KR101506205B1 - 수지-선형 유기실록산 블록 공중합체 - Google Patents

수지-선형 유기실록산 블록 공중합체 Download PDF

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KR101506205B1
KR101506205B1 KR1020137010239A KR20137010239A KR101506205B1 KR 101506205 B1 KR101506205 B1 KR 101506205B1 KR 1020137010239 A KR1020137010239 A KR 1020137010239A KR 20137010239 A KR20137010239 A KR 20137010239A KR 101506205 B1 KR101506205 B1 KR 101506205B1
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organosiloxane
block copolymer
sio
mol
resin
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KR20130140681A (ko
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스티븐 스웨어
존 버나드 호스트맨
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다우 코닝 코포레이션
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/10—Block or graft copolymers containing polysiloxane sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/26—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen nitrogen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42—Block-or graft-polymers containing polysiloxane sequences
    • C08G77/44—Block-or graft-polymers containing polysiloxane sequences containing only polysiloxane sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/485—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms containing less than 25 silicon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/54—Nitrogen-containing linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wood Science & Technology (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Silicon Polymers (AREA)
  • Paints Or Removers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020137010239A 2010-09-22 2011-09-21 수지-선형 유기실록산 블록 공중합체 Active KR101506205B1 (ko)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US38544610P 2010-09-22 2010-09-22
US61/385,446 2010-09-22
US201161537151P 2011-09-21 2011-09-21
US201161537146P 2011-09-21 2011-09-21
US61/537,146 2011-09-21
PCT/US2011/052518 WO2012040305A1 (en) 2010-09-22 2011-09-21 Resin-linear organosiloxane block copolymers
US61/537,151 2011-09-21

Publications (2)

Publication Number Publication Date
KR20130140681A KR20130140681A (ko) 2013-12-24
KR101506205B1 true KR101506205B1 (ko) 2015-03-27

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KR1020137010243A Active KR101807190B1 (ko) 2010-09-22 2011-09-21 수지-선형 유기실록산 블록 공중합체의 제조 방법

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US (2) US8957147B2 (enExample)
EP (2) EP2619246B1 (enExample)
JP (2) JP5662580B2 (enExample)
KR (2) KR101506205B1 (enExample)
CN (2) CN103201318B (enExample)
WO (2) WO2012040305A1 (enExample)

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012040367A1 (en) 2010-09-22 2012-03-29 Dow Corning Corporation Organosiloxane block copolymer
WO2012040453A1 (en) 2010-09-22 2012-03-29 Dow Corning Corporation Thermally stable compositions containing resin-linear organosiloxane block copolymers
KR101506205B1 (ko) 2010-09-22 2015-03-27 다우 코닝 코포레이션 수지-선형 유기실록산 블록 공중합체
KR101477609B1 (ko) 2010-09-22 2014-12-31 다우 코닝 코포레이션 수지-선형 유기실록산 블록 공중합체를 함유하는 고굴절률 조성물
KR20140003510A (ko) 2011-02-04 2014-01-09 다우 코닝 코포레이션 경화성 유기실록산 블록 공중합체 에멀젼
US9006356B2 (en) 2011-12-02 2015-04-14 Dow Corning Corporation Curable compositions of resin-linear organosiloxane block copolymers
EP2791263B1 (en) 2011-12-14 2016-08-31 Dow Corning Corporation Curable compositions of resin-linear organosiloxane block copolymers
WO2013101674A1 (en) 2011-12-30 2013-07-04 Dow Corning Corporation Solid state light and method of forming
JP6309898B2 (ja) 2012-01-16 2018-04-11 ダウ シリコーンズ コーポレーション 光学物品及び形成方法
US20130200425A1 (en) * 2012-02-03 2013-08-08 Shin-Etsu Chemical Co., Ltd Phosphor-containing adhesive silicone composition sheet, and method of producing light-emitting device using same
KR102001403B1 (ko) 2012-02-09 2019-07-18 다우 코닝 도레이 캄파니 리미티드 구배 중합체 구조물 및 방법
WO2013130574A1 (en) 2012-02-29 2013-09-06 Dow Corning Corporation Compositions of resin-linear organosiloxane block copolymers
JP6218757B2 (ja) 2012-03-09 2017-10-25 ダウ コーニング コーポレーションＤｏｗ Ｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ 樹脂−直鎖状オルガノシロキサンブロックコポリマーの組成物
US9006358B2 (en) * 2012-03-12 2015-04-14 Dow Corning Corporation Compositions of resin-linear organosiloxane block copolymers
EP2828691A2 (en) * 2012-03-20 2015-01-28 Dow Corning Corporation Light guide and associated light assemblies
WO2013154718A1 (en) 2012-03-21 2013-10-17 Dow Corning Corporation Compositions comprising resin- linear organosiloxane block copolymers and organopolysiloxanes
WO2013142252A1 (en) 2012-03-21 2013-09-26 Dow Corning Corporation Compositions of resin-linear organosiloxane block copolymers
US9076934B2 (en) * 2012-03-21 2015-07-07 Dow Corning Corporation Process for preparing resin-linear organosiloxane block copolymers
CN104271641B (zh) * 2012-03-21 2016-11-02 道康宁公司 树脂-线性有机硅氧烷嵌段共聚物的组合物
WO2014100652A1 (en) 2012-12-21 2014-06-26 Dow Corning Corporation Layered polymer structures and methods
WO2014105963A2 (en) 2012-12-28 2014-07-03 Dow Corning Corporation Curable organopolysiloxane composition for transducers and applications of such curable silicone composition for transducers
EP2970695A2 (en) * 2013-03-15 2016-01-20 Dow Corning Corporation Powdered resin linear organopolysiloxane compositions
KR20150132380A (ko) * 2013-03-15 2015-11-25 다우 코닝 코포레이션 수지-선형 유기실록산 블록 공중합체의 조성물
WO2014197617A1 (en) 2013-06-05 2014-12-11 Dow Corning Corporation Compositions of resin-linear organosiloxane block copolymers
KR102335293B1 (ko) * 2013-09-18 2021-12-06 다우 실리콘즈 코포레이션 수지-선형 유기실록산 블록 공중합체의 조성물
JP2017533337A (ja) * 2014-09-23 2017-11-09 ダウ コーニング コーポレーションＤｏｗ Ｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ 接着剤組成物及びその使用
TWI688609B (zh) 2014-11-13 2020-03-21 美商道康寧公司 含硫聚有機矽氧烷組成物及相關態樣
EP3275955B1 (en) * 2015-02-26 2020-05-27 Dow Toray Co., Ltd. Electric/electronic part and bonding method
JP6717928B2 (ja) * 2015-07-27 2020-07-08 ダウ シリコーンズ コーポレーション 金属−含窒素複素環式カルベン縮合反応触媒を用いたポリオルガノシロキサン組成物及びその調製方法
TWI678551B (zh) 2015-07-28 2019-12-01 美商道康寧公司 智慧型光學材料、配方、方法、用途、物品、及裝置
JP7110105B2 (ja) 2016-02-10 2022-08-01 コーニンクレッカ フィリップス エヌ ヴェ Ｌｅｄ用途におけるシロキサン樹脂の気相硬化触媒及び不動態化
CN108699389B (zh) * 2016-02-24 2020-10-27 日产化学株式会社 含有硅的图案反转用被覆剂
JP6574147B2 (ja) * 2016-07-08 2019-09-11 信越化学工業株式会社 硬化性有機ケイ素樹脂組成物
JP2019529596A (ja) * 2016-07-28 2019-10-17 スリーエム イノベイティブ プロパティズ カンパニー セグメント化シリコーンポリアミドブロックコポリマー及びそれを含む物品
US20190233594A1 (en) * 2016-10-04 2019-08-01 Dow Silicones Corporation Silicone resin-linear copolymer and related methods
US10874604B2 (en) * 2016-10-04 2020-12-29 Dow Toray Co., Ltd. Cosmetic composition or external composition, and cosmetic raw material composition
JP7249954B2 (ja) * 2017-05-05 2023-03-31 ダウ シリコーンズ コーポレーション ヒドロシリル化硬化性シリコーン樹脂
CN110651016B (zh) * 2017-05-17 2022-06-24 株式会社大赛璐 粘接剂组合物、固化物、叠层体以及装置
TWI859121B (zh) 2017-07-27 2024-10-21 美商杜邦電子材料國際有限責任公司 光電裝置及其製造方法、以及其用途
US11015082B2 (en) * 2017-12-19 2021-05-25 Honeywell International Inc. Crack-resistant polysiloxane dielectric planarizing compositions, methods and films
WO2019177689A1 (en) 2018-03-16 2019-09-19 Dow Silicones Corporation Curable polysiloxane composition
TWI794401B (zh) 2018-03-21 2023-03-01 美商陶氏有機矽公司 可室溫固化有機聚矽氧烷組成物及電氣/電子設備
KR102587408B1 (ko) 2018-08-24 2023-10-10 와커 헤미 아게 분지형 유기폴리실록산의 제조 방법
EP4011992A1 (de) 2020-12-09 2022-06-15 Evonik Operations GmbH Härtbare kondensationsverbindungen auf basis von alkoxyfunktionellen polysiloxanen
CA3180684A1 (en) 2021-11-25 2023-05-25 Evonik Operations Gmbh Curable condensation compounds based on alkoxy-functional polysiloxanes
CN115716900B (zh) * 2022-03-21 2025-02-07 天津大学 一种基于硅醚键的高性能聚硅氧烷弹性体及其制备方法
WO2025170712A1 (en) 2024-02-07 2025-08-14 Dow Silicones Corporation Epoxy-functional resin-linear polyorganosiloxane copolymer, composition containing the copolymer, and methods for their preparation and use
WO2025178717A1 (en) 2024-02-20 2025-08-28 Dow Silicones Corporation Alkenyl ester – functional resin – linear polyorganosiloxane block copolymer, composition containing the copolymer, and methods for their preparation and use

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05271400A (ja) * 1992-01-29 1993-10-19 Daicel Chem Ind Ltd 分岐状ポリカーボネート及びその製造法
KR20070004587A (ko) * 2003-12-23 2007-01-09 게에 바이엘 실리콘스 게엠베하 운트 코. 카게 개질된 표면 특성을 갖는 경화성 실록산 조성물
KR20080000538A (ko) * 2006-06-27 2008-01-02 에어 프로덕츠 앤드 케미칼스, 인코오포레이티드 환원 분위기 하에서 유전 필름을 경화시키는 방법
KR20090106485A (ko) * 2006-11-22 2009-10-09 다우 코닝 코포레이션 시멘트질 재료

Family Cites Families (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3294737A (en) * 1963-12-23 1966-12-27 Gen Electric Organopolysiloxanes
US3294718A (en) 1964-04-20 1966-12-27 Dow Corning Method for preparing block copolymers
US3328481A (en) * 1964-04-20 1967-06-27 Dow Corning Organosilicon resins
US3308203A (en) 1964-06-24 1967-03-07 Dow Corning Polysiloxane block copolymer rubber and process for making same
US3436439A (en) 1965-08-13 1969-04-01 Dow Corning Preparation of siloxane block copolymers
US3440262A (en) * 1965-08-23 1969-04-22 Dow Corning Fluid aromatic siloxane block copolymers
US3619229A (en) * 1968-09-05 1971-11-09 Dow Corning Reinforced polystyrene and its copolymers
JPS4842720B1 (enExample) * 1969-02-21 1973-12-14
US3632793A (en) 1969-02-25 1972-01-04 Dow Corning Acetoxy functional copolymers composed of monomethylsiloxane units and diphenylsiloxane units
BE759623A (fr) * 1969-12-01 1971-06-01 Dow Corning Copolymeres sequences vulcanisables a la temperature ambiante comprenant des mailles acetoxy-siloxanes de blocage terminal
BE759621A (fr) * 1969-12-01 1971-06-01 Dow Corning Copolymeres sequences d'organosiloxanes non corrosifs, vulcanisables a la temperature ambiante
BE759618A (fr) * 1969-12-01 1971-06-01 Dow Corning Procede pour promouvoir la reaction entre un radical hydroxyle lie au silicium et un radical alcoxy lie au silicium
BE759619A (fr) * 1969-12-01 1971-06-01 Dow Corning Copolymeres sequences d'organosiloxanes a fonctionnalite cetoxime, vulcanisables a la temperature ambiante et resistant a l'arc
BE759624A (fr) * 1969-12-01 1971-06-01 Dow Corning Caoutchouc de silicone resistant aux salissures et sa fabrication
US3670649A (en) * 1970-08-13 1972-06-20 Dow Corning Combustible cartridges
JPS5950182B2 (ja) 1977-12-16 1984-12-06 ジェイエスアール株式会社 シリコ−ン樹脂の組成物
JPS56827A (en) * 1979-06-15 1981-01-07 Japan Synthetic Rubber Co Ltd Production of block copolymer
DE3003116A1 (de) 1980-01-29 1981-08-06 Wacker-Chemie GmbH, 8000 München Verfahren zur herstellung von organosiloxanblockmischpolymerisat
US4340709A (en) 1980-07-16 1982-07-20 General Electric Company Addition curing silicone compositions
US4419402A (en) * 1982-02-16 1983-12-06 Dow Corning Corporation Flame retardant polyorganopolysiloxane resin compositions
US4443502A (en) * 1983-04-12 1984-04-17 Dow Corning Corporation Liquid organosiloxane resin compositions
US4508887A (en) * 1983-08-01 1985-04-02 Dow Corning Corporation Method and novel catalyst compositions for preparing polyorganosiloxanes
US4585670A (en) 1985-01-03 1986-04-29 General Electric Company UV curable silicone block copolymers
US4766023A (en) 1987-01-16 1988-08-23 Minnesota Mining And Manufacturing Company Method for making a flexible louvered plastic film with protective coatings and film produced thereby
US5145933A (en) 1987-12-18 1992-09-08 Dow Corning France S.A. Organosiloxane gel-forming compositions and use thereof
US5075103A (en) 1990-07-06 1991-12-24 Dow Corning Corporation Hair fixatives comprising nonpolar silsesquioxanes
JP3445831B2 (ja) 1994-06-28 2003-09-08 ジーイー東芝シリコーン株式会社 シリコーン樹脂組成物
DE69620575T2 (de) * 1995-08-15 2002-10-31 Dow Corning Asia, Ltd. Härtbare polymethylsilsesquioxanzusammensetzung
US5830950A (en) 1996-12-31 1998-11-03 Dow Corning Corporation Method of making rubber-modified rigid silicone resins and composites produced therefrom
JP3635180B2 (ja) 1997-02-24 2005-04-06 ダウ コーニング アジア株式会社 シリル化ポリメチルシルセスキオキサン、その製造方法、それを用いた組成物
JP4408458B2 (ja) * 1997-06-30 2010-02-03 ダウ コ−ニング コ−ポレ−ション 硬化性シリコーンレジン及び硬化物の各製造方法
US6020409A (en) 1997-09-19 2000-02-01 Dow Corning Corporation Routes to dielectric gel for protection of electronic modules
US6803409B2 (en) 2002-05-29 2004-10-12 John Robert Keryk Organopolysiloxane copolymer and method of preparing
US6842577B2 (en) * 2002-12-02 2005-01-11 Shipley Company L.L.C. Photoimageable waveguide composition and waveguide formed therefrom
JP4742216B2 (ja) 2004-07-08 2011-08-10 Ｊｎｃ株式会社 ケイ素化合物
JP2006206721A (ja) 2005-01-27 2006-08-10 Kansai Electric Power Co Inc:The 高耐熱合成高分子化合物及びこれで被覆した高耐電圧半導体装置
US7312008B2 (en) * 2005-02-10 2007-12-25 Xerox Corporation High-performance surface layer for photoreceptors
JP5586820B2 (ja) * 2006-07-21 2014-09-10 東京応化工業株式会社 高屈折率材料
EP2255394A2 (en) 2008-03-14 2010-12-01 Dow Corning Corporation Photovoltaic cell module and method of forming same
JP2010100667A (ja) * 2008-10-21 2010-05-06 Shin-Etsu Chemical Co Ltd 縮合硬化性オルガノポリシロキサン組成物
WO2010051355A2 (en) 2008-10-31 2010-05-06 Dow Corning Corporation Photovoltaic cell module and method of forming
JP5610379B2 (ja) * 2008-11-12 2014-10-22 Jnc株式会社 シロキサンポリマー、シロキサン系の架橋性組成物及びシリコーン膜
US8222352B2 (en) 2008-12-24 2012-07-17 Nitto Denko Corporation Silicone resin composition
JP2011190413A (ja) * 2010-03-16 2011-09-29 Kumamoto Univ シロキサンポリマー架橋硬化物
KR101506205B1 (ko) 2010-09-22 2015-03-27 다우 코닝 코포레이션 수지-선형 유기실록산 블록 공중합체
WO2012040453A1 (en) 2010-09-22 2012-03-29 Dow Corning Corporation Thermally stable compositions containing resin-linear organosiloxane block copolymers
KR101477609B1 (ko) 2010-09-22 2014-12-31 다우 코닝 코포레이션 수지-선형 유기실록산 블록 공중합체를 함유하는 고굴절률 조성물
WO2012040367A1 (en) 2010-09-22 2012-03-29 Dow Corning Corporation Organosiloxane block copolymer

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05271400A (ja) * 1992-01-29 1993-10-19 Daicel Chem Ind Ltd 分岐状ポリカーボネート及びその製造法
KR20070004587A (ko) * 2003-12-23 2007-01-09 게에 바이엘 실리콘스 게엠베하 운트 코. 카게 개질된 표면 특성을 갖는 경화성 실록산 조성물
KR20080000538A (ko) * 2006-06-27 2008-01-02 에어 프로덕츠 앤드 케미칼스, 인코오포레이티드 환원 분위기 하에서 유전 필름을 경화시키는 방법
KR20090106485A (ko) * 2006-11-22 2009-10-09 다우 코닝 코포레이션 시멘트질 재료

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