KR101433622B1 - 처리 장치 및 처리 방법 - Google Patents

처리 장치 및 처리 방법 Download PDF

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Publication number
KR101433622B1
KR101433622B1 KR1020130022745A KR20130022745A KR101433622B1 KR 101433622 B1 KR101433622 B1 KR 101433622B1 KR 1020130022745 A KR1020130022745 A KR 1020130022745A KR 20130022745 A KR20130022745 A KR 20130022745A KR 101433622 B1 KR101433622 B1 KR 101433622B1
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KR
South Korea
Prior art keywords
nozzle
liquid
treatment
processing
cleaning liquid
Prior art date
Application number
KR1020130022745A
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English (en)
Korean (ko)
Other versions
KR20130105376A (ko
Inventor
히로시 후지타
아키노리 이소
가츠유키 소에다
유키노부 니시베
신이치 사사키
Original Assignee
가부시끼가이샤 도시바
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 가부시끼가이샤 도시바 filed Critical 가부시끼가이샤 도시바
Publication of KR20130105376A publication Critical patent/KR20130105376A/ko
Application granted granted Critical
Publication of KR101433622B1 publication Critical patent/KR101433622B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Details Or Accessories Of Spraying Plant Or Apparatus (AREA)
KR1020130022745A 2012-03-14 2013-03-04 처리 장치 및 처리 방법 KR101433622B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2012-057939 2012-03-14
JP2012057939A JP2013191779A (ja) 2012-03-14 2012-03-14 処理装置および処理方法

Publications (2)

Publication Number Publication Date
KR20130105376A KR20130105376A (ko) 2013-09-25
KR101433622B1 true KR101433622B1 (ko) 2014-08-26

Family

ID=49127965

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130022745A KR101433622B1 (ko) 2012-03-14 2013-03-04 처리 장치 및 처리 방법

Country Status (4)

Country Link
JP (1) JP2013191779A (zh)
KR (1) KR101433622B1 (zh)
CN (1) CN103301992B (zh)
TW (1) TWI583452B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015137077A1 (ja) * 2014-03-11 2015-09-17 芝浦メカトロニクス株式会社 反射型マスクの洗浄装置および反射型マスクの洗浄方法
CN104056798B (zh) * 2014-05-21 2016-02-03 上海和辉光电有限公司 清洗液的回收和供给设备及方法
CN104014500B (zh) * 2014-06-09 2016-04-27 福州宝井钢材有限公司 一种电镀锌材料的清洗装置
KR101994961B1 (ko) 2018-07-04 2019-07-02 주식회사 엠에스이엔씨 다공성 장석을 이용한 충전 모르타르 조성물 및 그 제조 방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060000009A (ko) * 2004-06-28 2006-01-06 엘지.필립스 엘시디 주식회사 세정 장비
KR20070034888A (ko) * 2005-09-26 2007-03-29 세메스 주식회사 기판 세정장치
KR101020676B1 (ko) 2008-11-26 2011-03-09 세메스 주식회사 기판 세정 장치

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09213669A (ja) * 1996-02-05 1997-08-15 Dainippon Screen Mfg Co Ltd 基板処理装置
JPH1147665A (ja) * 1997-07-29 1999-02-23 Dainippon Screen Mfg Co Ltd 処理液の置換機構および該置換機構を備えた基板処理装置
CN1327888A (zh) * 2000-06-09 2001-12-26 株式会社平间理化研究所 基板表面处理装置
KR100593709B1 (ko) * 2002-03-27 2006-06-28 다이닛뽕스크린 세이조오 가부시키가이샤 기판처리장치
JP2004074021A (ja) * 2002-08-19 2004-03-11 Dainippon Screen Mfg Co Ltd 基板処理装置及び基板洗浄ユニット
JP2004273984A (ja) * 2003-03-12 2004-09-30 Dainippon Screen Mfg Co Ltd 基板処理方法および基板処理装置
JP2004275918A (ja) * 2003-03-17 2004-10-07 Hitachi High-Tech Electronics Engineering Co Ltd 基板洗浄装置、基板洗浄方法、及び基板の製造方法
JP2006130484A (ja) * 2004-11-09 2006-05-25 Dainippon Screen Mfg Co Ltd 基板処理装置
JP5252861B2 (ja) * 2007-01-15 2013-07-31 芝浦メカトロニクス株式会社 基板の処理装置
JP2009004728A (ja) * 2007-05-24 2009-01-08 Dainippon Screen Mfg Co Ltd 基板処理装置
TW200916199A (en) * 2007-08-28 2009-04-16 Dainippon Screen Mfg Substrate processing apparatus
JP4812847B2 (ja) * 2009-02-23 2011-11-09 東京エレクトロン株式会社 基板処理装置及び基板処理方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060000009A (ko) * 2004-06-28 2006-01-06 엘지.필립스 엘시디 주식회사 세정 장비
KR20070034888A (ko) * 2005-09-26 2007-03-29 세메스 주식회사 기판 세정장치
KR101020676B1 (ko) 2008-11-26 2011-03-09 세메스 주식회사 기판 세정 장치

Also Published As

Publication number Publication date
CN103301992A (zh) 2013-09-18
TW201347857A (zh) 2013-12-01
CN103301992B (zh) 2016-12-28
KR20130105376A (ko) 2013-09-25
JP2013191779A (ja) 2013-09-26
TWI583452B (zh) 2017-05-21

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