KR101599086B1 - 기판 위치 결정 장치, 기판 처리 장치, 기판 위치 결정 방법, 및 프로그램을 기록한 기억 매체 - Google Patents

기판 위치 결정 장치, 기판 처리 장치, 기판 위치 결정 방법, 및 프로그램을 기록한 기억 매체 Download PDF

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KR101599086B1
KR101599086B1 KR1020110032787A KR20110032787A KR101599086B1 KR 101599086 B1 KR101599086 B1 KR 101599086B1 KR 1020110032787 A KR1020110032787 A KR 1020110032787A KR 20110032787 A KR20110032787 A KR 20110032787A KR 101599086 B1 KR101599086 B1 KR 101599086B1
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substrate
positioning
unit
positioning mechanism
processed
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KR20110125166A (ko
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요시후미 아마노
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도쿄엘렉트론가부시키가이샤
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020110032787A 2010-05-12 2011-04-08 기판 위치 결정 장치, 기판 처리 장치, 기판 위치 결정 방법, 및 프로그램을 기록한 기억 매체 Active KR101599086B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2010-110366 2010-05-12
JP2010110366 2010-05-12
JPJP-P-2011-058278 2011-03-16
JP2011058278A JP5572575B2 (ja) 2010-05-12 2011-03-16 基板位置決め装置、基板処理装置、基板位置決め方法及びプログラムを記録した記憶媒体

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KR20110125166A KR20110125166A (ko) 2011-11-18
KR101599086B1 true KR101599086B1 (ko) 2016-03-14

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US (1) US9008817B2 (https=)
JP (1) JP5572575B2 (https=)
KR (1) KR101599086B1 (https=)
CN (1) CN102244026B (https=)
TW (1) TWI509728B (https=)

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JP5243491B2 (ja) * 2010-06-18 2013-07-24 東京エレクトロン株式会社 位置決め装置、基板処理装置及び基準部材の固定方法
JP5727244B2 (ja) * 2011-01-28 2015-06-03 リンテック株式会社 支持装置及び支持方法
JP5996381B2 (ja) * 2011-12-28 2016-09-21 東京エレクトロン株式会社 基板処理装置および基板処理方法
JP5835188B2 (ja) * 2012-11-06 2015-12-24 東京エレクトロン株式会社 基板周縁部の塗布膜除去方法、基板処理装置及び記憶媒体
CN103594406B (zh) * 2013-11-05 2016-08-24 中国电子科技集团公司第四十五研究所 自定心定位卡盘及半导体晶圆的定心定位方法
TWI668795B (zh) * 2014-09-15 2019-08-11 美商瓦里安半導體設備公司 半導體製程用的主動式基板對準系統及對準基板的方法
US20180015614A1 (en) * 2015-02-04 2018-01-18 Kawasaki Jukogyo Kabushiki Kaisha Robot shakes automatically adjusting device and method of automatically adjusting shakes of robot
JP6612670B2 (ja) * 2016-03-31 2019-11-27 東京応化工業株式会社 基板処理装置、及び、基板処理方法
CN108242417B (zh) * 2016-12-26 2020-10-16 北京北方华创微电子装备有限公司 一种手动输送硅片机构
JP6920849B2 (ja) * 2017-03-27 2021-08-18 株式会社荏原製作所 基板処理方法および装置
JP6847770B2 (ja) 2017-05-31 2021-03-24 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
CN111217149B (zh) * 2018-11-23 2024-08-27 合肥欣奕华智能机器股份有限公司 一种基板校准装置、基板校准方法及基板搬运装置
US12486574B2 (en) 2019-08-23 2025-12-02 Lam Research Corporation Thermally controlled chandelier showerhead
JP7426808B2 (ja) 2019-11-27 2024-02-02 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
CN114929935A (zh) * 2020-01-06 2022-08-19 朗姆研究公司 带有内部轮廓的面板的喷头
JP2022048506A (ja) * 2020-09-15 2022-03-28 株式会社ダイヘン アライナ装置
CN113634401A (zh) * 2021-09-08 2021-11-12 江苏科环新材料有限公司 一种纳米金属涂层加工装置
CN114446848B (zh) * 2021-12-28 2025-06-24 苏州精濑光电有限公司 一种料盒的辅助定位机构
JP7813152B2 (ja) 2022-02-07 2026-02-12 株式会社Ｓｃｒｅｅｎホールディングス センタリング装置、センタリング方法および基板処理装置
KR102775356B1 (ko) * 2022-12-21 2025-03-06 세메스 주식회사 편심 보정 유닛을 포함한 기판 처리 장치 및 기판 처리 방법
WO2025083774A1 (ja) * 2023-10-17 2025-04-24 株式会社Fukumura エジェクタ及びこれを用いた熱分解炭化処理装置
JP7801827B1 (ja) * 2025-09-08 2026-01-19 株式会社オプトラン アライメント装置及びアライメント方法

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Also Published As

Publication number Publication date
JP2011258924A (ja) 2011-12-22
US9008817B2 (en) 2015-04-14
CN102244026A (zh) 2011-11-16
TW201205712A (en) 2012-02-01
US20110282484A1 (en) 2011-11-17
KR20110125166A (ko) 2011-11-18
CN102244026B (zh) 2016-04-20
TWI509728B (zh) 2015-11-21
JP5572575B2 (ja) 2014-08-13

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