KR101653838B1 - 감광성 수지 조성물, 드라이 필름, 및 패턴 형성 방법 - Google Patents

감광성 수지 조성물, 드라이 필름, 및 패턴 형성 방법 Download PDF

Info

Publication number
KR101653838B1
KR101653838B1 KR1020100003078A KR20100003078A KR101653838B1 KR 101653838 B1 KR101653838 B1 KR 101653838B1 KR 1020100003078 A KR1020100003078 A KR 1020100003078A KR 20100003078 A KR20100003078 A KR 20100003078A KR 101653838 B1 KR101653838 B1 KR 101653838B1
Authority
KR
South Korea
Prior art keywords
group
photosensitive resin
resin composition
pattern
meth
Prior art date
Application number
KR1020100003078A
Other languages
English (en)
Korean (ko)
Other versions
KR20100097007A (ko
Inventor
다카히로 센자키
데츠야 가토
Original Assignee
도쿄 오카 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄 오카 고교 가부시키가이샤 filed Critical 도쿄 오카 고교 가부시키가이샤
Publication of KR20100097007A publication Critical patent/KR20100097007A/ko
Application granted granted Critical
Publication of KR101653838B1 publication Critical patent/KR101653838B1/ko

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Epoxy Resins (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
KR1020100003078A 2009-02-24 2010-01-13 감광성 수지 조성물, 드라이 필름, 및 패턴 형성 방법 KR101653838B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009040601A JP5210201B2 (ja) 2009-02-24 2009-02-24 感光性樹脂組成物、ドライフィルム、及びパターン形成方法
JPJP-P-2009-040601 2009-02-24

Publications (2)

Publication Number Publication Date
KR20100097007A KR20100097007A (ko) 2010-09-02
KR101653838B1 true KR101653838B1 (ko) 2016-09-02

Family

ID=42822369

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100003078A KR101653838B1 (ko) 2009-02-24 2010-01-13 감광성 수지 조성물, 드라이 필름, 및 패턴 형성 방법

Country Status (2)

Country Link
JP (1) JP5210201B2 (ja)
KR (1) KR101653838B1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160130432A1 (en) * 2013-05-24 2016-05-12 Daicel Corporation Composition for fiber-reinforced composite material, prepreg, and fiber-reinforced composite material
US10254648B2 (en) * 2013-08-27 2019-04-09 Zeon Corportion Radiation-sensitive resin composition, resin film, and electronic device
JP2016114926A (ja) * 2014-12-12 2016-06-23 三菱化学株式会社 感光性樹脂組成物、それで構成される硬化部材、及びそれを備えた画像表示装置
US10241403B2 (en) 2015-03-26 2019-03-26 Tokyo Ohka Kogyo Co., Ltd. Negative photosensitive composition and pattern formation method
JP6825870B2 (ja) * 2016-10-07 2021-02-03 東京応化工業株式会社 感光性樹脂組成物、硬化膜、カラーフィルタ、及び硬化膜の製造方法
KR20200052090A (ko) * 2018-11-06 2020-05-14 롬엔드하스전자재료코리아유한회사 포지티브형 감광성 수지 조성물 및 이로부터 제조된 경화막

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006251009A (ja) 2005-03-08 2006-09-21 Chisso Corp 感光性組成物およびそれを用いた表示素子

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000227665A (ja) * 1998-11-02 2000-08-15 Kansai Paint Co Ltd パターン形成方法
JP2006256033A (ja) * 2005-03-16 2006-09-28 Fuji Photo Film Co Ltd 平版印刷版原版および製版方法
JP4742662B2 (ja) * 2005-04-26 2011-08-10 Ｊｓｒ株式会社 感放射線性樹脂組成物、それから形成された突起およびスペーサー、ならびにそれらを具備する液晶表示素子
JP2007052120A (ja) * 2005-08-16 2007-03-01 Nec Corp 光導波路形成用感光性樹脂組成物、光導波路及び光導波路パターンの形成方法
JP4789733B2 (ja) 2006-07-21 2011-10-12 日本化薬株式会社 感光性樹脂組成物、その積層体、その硬化物及び該組成物を用いたパターン形成方法
JP4967687B2 (ja) * 2007-01-29 2012-07-04 東レ株式会社 感光性シロキサン組成物、それから形成された硬化膜、および硬化膜を有する素子
JP4826803B2 (ja) * 2007-03-20 2011-11-30 Ｊｓｒ株式会社 感放射線性樹脂組成物および液晶表示素子用スペーサーとその製造法
JP5039442B2 (ja) * 2007-06-15 2012-10-03 東京応化工業株式会社 感光性樹脂組成物、感光性樹脂積層体、及びパターン形成方法
JP4935565B2 (ja) * 2007-08-01 2012-05-23 住友化学株式会社 感光性樹脂組成物

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006251009A (ja) 2005-03-08 2006-09-21 Chisso Corp 感光性組成物およびそれを用いた表示素子

Also Published As

Publication number Publication date
JP2010197568A (ja) 2010-09-09
KR20100097007A (ko) 2010-09-02
JP5210201B2 (ja) 2013-06-12

Similar Documents

Publication Publication Date Title
KR101653838B1 (ko) 감광성 수지 조성물, 드라이 필름, 및 패턴 형성 방법
TWI632192B (zh) 絕緣膜用感光性樹脂組成物及硬化物
JP5315106B2 (ja) アルカリ可溶性樹脂及びその製造方法、並びにアルカリ可溶性樹脂を用いた感光性樹脂組成物
JP5387894B2 (ja) 導電性転写フィルム及びそれを用いた導電性パターンの形成方法
JP4499591B2 (ja) 厚膜形成用化学増幅型ポジ型ホトレジスト組成物
JP5449666B2 (ja) アルカリ可溶性樹脂及びその製造方法、並びにアルカリ可溶性樹脂を用いた感光性樹脂組成物、硬化物及びカラーフィルター
WO2007122929A1 (ja) 感放射線性絶縁樹脂組成物
JP4578269B2 (ja) 光重合性樹脂組成物
JP4873621B2 (ja) 機能素子及びそれに用いられるネガ型感光性樹脂組成物並びに機能素子の製造方法
JP2018155802A (ja) ポジ型感光性レジストドライフィルムの製造方法及びポジ型感光性レジストドライフィルム
JP2011164516A (ja) 感光性樹脂組成物及びこれを用いた感光性エレメント
KR101666231B1 (ko) 네거티브형 감광성 수지 조성물, 감광성 드라이 필름 및 수광 장치
TWI803587B (zh) 感放射線性組合物、硬化膜及顯示元件
TW202112831A (zh) 感光性樹脂組成物、感光性樹脂薄膜、印刷線路板及半導體封裝體、以及印刷線路板的製造方法
JP6098063B2 (ja) 樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
WO2019130750A1 (ja) 転写フィルム、電極保護膜、積層体、静電容量型入力装置、及び、タッチパネルの製造方法
WO2018179259A1 (ja) 感光性樹脂組成物、それを用いたドライフィルム、プリント配線板、及び、プリント配線板の製造方法
JP4910610B2 (ja) 感光性樹脂組成物及び感光性フィルム
TW201942160A (zh) 含有不飽和基的鹼可溶性樹脂、以其作為必須成分的感光性樹脂組成物及其硬化物
WO2020027024A1 (ja) 感光性樹脂組成物、めっき方法及び金属パターンの製造方法
JP7400679B2 (ja) 感放射線性組成物、表示装置用絶縁膜、表示装置、表示装置用絶縁膜の形成方法、及び重合体
JP2011017976A (ja) 遮光性膜の形成方法
KR20240043701A (ko) 감광성 수지 조성물, 레지스트 패턴막의 제조 방법, 및 도금 조형물의 제조 방법
JP2009058582A (ja) 光硬化性樹脂組成物及びパターン形成方法
CN116789912A (zh) 硬化性树脂组合物、树脂硬化膜、半导体封装及显示装置

Legal Events

Date Code Title Description
A201 Request for examination
A302 Request for accelerated examination
E902 Notification of reason for refusal
E902 Notification of reason for refusal
E902 Notification of reason for refusal
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20190729

Year of fee payment: 4