CN101562127B - 划线装置以及多轴划线装置 - Google Patents

划线装置以及多轴划线装置 Download PDF

Info

Publication number
CN101562127B
CN101562127B CN2009101327109A CN200910132710A CN101562127B CN 101562127 B CN101562127 B CN 101562127B CN 2009101327109 A CN2009101327109 A CN 2009101327109A CN 200910132710 A CN200910132710 A CN 200910132710A CN 101562127 B CN101562127 B CN 101562127B
Authority
CN
China
Prior art keywords
workpiece
spindle unit
chalker
scoring tool
coil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN2009101327109A
Other languages
English (en)
Chinese (zh)
Other versions
CN101562127A (zh
Inventor
星野京延
三户雅德
羽生明夫
河野贵哉
宍户善明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
THK Co Ltd
Original Assignee
THK Co Ltd
THK Intechs Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by THK Co Ltd, THK Intechs Co Ltd filed Critical THK Co Ltd
Publication of CN101562127A publication Critical patent/CN101562127A/zh
Application granted granted Critical
Publication of CN101562127B publication Critical patent/CN101562127B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Linear Motors (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)
CN2009101327109A 2008-04-16 2009-04-14 划线装置以及多轴划线装置 Active CN101562127B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2008-107148 2008-04-16
JP2008107148 2008-04-16
JP2008107148 2008-04-16
JP2009045718A JP2009274434A (ja) 2008-04-16 2009-02-27 スクライブ装置及び多軸スクライブ装置
JP2009045718 2009-02-27
JP2009-045718 2009-02-27

Publications (2)

Publication Number Publication Date
CN101562127A CN101562127A (zh) 2009-10-21
CN101562127B true CN101562127B (zh) 2013-03-20

Family

ID=41220863

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009101327109A Active CN101562127B (zh) 2008-04-16 2009-04-14 划线装置以及多轴划线装置

Country Status (4)

Country Link
JP (1) JP2009274434A (ja)
KR (1) KR101634803B1 (ja)
CN (1) CN101562127B (ja)
TW (1) TWI488819B (ja)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011110681A (ja) * 2009-11-30 2011-06-09 Lintec Corp シート切断装置及び切断方法
JP5538090B2 (ja) * 2010-06-23 2014-07-02 株式会社ジャパンディスプレイ ガラスカッター
EP2755308B1 (en) * 2011-09-07 2018-01-24 THK Co., Ltd. Linear motor device and control method
JP5912395B2 (ja) * 2011-10-14 2016-04-27 三星ダイヤモンド工業株式会社 基板上面検出方法及びスクライブ装置
JP2013144635A (ja) * 2011-12-15 2013-07-25 Amagasaki Kosakusho:Kk 倣い制御を備えた硬質脆性板のスクライブライン形成装置及びその形成方法
JP5948077B2 (ja) * 2012-02-16 2016-07-06 Thk株式会社 プランジャユニット、位置決め装置
CN104766821A (zh) * 2014-01-02 2015-07-08 大族激光科技产业集团股份有限公司 一种裂片装置及裂片方法
JP6405717B2 (ja) * 2014-06-03 2018-10-17 三星ダイヤモンド工業株式会社 ホルダ、ホルダユニット及びスクライブ装置
DE102015120566B4 (de) 2014-12-01 2021-12-16 Schott Ag Verfahren und Vorrichtung zum Ritzen von Dünnglas sowie angeritztes Dünnglas
JP6424652B2 (ja) * 2015-02-02 2018-11-21 三星ダイヤモンド工業株式会社 ホルダ、ホルダユニット及びスクライブ装置
KR101721125B1 (ko) * 2015-12-30 2017-04-10 주식회사 에스에프에이 기판 절단장치
TWI654148B (zh) 2018-02-14 2019-03-21 旭東機械工業股份有限公司 板材切割設備
CN109623763A (zh) * 2018-12-25 2019-04-16 亚杰科技（江苏）有限公司 一种设有弹性滚轮的中心线策划装置
JP7360263B2 (ja) * 2019-07-18 2023-10-12 Thk株式会社 アクチュエータ

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1517186A (zh) * 2003-01-15 2004-08-04 Thk株式会社 划线装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08225333A (ja) * 1995-02-21 1996-09-03 Asahi Glass Co Ltd 板ガラスの切断方法及び装置
JPH09295822A (ja) * 1996-05-07 1997-11-18 Hitachi Ltd ガラス切断装置
JP2005175084A (ja) * 2003-12-09 2005-06-30 Active Inc 半導体材料を劈開・分離させるための溝加工方法並びに溝加工装置
KR100660794B1 (ko) * 2005-12-05 2006-12-22 주식회사 탑 엔지니어링 Ｖｃｍ을 이용한 휠의 마모 측정장치 및 측정방법
KR20070103188A (ko) * 2006-04-18 2007-10-23 주식회사 탑 엔지니어링 기판 스크라이브 장치
KR100863438B1 (ko) * 2006-05-08 2008-10-16 주식회사 탑 엔지니어링 다축 동기 제어를 이용한 스크라이브 장치 및 그 방법

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1517186A (zh) * 2003-01-15 2004-08-04 Thk株式会社 划线装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开2003-2675A 2003.01.08

Also Published As

Publication number Publication date
JP2009274434A (ja) 2009-11-26
CN101562127A (zh) 2009-10-21
KR20090110238A (ko) 2009-10-21
TW200948728A (en) 2009-12-01
KR101634803B1 (ko) 2016-06-29
TWI488819B (zh) 2015-06-21

Similar Documents

Publication Publication Date Title
CN101562127B (zh) 划线装置以及多轴划线装置
KR101903830B1 (ko) 리니어 모터 장치 및 제어 방법
US20100044355A1 (en) Laser processing apparatus
TW201801443A (zh) 用於電能到移動裝置的移動系統中的非接觸式傳遞的裝置
JP2008093987A (ja) 型締装置
KR100851058B1 (ko) 기계장치의 평면 스테이지 이동장치
JP2008254114A (ja) 工作機械用磁気軸受スピンドル装置
JPH11287880A (ja) ステージ装置、およびこれを用いた露光装置ならびにデバイス製造方法
CN100562826C (zh) 用于定位负载的电动机系统
Yoshioka et al. Micro patterning on curved surface with a fast tool servo system for micro milling process
WO2013069156A1 (ja) レーザ加工機用ステージ装置
JP5065551B2 (ja) ガラス板切断ヘッド及びこれを具備しているガラス板加工装置
US20060119189A1 (en) Driving unit
JP4811780B2 (ja) リニアモータ、工作機械及び計測器
US7518268B2 (en) Linear stage including an integrated actuator and associated methods
JP3504637B2 (ja) 直線駆動装置
JP4543375B2 (ja) 可動コイル型リニアモータ及びその制御方法
JP2006020478A (ja) ステージ装置
JP2002355730A (ja) テーブル位置決め装置
JPH0592343A (ja) 移動案内装置
JP7158661B2 (ja) 縦型リニアアクチュエータ
JP2020195200A (ja) リニアアクチュエータおよびｘｙテーブル
US20220415562A1 (en) System and method for manufacturing a wire-wound power transmission device
JP2006034013A (ja) 工作機械用リニアモータ
US20040189234A1 (en) Uniaxial drive unit

Legal Events

Date Code Title Description
C06 Publication
C41 Transfer of patent application or patent right or utility model
PB01 Publication
TA01 Transfer of patent application right

Effective date of registration: 20090918

Address after: Tokyo, Japan

Applicant after: THK Co., Ltd.

Applicant after: THK INTELLEX CO., LTD

Address before: Tokyo, Japan

Applicant before: THK Co., Ltd.

Applicant before: Bairdicks Co., Ltd.

C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant