KR101529799B1 - 경화성 수지 조성물, 그의 드라이 필름 및 경화물, 및 이들을 이용한 인쇄 배선판 - Google Patents

경화성 수지 조성물, 그의 드라이 필름 및 경화물, 및 이들을 이용한 인쇄 배선판 Download PDF

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KR101529799B1
KR101529799B1 KR1020137008024A KR20137008024A KR101529799B1 KR 101529799 B1 KR101529799 B1 KR 101529799B1 KR 1020137008024 A KR1020137008024 A KR 1020137008024A KR 20137008024 A KR20137008024 A KR 20137008024A KR 101529799 B1 KR101529799 B1 KR 101529799B1
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South Korea
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resin composition
curable resin
compound
manufactured
group
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KR1020137008024A
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English (en)
Korean (ko)
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KR20130048792A (ko
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다이찌 오까모또
마사오 아리마
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다이요 홀딩스 가부시키가이샤
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D167/00—Coating compositions based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Coating compositions based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • C08F299/04—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polyesters
    • C08F299/0485—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polyesters from polyesters with side or terminal unsaturations
    • C08F299/0492—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polyesters from polyesters with side or terminal unsaturations the unsaturation being in acrylic or methacrylic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/06—Unsaturated polyesters
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Materials For Photolithography (AREA)
  • Ceramic Engineering (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020137008024A 2010-08-30 2011-07-28 경화성 수지 조성물, 그의 드라이 필름 및 경화물, 및 이들을 이용한 인쇄 배선판 KR101529799B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010192193A JP5734604B2 (ja) 2010-08-30 2010-08-30 硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JPJP-P-2010-192193 2010-08-30
PCT/JP2011/067293 WO2012029468A1 (ja) 2010-08-30 2011-07-28 硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板

Publications (2)

Publication Number Publication Date
KR20130048792A KR20130048792A (ko) 2013-05-10
KR101529799B1 true KR101529799B1 (ko) 2015-06-17

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KR1020137008024A KR101529799B1 (ko) 2010-08-30 2011-07-28 경화성 수지 조성물, 그의 드라이 필름 및 경화물, 및 이들을 이용한 인쇄 배선판

Country Status (4)

Country Link
JP (1) JP5734604B2 (ja)
KR (1) KR101529799B1 (ja)
CN (1) CN103080236B (ja)
WO (1) WO2012029468A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11402754B2 (en) 2016-11-18 2022-08-02 Arisawa Mfg. Co., Ltd. Photosensitive resin composition, solder resist film using said photosensitive resin composition, flexible printed wiring board, and image display device
KR102319223B1 (ko) * 2017-02-07 2021-11-01 가부시키가이샤 아리사와 세이사쿠쇼 감광성 수지 조성물, 해당 감광성 수지 조성물을 사용한 솔더 레지스트 필름, 플렉시블 프린트 배선판 및 화상 표시 장치
KR102444761B1 (ko) * 2017-02-07 2022-09-20 가부시키가이샤 아리사와 세이사쿠쇼 감광성 수지 조성물, 해당 감광성 수지 조성물을 사용한 솔더 레지스트 필름, 플렉시블 프린트 배선판 및 화상 표시 장치
JP6329334B1 (ja) * 2017-02-07 2018-05-23 株式会社有沢製作所 感光性樹脂組成物、該感光性樹脂組成物を用いたソルダーレジストフィルム、フレキシブルプリント配線板及び画像表示装置
JP7316551B2 (ja) * 2018-08-09 2023-07-28 三菱瓦斯化学株式会社 プリント配線板用樹脂組成物、プリプレグ、積層板、金属箔張積層板、プリント配線板及び多層プリント配線板
WO2021053774A1 (ja) * 2019-09-18 2021-03-25 太陽ホールディングス株式会社 硬化性組成物、ドライフィルム、硬化物、および電子部品

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06279662A (ja) * 1993-03-29 1994-10-04 Dainippon Ink & Chem Inc 熱可塑性難燃ポリエステル樹脂組成物
JP2004012810A (ja) * 2002-06-06 2004-01-15 Showa Denko Kk 硬化性難燃組成物、その硬化物及びその製造方法
JP2006233148A (ja) * 2005-02-28 2006-09-07 Wakayama Prefecture ポリエステルマクロモノマーおよびその製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4258687B2 (ja) * 1998-11-30 2009-04-30 日立化成工業株式会社 感光性樹脂組成物
EP1072624A3 (en) * 1999-07-28 2001-02-07 Dainippon Ink And Chemicals, Inc. Process for producing unsaturated polyester and unsaturated polyester resin composition
JP2002060632A (ja) * 2000-08-16 2002-02-26 Sakai Chem Ind Co Ltd 熱硬化性樹脂組成物
JP2002080706A (ja) * 2000-09-07 2002-03-19 Sakai Chem Ind Co Ltd 不飽和ポリエステル性樹脂組成物
JP2002293910A (ja) * 2001-03-28 2002-10-09 Mitsui Chemicals Inc アミド基含有芳香族ポリエステルポリオールおよびその製造方法
JP3965025B2 (ja) * 2001-05-02 2007-08-22 和歌山県 ポリエステルマクロモノマーの製造方法
JP4738830B2 (ja) * 2005-02-09 2011-08-03 三井化学株式会社 ポリエステル樹脂組成物
KR20090038883A (ko) * 2006-07-28 2009-04-21 데이진 가부시키가이샤 수지 조성물, 그 제조 방법 및 성형품
JP5183540B2 (ja) * 2009-03-23 2013-04-17 太陽ホールディングス株式会社 硬化性樹脂組成物、それを用いたドライフィルム及びプリント配線板
JP5349113B2 (ja) * 2009-03-30 2013-11-20 太陽ホールディングス株式会社 感光性樹脂組成物、それを用いたドライフィルム及びプリント配線板
JP5748941B2 (ja) * 2009-04-14 2015-07-15 太陽ホールディングス株式会社 感光性化合物及びそれを含有する光硬化性樹脂組成物
JP5662650B2 (ja) * 2009-04-14 2015-02-04 太陽ホールディングス株式会社 ポリオール化合物及びそれを含有する熱硬化性組成物
JP5567290B2 (ja) * 2009-05-12 2014-08-06 太陽ホールディングス株式会社 感光性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JP5620656B2 (ja) * 2009-08-19 2014-11-05 太陽ホールディングス株式会社 光硬化性樹脂組成物
JP5575436B2 (ja) * 2009-09-01 2014-08-20 太陽ホールディングス株式会社 アルカリ現像性の光硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06279662A (ja) * 1993-03-29 1994-10-04 Dainippon Ink & Chem Inc 熱可塑性難燃ポリエステル樹脂組成物
JP2004012810A (ja) * 2002-06-06 2004-01-15 Showa Denko Kk 硬化性難燃組成物、その硬化物及びその製造方法
JP2006233148A (ja) * 2005-02-28 2006-09-07 Wakayama Prefecture ポリエステルマクロモノマーおよびその製造方法

Also Published As

Publication number Publication date
JP2012046691A (ja) 2012-03-08
JP5734604B2 (ja) 2015-06-17
KR20130048792A (ko) 2013-05-10
CN103080236B (zh) 2015-09-30
WO2012029468A1 (ja) 2012-03-08
CN103080236A (zh) 2013-05-01

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