KR101634803B1 - 스크라이브 장치 및 다축 스크라이브 장치 - Google Patents

스크라이브 장치 및 다축 스크라이브 장치 Download PDF

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Publication number
KR101634803B1
KR101634803B1 KR1020090032546A KR20090032546A KR101634803B1 KR 101634803 B1 KR101634803 B1 KR 101634803B1 KR 1020090032546 A KR1020090032546 A KR 1020090032546A KR 20090032546 A KR20090032546 A KR 20090032546A KR 101634803 B1 KR101634803 B1 KR 101634803B1
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KR
South Korea
Prior art keywords
scribe
shaft member
scribing
coil
tool
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KR1020090032546A
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English (en)
Korean (ko)
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KR20090110238A (ko
Inventor
다까노부 호시노
마사노리 미또
아끼오 하뉴
다까야 고노
요시아끼 시시도
Original Assignee
티에치케이 가부시끼가이샤
티에이치케이 인텍스 가부시키가이샤
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Publication of KR20090110238A publication Critical patent/KR20090110238A/ko
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Publication of KR101634803B1 publication Critical patent/KR101634803B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Linear Motors (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)
KR1020090032546A 2008-04-16 2009-04-15 스크라이브 장치 및 다축 스크라이브 장치 KR101634803B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2008107148 2008-04-16
JPJP-P-2008-107148 2008-04-16
JP2009045718A JP2009274434A (ja) 2008-04-16 2009-02-27 スクライブ装置及び多軸スクライブ装置
JPJP-P-2009-045718 2009-02-27

Publications (2)

Publication Number Publication Date
KR20090110238A KR20090110238A (ko) 2009-10-21
KR101634803B1 true KR101634803B1 (ko) 2016-06-29

Family

ID=41220863

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020090032546A KR101634803B1 (ko) 2008-04-16 2009-04-15 스크라이브 장치 및 다축 스크라이브 장치

Country Status (4)

Country Link
JP (1) JP2009274434A (ja)
KR (1) KR101634803B1 (ja)
CN (1) CN101562127B (ja)
TW (1) TWI488819B (ja)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011110681A (ja) * 2009-11-30 2011-06-09 Lintec Corp シート切断装置及び切断方法
JP5538090B2 (ja) * 2010-06-23 2014-07-02 株式会社ジャパンディスプレイ ガラスカッター
CN106877777B (zh) 2011-09-07 2019-10-15 Thk株式会社 线性电动机装置
JP5912395B2 (ja) * 2011-10-14 2016-04-27 三星ダイヤモンド工業株式会社 基板上面検出方法及びスクライブ装置
JP2013144635A (ja) * 2011-12-15 2013-07-25 Amagasaki Kosakusho:Kk 倣い制御を備えた硬質脆性板のスクライブライン形成装置及びその形成方法
JP5948077B2 (ja) * 2012-02-16 2016-07-06 Thk株式会社 プランジャユニット、位置決め装置
CN104766821A (zh) * 2014-01-02 2015-07-08 大族激光科技产业集团股份有限公司 一种裂片装置及裂片方法
JP6405717B2 (ja) * 2014-06-03 2018-10-17 三星ダイヤモンド工業株式会社 ホルダ、ホルダユニット及びスクライブ装置
DE102015120566B4 (de) * 2014-12-01 2021-12-16 Schott Ag Verfahren und Vorrichtung zum Ritzen von Dünnglas sowie angeritztes Dünnglas
JP6424652B2 (ja) * 2015-02-02 2018-11-21 三星ダイヤモンド工業株式会社 ホルダ、ホルダユニット及びスクライブ装置
KR101721125B1 (ko) * 2015-12-30 2017-04-10 주식회사 에스에프에이 기판 절단장치
TWI654148B (zh) 2018-02-14 2019-03-21 旭東機械工業股份有限公司 板材切割設備
CN109623763A (zh) * 2018-12-25 2019-04-16 亚杰科技（江苏）有限公司 一种设有弹性滚轮的中心线策划装置
JP7360263B2 (ja) * 2019-07-18 2023-10-12 Thk株式会社 アクチュエータ

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100660794B1 (ko) * 2005-12-05 2006-12-22 주식회사 탑 엔지니어링 Ｖｃｍ을 이용한 휠의 마모 측정장치 및 측정방법

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08225333A (ja) * 1995-02-21 1996-09-03 Asahi Glass Co Ltd 板ガラスの切断方法及び装置
JPH09295822A (ja) * 1996-05-07 1997-11-18 Hitachi Ltd ガラス切断装置
CN100396448C (zh) * 2003-01-15 2008-06-25 Thk株式会社 划线装置
JP2005175084A (ja) * 2003-12-09 2005-06-30 Active Inc 半導体材料を劈開・分離させるための溝加工方法並びに溝加工装置
KR20070103188A (ko) * 2006-04-18 2007-10-23 주식회사 탑 엔지니어링 기판 스크라이브 장치
KR100863438B1 (ko) * 2006-05-08 2008-10-16 주식회사 탑 엔지니어링 다축 동기 제어를 이용한 스크라이브 장치 및 그 방법

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100660794B1 (ko) * 2005-12-05 2006-12-22 주식회사 탑 엔지니어링 Ｖｃｍ을 이용한 휠의 마모 측정장치 및 측정방법

Also Published As

Publication number Publication date
JP2009274434A (ja) 2009-11-26
TW200948728A (en) 2009-12-01
CN101562127B (zh) 2013-03-20
TWI488819B (zh) 2015-06-21
KR20090110238A (ko) 2009-10-21
CN101562127A (zh) 2009-10-21

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