KR101653838B1 - 감광성 수지 조성물, 드라이 필름, 및 패턴 형성 방법 - Google Patents
감광성 수지 조성물, 드라이 필름, 및 패턴 형성 방법 Download PDFInfo
- Publication number
- KR101653838B1 KR101653838B1 KR1020100003078A KR20100003078A KR101653838B1 KR 101653838 B1 KR101653838 B1 KR 101653838B1 KR 1020100003078 A KR1020100003078 A KR 1020100003078A KR 20100003078 A KR20100003078 A KR 20100003078A KR 101653838 B1 KR101653838 B1 KR 101653838B1
- Authority
- KR
- South Korea
- Prior art keywords
- group
- photosensitive resin
- resin composition
- pattern
- meth
- Prior art date
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials For Photolithography (AREA)
- Epoxy Resins (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009040601A JP5210201B2 (ja) | 2009-02-24 | 2009-02-24 | 感光性樹脂組成物、ドライフィルム、及びパターン形成方法 |
JPJP-P-2009-040601 | 2009-02-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20100097007A KR20100097007A (ko) | 2010-09-02 |
KR101653838B1 true KR101653838B1 (ko) | 2016-09-02 |
Family
ID=42822369
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020100003078A KR101653838B1 (ko) | 2009-02-24 | 2010-01-13 | 감광성 수지 조성물, 드라이 필름, 및 패턴 형성 방법 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP5210201B2 (ja) |
KR (1) | KR101653838B1 (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20160130432A1 (en) * | 2013-05-24 | 2016-05-12 | Daicel Corporation | Composition for fiber-reinforced composite material, prepreg, and fiber-reinforced composite material |
US10254648B2 (en) * | 2013-08-27 | 2019-04-09 | Zeon Corportion | Radiation-sensitive resin composition, resin film, and electronic device |
JP2016114926A (ja) * | 2014-12-12 | 2016-06-23 | 三菱化学株式会社 | 感光性樹脂組成物、それで構成される硬化部材、及びそれを備えた画像表示装置 |
US10241403B2 (en) | 2015-03-26 | 2019-03-26 | Tokyo Ohka Kogyo Co., Ltd. | Negative photosensitive composition and pattern formation method |
JP6825870B2 (ja) * | 2016-10-07 | 2021-02-03 | 東京応化工業株式会社 | 感光性樹脂組成物、硬化膜、カラーフィルタ、及び硬化膜の製造方法 |
KR20200052090A (ko) * | 2018-11-06 | 2020-05-14 | 롬엔드하스전자재료코리아유한회사 | 포지티브형 감광성 수지 조성물 및 이로부터 제조된 경화막 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006251009A (ja) | 2005-03-08 | 2006-09-21 | Chisso Corp | 感光性組成物およびそれを用いた表示素子 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000227665A (ja) * | 1998-11-02 | 2000-08-15 | Kansai Paint Co Ltd | パターン形成方法 |
JP2006256033A (ja) * | 2005-03-16 | 2006-09-28 | Fuji Photo Film Co Ltd | 平版印刷版原版および製版方法 |
JP4742662B2 (ja) * | 2005-04-26 | 2011-08-10 | Jsr株式会社 | 感放射線性樹脂組成物、それから形成された突起およびスペーサー、ならびにそれらを具備する液晶表示素子 |
JP2007052120A (ja) * | 2005-08-16 | 2007-03-01 | Nec Corp | 光導波路形成用感光性樹脂組成物、光導波路及び光導波路パターンの形成方法 |
JP4789733B2 (ja) | 2006-07-21 | 2011-10-12 | 日本化薬株式会社 | 感光性樹脂組成物、その積層体、その硬化物及び該組成物を用いたパターン形成方法 |
JP4967687B2 (ja) * | 2007-01-29 | 2012-07-04 | 東レ株式会社 | 感光性シロキサン組成物、それから形成された硬化膜、および硬化膜を有する素子 |
JP4826803B2 (ja) * | 2007-03-20 | 2011-11-30 | Jsr株式会社 | 感放射線性樹脂組成物および液晶表示素子用スペーサーとその製造法 |
JP5039442B2 (ja) * | 2007-06-15 | 2012-10-03 | 東京応化工業株式会社 | 感光性樹脂組成物、感光性樹脂積層体、及びパターン形成方法 |
JP4935565B2 (ja) * | 2007-08-01 | 2012-05-23 | 住友化学株式会社 | 感光性樹脂組成物 |
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2009
- 2009-02-24 JP JP2009040601A patent/JP5210201B2/ja active Active
-
2010
- 2010-01-13 KR KR1020100003078A patent/KR101653838B1/ko active IP Right Grant
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006251009A (ja) | 2005-03-08 | 2006-09-21 | Chisso Corp | 感光性組成物およびそれを用いた表示素子 |
Also Published As
Publication number | Publication date |
---|---|
JP2010197568A (ja) | 2010-09-09 |
KR20100097007A (ko) | 2010-09-02 |
JP5210201B2 (ja) | 2013-06-12 |
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