KR101586599B1 - 구리-폴리이미드 적층체, 입체 성형체 및 입체 성형체의 제조 방법 - Google Patents

구리-폴리이미드 적층체, 입체 성형체 및 입체 성형체의 제조 방법 Download PDF

Info

Publication number
KR101586599B1
KR101586599B1 KR1020147018245A KR20147018245A KR101586599B1 KR 101586599 B1 KR101586599 B1 KR 101586599B1 KR 1020147018245 A KR1020147018245 A KR 1020147018245A KR 20147018245 A KR20147018245 A KR 20147018245A KR 101586599 B1 KR101586599 B1 KR 101586599B1
Authority
KR
South Korea
Prior art keywords
copper foil
copper
polyimide film
thermoplastic polyimide
glass transition
Prior art date
Application number
KR1020147018245A
Other languages
English (en)
Korean (ko)
Other versions
KR20140099533A (ko
Inventor
도시유키 오노
가즈키 감무리
히데아키 마치다
히토시 구리바라
Original Assignee
제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤
듀폰 도레이 컴파니, 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤, 듀폰 도레이 컴파니, 리미티드 filed Critical 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤
Publication of KR20140099533A publication Critical patent/KR20140099533A/ko
Application granted granted Critical
Publication of KR101586599B1 publication Critical patent/KR101586599B1/ko

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
KR1020147018245A 2012-01-17 2012-07-24 구리-폴리이미드 적층체, 입체 성형체 및 입체 성형체의 제조 방법 KR101586599B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012007233A JP5774505B2 (ja) 2012-01-17 2012-01-17 銅−ポリイミド積層体、立体成型体、及び立体成型体の製造方法
JPJP-P-2012-007233 2012-01-17
PCT/JP2012/068644 WO2013108431A1 (ja) 2012-01-17 2012-07-24 銅-ポリイミド積層体、立体成型体、及び立体成型体の製造方法

Publications (2)

Publication Number Publication Date
KR20140099533A KR20140099533A (ko) 2014-08-12
KR101586599B1 true KR101586599B1 (ko) 2016-01-18

Family

ID=48798869

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020147018245A KR101586599B1 (ko) 2012-01-17 2012-07-24 구리-폴리이미드 적층체, 입체 성형체 및 입체 성형체의 제조 방법

Country Status (5)

Country Link
JP (1) JP5774505B2 (ja)
KR (1) KR101586599B1 (ja)
CN (1) CN104010811B (ja)
TW (1) TWI436885B (ja)
WO (1) WO2013108431A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016208006A1 (ja) 2015-06-24 2016-12-29 株式会社メイコー 立体配線基板の製造方法、立体配線基板、立体配線基板用基材
JP6491556B2 (ja) * 2015-07-09 2019-03-27 日東電工株式会社 配線回路基板
JP6484133B2 (ja) * 2015-07-09 2019-03-13 日東電工株式会社 配線回路基板の製造方法
CN109757023B (zh) * 2017-11-08 2022-04-26 广东生益科技股份有限公司 印刷线路板及其制作方法
JP7045172B2 (ja) * 2017-11-28 2022-03-31 藤森工業株式会社 カバーレイフィルムおよびそれを用いた電子機器

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000212661A (ja) 1998-11-17 2000-08-02 Nippon Mining & Metals Co Ltd フレキシブルプリント回路基板用圧延銅箔およびその製造方法
JP2002240195A (ja) 2001-02-19 2002-08-28 Ube Ind Ltd ポリイミド銅張板
JP2005340184A (ja) 2004-04-30 2005-12-08 Du Pont Toray Co Ltd Ｌｅｄ照明装置
JP2007005003A (ja) 2005-06-21 2007-01-11 Du Pont Toray Co Ltd Ｌｅｄ照明装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04251343A (ja) 1991-01-09 1992-09-07 Nec Corp エラー情報処理回路
JP4147639B2 (ja) * 1998-09-29 2008-09-10 宇部興産株式会社 フレキシブル金属箔積層体
JP4422839B2 (ja) * 2000-01-13 2010-02-24 東レ・デュポン株式会社 開放型ポリイミド成形品の製造方法
JP2003151328A (ja) * 2001-11-15 2003-05-23 Du Pont Toray Co Ltd 照明用反射装置
JP2008144049A (ja) * 2006-12-11 2008-06-26 Du Pont Toray Co Ltd 成形用ポリイミドフィルム、その製造方法並びに成形品
JP5196342B2 (ja) 2007-05-24 2013-05-15 東レ・デュポン株式会社 ポリイミドフィルムおよび成形体
JP5185066B2 (ja) * 2008-10-23 2013-04-17 Ｊｘ日鉱日石金属株式会社 屈曲性に優れた銅箔、その製造方法及びフレキシブル銅貼積層板
CN102009515B (zh) * 2010-07-21 2013-01-02 广东生益科技股份有限公司 二层法双面挠性覆铜板的制作方法及该二层法双面挠性覆铜板

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000212661A (ja) 1998-11-17 2000-08-02 Nippon Mining & Metals Co Ltd フレキシブルプリント回路基板用圧延銅箔およびその製造方法
JP2002240195A (ja) 2001-02-19 2002-08-28 Ube Ind Ltd ポリイミド銅張板
JP2005340184A (ja) 2004-04-30 2005-12-08 Du Pont Toray Co Ltd Ｌｅｄ照明装置
JP2007005003A (ja) 2005-06-21 2007-01-11 Du Pont Toray Co Ltd Ｌｅｄ照明装置

Also Published As

Publication number Publication date
CN104010811B (zh) 2016-01-06
JP2013146870A (ja) 2013-08-01
KR20140099533A (ko) 2014-08-12
JP5774505B2 (ja) 2015-09-09
WO2013108431A1 (ja) 2013-07-25
TWI436885B (zh) 2014-05-11
CN104010811A (zh) 2014-08-27
TW201331023A (zh) 2013-08-01

Similar Documents

Publication Publication Date Title
US10077337B2 (en) Polyimide, resin film, and metal-clad laminate
JP5180814B2 (ja) フレキシブル配線基板用積層体
KR101586599B1 (ko) 구리-폴리이미드 적층체, 입체 성형체 및 입체 성형체의 제조 방법
KR101009128B1 (ko) 플렉시블 동장 적층판 및 그 제조방법
JP4907580B2 (ja) フレキシブル銅張積層板
KR101333808B1 (ko) 배선기판용 적층체
JP6793232B2 (ja) リジッドフレキシブル基板
JP5095142B2 (ja) フレキシブルプリント配線板用基板及びその製造方法
JP2008091463A (ja) 両面フレキシブル銅張積層基板及びキャリア付両面フレキシブル銅張積層基板の製造方法
JP2010116443A (ja) 接着フィルムならびにフレキシブル金属張積層板
KR100728150B1 (ko) 본딩 시트 및 한면 금속 클래드 적층판
JP6948418B2 (ja) フレキシブル金属張積層板の製造方法
JP5567283B2 (ja) ポリイミドフィルム
JP2008258559A (ja) 配線基板用積層体
JP4231511B2 (ja) ポリイミドフィルム、ポリイミド金属積層体及びその製造方法
JP6936639B2 (ja) 積層体、フレキシブル金属張積層板、およびフレキシブルプリント回路基板
CN107428146B (zh) 聚酰亚胺层叠膜、聚酰亚胺层叠膜的制造方法、热塑性聚酰亚胺的制造方法、以及柔性金属包覆层叠体的制造方法
JP4304459B2 (ja) 金属薄膜付きポリイミドフィルム
JP2007189011A (ja) フレキシブルプリント配線板用基板及びその製造方法
KR101546393B1 (ko) 플렉시블 금속장 적층판 및 그 제조 방법
JP5063257B2 (ja) 金属積層フィルムの製造方法および金属積層フィルム
JP5844853B2 (ja) ポリイミドフィルム
JP2007254530A (ja) 積層接着シート、金属層付き積層接着シートおよび回路基板
JP2006321228A (ja) 金属積層体及びその製造方法と用途
JP2009242676A (ja) ポリイミドフィルムの製造方法

Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20181226

Year of fee payment: 4

FPAY Annual fee payment

Payment date: 20191217

Year of fee payment: 5