KR101653838B1 - 감광성 수지 조성물, 드라이 필름, 및 패턴 형성 방법 - Google Patents

감광성 수지 조성물, 드라이 필름, 및 패턴 형성 방법 Download PDF

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Publication number
KR101653838B1
KR101653838B1 KR1020100003078A KR20100003078A KR101653838B1 KR 101653838 B1 KR101653838 B1 KR 101653838B1 KR 1020100003078 A KR1020100003078 A KR 1020100003078A KR 20100003078 A KR20100003078 A KR 20100003078A KR 101653838 B1 KR101653838 B1 KR 101653838B1
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KR
South Korea
Prior art keywords
group
photosensitive resin
resin composition
pattern
meth
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KR1020100003078A
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English (en)
Korean (ko)
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KR20100097007A (ko
Inventor
다카히로 센자키
데츠야 가토
Original Assignee
도쿄 오카 고교 가부시키가이샤
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Publication of KR20100097007A publication Critical patent/KR20100097007A/ko
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Publication of KR101653838B1 publication Critical patent/KR101653838B1/ko

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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0045Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/022Quinonediazides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Epoxy Resins (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
KR1020100003078A 2009-02-24 2010-01-13 감광성 수지 조성물, 드라이 필름, 및 패턴 형성 방법 KR101653838B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009040601A JP5210201B2 (ja) 2009-02-24 2009-02-24 感光性樹脂組成物、ドライフィルム、及びパターン形成方法
JPJP-P-2009-040601 2009-02-24

Publications (2)

Publication Number Publication Date
KR20100097007A KR20100097007A (ko) 2010-09-02
KR101653838B1 true KR101653838B1 (ko) 2016-09-02

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KR1020100003078A KR101653838B1 (ko) 2009-02-24 2010-01-13 감광성 수지 조성물, 드라이 필름, 및 패턴 형성 방법

Country Status (2)

Country Link
JP (1) JP5210201B2 (ja)
KR (1) KR101653838B1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160130432A1 (en) * 2013-05-24 2016-05-12 Daicel Corporation Composition for fiber-reinforced composite material, prepreg, and fiber-reinforced composite material
US10254648B2 (en) * 2013-08-27 2019-04-09 Zeon Corportion Radiation-sensitive resin composition, resin film, and electronic device
JP2016114926A (ja) * 2014-12-12 2016-06-23 三菱化学株式会社 感光性樹脂組成物、それで構成される硬化部材、及びそれを備えた画像表示装置
US10241403B2 (en) 2015-03-26 2019-03-26 Tokyo Ohka Kogyo Co., Ltd. Negative photosensitive composition and pattern formation method
JP6825870B2 (ja) * 2016-10-07 2021-02-03 東京応化工業株式会社 感光性樹脂組成物、硬化膜、カラーフィルタ、及び硬化膜の製造方法
KR20200052090A (ko) * 2018-11-06 2020-05-14 롬엔드하스전자재료코리아유한회사 포지티브형 감광성 수지 조성물 및 이로부터 제조된 경화막

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006251009A (ja) 2005-03-08 2006-09-21 Chisso Corp 感光性組成物およびそれを用いた表示素子

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JP2000227665A (ja) * 1998-11-02 2000-08-15 Kansai Paint Co Ltd パターン形成方法
JP2006256033A (ja) * 2005-03-16 2006-09-28 Fuji Photo Film Co Ltd 平版印刷版原版および製版方法
JP4742662B2 (ja) * 2005-04-26 2011-08-10 Jsr株式会社 感放射線性樹脂組成物、それから形成された突起およびスペーサー、ならびにそれらを具備する液晶表示素子
JP2007052120A (ja) * 2005-08-16 2007-03-01 Nec Corp 光導波路形成用感光性樹脂組成物、光導波路及び光導波路パターンの形成方法
JP4789733B2 (ja) 2006-07-21 2011-10-12 日本化薬株式会社 感光性樹脂組成物、その積層体、その硬化物及び該組成物を用いたパターン形成方法
JP4967687B2 (ja) * 2007-01-29 2012-07-04 東レ株式会社 感光性シロキサン組成物、それから形成された硬化膜、および硬化膜を有する素子
JP4826803B2 (ja) * 2007-03-20 2011-11-30 Jsr株式会社 感放射線性樹脂組成物および液晶表示素子用スペーサーとその製造法
JP5039442B2 (ja) * 2007-06-15 2012-10-03 東京応化工業株式会社 感光性樹脂組成物、感光性樹脂積層体、及びパターン形成方法
JP4935565B2 (ja) * 2007-08-01 2012-05-23 住友化学株式会社 感光性樹脂組成物

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006251009A (ja) 2005-03-08 2006-09-21 Chisso Corp 感光性組成物およびそれを用いた表示素子

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Publication number Publication date
JP2010197568A (ja) 2010-09-09
KR20100097007A (ko) 2010-09-02
JP5210201B2 (ja) 2013-06-12

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