KR101439742B1 - 기판의 반전 장치, 반전 방법 및 기판의 처리 장치 - Google Patents
기판의 반전 장치, 반전 방법 및 기판의 처리 장치 Download PDFInfo
- Publication number
- KR101439742B1 KR101439742B1 KR1020130016485A KR20130016485A KR101439742B1 KR 101439742 B1 KR101439742 B1 KR 101439742B1 KR 1020130016485 A KR1020130016485 A KR 1020130016485A KR 20130016485 A KR20130016485 A KR 20130016485A KR 101439742 B1 KR101439742 B1 KR 101439742B1
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- KR
- South Korea
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- support members
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67796—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with angular orientation of workpieces
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012033016 | 2012-02-17 | ||
JPJP-P-2012-033016 | 2012-02-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20130095227A KR20130095227A (ko) | 2013-08-27 |
KR101439742B1 true KR101439742B1 (ko) | 2014-09-17 |
Family
ID=49218674
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020130016485A KR101439742B1 (ko) | 2012-02-17 | 2013-02-15 | 기판의 반전 장치, 반전 방법 및 기판의 처리 장치 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6068181B2 (ja) |
KR (1) | KR101439742B1 (ja) |
TW (1) | TWI513646B (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101495544B1 (ko) | 2013-08-12 | 2015-02-26 | 현대자동차주식회사 | 인터쿨러파이프의 장착구조 |
JP6917846B2 (ja) * | 2017-09-25 | 2021-08-11 | 株式会社Screenホールディングス | 基板反転装置、基板処理装置および基板挟持装置 |
JP7377659B2 (ja) * | 2019-09-27 | 2023-11-10 | 株式会社Screenホールディングス | 基板処理装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20020076819A (ko) * | 2001-03-30 | 2002-10-11 | (주)케이.씨.텍 | 기판을 파지하는 장치 및 이를 갖는 핸들링 장치 |
JP2002302248A (ja) * | 2001-03-30 | 2002-10-18 | Shibaura Mechatronics Corp | 基板反転装置、及びそれを用いたパネル製造装置 |
JP2006012880A (ja) | 2004-06-22 | 2006-01-12 | Dainippon Screen Mfg Co Ltd | 基板反転装置、基板搬送装置、基板処理装置、基板反転方法、基板搬送方法および基板処理方法 |
KR20070045534A (ko) * | 2005-10-27 | 2007-05-02 | 엘지.필립스 엘시디 주식회사 | 반전 기능이 구비된 액정 표시 장치용 리페어 장비 및 이의기판 반전 방법 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3724361B2 (ja) * | 2000-10-31 | 2005-12-07 | ダイキン工業株式会社 | 基板搬送装置 |
JP2003100695A (ja) * | 2001-09-26 | 2003-04-04 | Dainippon Screen Mfg Co Ltd | 基板洗浄装置 |
JP2005203452A (ja) * | 2004-01-13 | 2005-07-28 | Serubakku:Kk | 基板保持反転装置 |
JP4595740B2 (ja) * | 2005-08-16 | 2010-12-08 | パナソニック株式会社 | チップ反転装置およびチップ反転方法ならびにチップ搭載装置 |
JP4726776B2 (ja) * | 2006-12-27 | 2011-07-20 | 大日本スクリーン製造株式会社 | 反転装置およびそれを備えた基板処理装置 |
TWI556346B (zh) * | 2010-06-25 | 2016-11-01 | 愛發科股份有限公司 | 基板反轉裝置、真空成膜裝置及基板反轉方法 |
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2013
- 2013-02-08 TW TW102105253A patent/TWI513646B/zh active
- 2013-02-15 KR KR1020130016485A patent/KR101439742B1/ko active IP Right Grant
- 2013-02-18 JP JP2013029270A patent/JP6068181B2/ja active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20020076819A (ko) * | 2001-03-30 | 2002-10-11 | (주)케이.씨.텍 | 기판을 파지하는 장치 및 이를 갖는 핸들링 장치 |
JP2002302248A (ja) * | 2001-03-30 | 2002-10-18 | Shibaura Mechatronics Corp | 基板反転装置、及びそれを用いたパネル製造装置 |
JP2006012880A (ja) | 2004-06-22 | 2006-01-12 | Dainippon Screen Mfg Co Ltd | 基板反転装置、基板搬送装置、基板処理装置、基板反転方法、基板搬送方法および基板処理方法 |
KR20070045534A (ko) * | 2005-10-27 | 2007-05-02 | 엘지.필립스 엘시디 주식회사 | 반전 기능이 구비된 액정 표시 장치용 리페어 장비 및 이의기판 반전 방법 |
Also Published As
Publication number | Publication date |
---|---|
KR20130095227A (ko) | 2013-08-27 |
TWI513646B (zh) | 2015-12-21 |
TW201343519A (zh) | 2013-11-01 |
JP6068181B2 (ja) | 2017-01-25 |
JP2013191844A (ja) | 2013-09-26 |
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