * 2010-02-08 2014-04-09 太陽ホールディングス株式会社 光硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JP2012212039A (ja) * 2011-03-31 2012-11-01 Sekisui Chem Co Ltd 感光性組成物及びプリント配線板
JP5821282B2 (ja) * 2011-05-26 2015-11-24 Jsr株式会社 新規化合物、新規化合物の製造方法、新規化合物を含有する感放射線性組成物及び硬化膜
JP2012248245A (ja) * 2011-05-26 2012-12-13 Sony Corp 光ディスク装置、受光レベル補正値取得方法、プログラム
JP6003053B2 (ja) * 2011-12-14 2016-10-05 日立化成株式会社 半導体パッケージ用プリント配線板の保護膜用感光性樹脂組成物及び半導体パッケージ

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003183401A (ja) * 2001-12-20 2003-07-03 Showa Denko Kk 硬化性樹脂組成物およびその硬化物
JP2011026370A (ja) 2009-07-21 2011-02-10 Taiyo Holdings Co Ltd 光硬化性樹脂組成物
JP2012214557A (ja) 2011-03-31 2012-11-08 Taiyo Holdings Co Ltd 白色硬化性樹脂組成物及びその樹脂組成物の硬化物、並びに当該硬化物を有する反射板

Also Published As

Publication number Publication date
CN104423160B (zh) 2015-11-25
KR20150026795A (ko) 2015-03-11
CN104423160A (zh) 2015-03-18
TW201443125A (zh) 2014-11-16
JP2015064546A (ja) 2015-04-09
TWI481653B (zh) 2015-04-21
JP5507023B1 (ja) 2014-05-28

Similar Documents

Publication Publication Date Title
KR101488138B1 (ko) 감광성 수지 조성물, 드라이 필름, 경화물 및 프린트 배선판
JP5722418B1 (ja) 感光性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP6742785B2 (ja) 感光性樹脂組成物、ドライフィルムおよびプリント配線板
KR101545724B1 (ko) 광경화성 및 열경화성을 갖는 수지 조성물과, 드라이 필름 솔더 레지스트
KR20150005907A (ko) 광경화 열경화성 수지 조성물, 경화물 및 프린트 배선판
JP2017215569A (ja) 感光性樹脂組成物、ドライフィルム、およびプリント配線板の製造方法
KR101623278B1 (ko) 감광성 수지 조성물, 드라이 필름, 경화물 및 프린트 배선판
CN106200266B (zh) 固化性树脂组合物、干膜、固化物及印刷电路板
KR20180129867A (ko) 경화성 수지 조성물, 드라이 필름, 경화물 및 프린트 배선판
KR101660583B1 (ko) 감광성 수지 조성물, 드라이 필름, 경화물 및 프린트 배선판
JP2019196444A (ja) 硬化性樹脂組成物、ドライフィルム、硬化物および電子部品
CN106054522B (zh) 固化性树脂组合物、干膜、固化物和印刷电路板
JP2015106160A (ja) 感光性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP5986157B2 (ja) 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP2017179184A (ja) 硬化性樹脂組成物、ドライフィルムおよびその硬化物
JP2021042268A (ja) 硬化性樹脂組成物
JP2020125404A (ja) 硬化性樹脂組成物、ドライフィルム、硬化物及び電子部品
JP7445095B2 (ja) 感光性樹脂組成物、ドライフィルム、硬化物、およびプリント配線板
JP7339103B2 (ja) 硬化性樹脂組成物、ドライフィルム、硬化物、および、電子部品
JP6742796B2 (ja) 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP2023151272A (ja) 感光性樹脂組成物、ドライフィルム、硬化物、および、プリント配線板
WO2023190455A1 (ja) 感光性樹脂組成物、硬化物、プリント配線板およびプリント配線板の製造方法
WO2023190393A1 (ja) 硬化物およびプリント配線板
JP2024059604A (ja) 感光性樹脂組成物、ドライフィルム、硬化物、およびプリント配線板
JP2020140065A (ja) 硬化性樹脂組成物、ドライフィルム、硬化物および電子部品

Legal Events

Date Code Title Description
A201 Request for examination
A302 Request for accelerated examination
E902 Notification of reason for refusal
E902 Notification of reason for refusal
AMND Amendment
E601 Decision to refuse application
AMND Amendment
E90F Notification of reason for final refusal
AMND Amendment
X701 Decision to grant (after re-examination)
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20190916

Year of fee payment: 4