KR101405361B1 - Ｆｐｃ용 전자파 실드재 - Google Patents

Ｆｐｃ용 전자파 실드재 Download PDF

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Publication number
KR101405361B1
KR101405361B1 KR1020120100925A KR20120100925A KR101405361B1 KR 101405361 B1 KR101405361 B1 KR 101405361B1 KR 1020120100925 A KR1020120100925 A KR 1020120100925A KR 20120100925 A KR20120100925 A KR 20120100925A KR 101405361 B1 KR101405361 B1 KR 101405361B1
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South Korea
Prior art keywords
electromagnetic wave
fpc
wave shielding
resin
film
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KR1020120100925A
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English (en)
Korean (ko)
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KR20130099799A (ko
Inventor
노부히로 고토우
모리토시 오구니
히사미치 타나카
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후지모리 고교 가부시키가이샤
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Publication of KR20130099799A publication Critical patent/KR20130099799A/ko
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0112—Absorbing light, e.g. dielectric layer with carbon filler for laser processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0326—Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0723—Shielding provided by an inner layer of PCB
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
    • Y02A30/00—Adapting or protecting infrastructure or their operation

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
KR1020120100925A 2011-09-16 2012-09-12 Ｆｐｃ용 전자파 실드재 Active KR101405361B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011203034A JP5712095B2 (ja) 2011-09-16 2011-09-16 Ｆｐｃ用電磁波シールド材
JPJP-P-2011-203034 2011-09-16

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020140045947A Division KR20140063546A (ko) 2011-09-16 2014-04-17 Ｆｐｃ용 전자파 실드재

Publications (2)

Publication Number Publication Date
KR20130099799A KR20130099799A (ko) 2013-09-06
KR101405361B1 true KR101405361B1 (ko) 2014-06-10

Family

ID=47930680

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020120100925A Active KR101405361B1 (ko) 2011-09-16 2012-09-12 Ｆｐｃ용 전자파 실드재
KR1020140045947A Ceased KR20140063546A (ko) 2011-09-16 2014-04-17 Ｆｐｃ용 전자파 실드재

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020140045947A Ceased KR20140063546A (ko) 2011-09-16 2014-04-17 Ｆｐｃ용 전자파 실드재

Country Status (4)

Country Link
JP (1) JP5712095B2 (enrdf_load_stackoverflow)
KR (2) KR101405361B1 (enrdf_load_stackoverflow)
CN (2) CN105050314B (enrdf_load_stackoverflow)
TW (1) TWI547236B (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180071483A (ko) * 2016-12-20 2018-06-28 주식회사 두산 커버레이용 필름

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JP2015109404A (ja) * 2013-10-24 2015-06-11 信越ポリマー株式会社 電磁波シールドフィルム、電磁波シールドフィルム付きフレキシブルプリント配線板、およびそれらの製造方法
CN103717050A (zh) * 2013-12-03 2014-04-09 明冠新材料股份有限公司 一种薄型柔性热固化电磁屏蔽胶膜
KR102202145B1 (ko) 2014-03-28 2021-01-13 삼성디스플레이 주식회사 완충패드를 갖는 표시장치
JP2015220259A (ja) * 2014-05-14 2015-12-07 Tdk株式会社 磁気抑制シート及びその製造方法
KR20150130915A (ko) 2014-05-14 2015-11-24 티디케이가부시기가이샤 자기억제 시트 및 그 제조방법
JP2015220260A (ja) * 2014-05-14 2015-12-07 Tdk株式会社 磁気抑制シート及びその製造方法
JP6381117B2 (ja) * 2014-09-04 2018-08-29 信越ポリマー株式会社 電磁波シールドフィルムおよび電磁波シールドフィルム付きフレキシブルプリント配線板の製造方法
JP6184025B2 (ja) * 2014-09-04 2017-08-23 信越ポリマー株式会社 電磁波シールドフィルムおよび電磁波シールドフィルム付きフレキシブルプリント配線板の製造方法
JP6435540B2 (ja) * 2014-09-19 2018-12-12 信越ポリマー株式会社 電磁波シールドフィルム、電磁波シールドフィルム付きフレキシブルプリント配線板、およびそれら製造方法
JP6467701B2 (ja) * 2014-10-28 2019-02-13 信越ポリマー株式会社 電磁波シールドフィルム、電磁波シールドフィルム付きフレキシブルプリント配線板、およびそれらの製造方法
JP6028290B2 (ja) * 2014-12-11 2016-11-16 東洋インキＳｃホールディングス株式会社 電磁波シールドシートおよびプリント配線板
KR101862121B1 (ko) * 2015-02-02 2018-05-29 토요잉크Sc홀딩스주식회사 전자파 차폐 시트, 프린트 배선판 및 전자 기기
CN104639693A (zh) * 2015-02-28 2015-05-20 上海鼎讯电子有限公司 柔性连接件及移动终端
KR20170084672A (ko) * 2016-01-12 2017-07-20 후지모리 고교 가부시키가이샤 커버레이 필름
CN106003916A (zh) * 2016-05-04 2016-10-12 胡银坤 一种电磁屏蔽膜
JP6694763B2 (ja) * 2016-06-08 2020-05-20 信越ポリマー株式会社 電磁波シールドフィルムおよび電磁波シールドフィルム付きプリント配線板
CN107953648A (zh) * 2017-12-27 2018-04-24 太仓金煜电子材料有限公司 一种阻燃级哑黑复合薄膜及其生产方法
JP6706655B2 (ja) * 2018-10-01 2020-06-10 信越ポリマー株式会社 電磁波シールドフィルム、電磁波シールドフィルム付きフレキシブルプリント配線板、およびそれらの製造方法
JP6706654B2 (ja) * 2018-10-01 2020-06-10 信越ポリマー株式会社 電磁波シールドフィルム、電磁波シールドフィルム付きフレキシブルプリント配線板、およびそれらの製造方法
JP6497477B1 (ja) * 2018-10-03 2019-04-10 東洋インキＳｃホールディングス株式会社 電磁波シールドシート、および電子部品搭載基板
JP7281888B2 (ja) * 2018-10-16 2023-05-26 信越ポリマー株式会社 電磁波シールドフィルム及びその製造方法、並びに電磁波シールドフィルム付きプリント配線板及びその製造方法
JP2020064927A (ja) * 2018-10-16 2020-04-23 信越ポリマー株式会社 電磁波シールドフィルム及びその製造方法、並びに電磁波シールドフィルム付きプリント配線板
CN109808267B (zh) * 2019-01-31 2021-01-29 常德力元新材料有限责任公司 一种电磁屏蔽复合材料及其制备方法
CN113853839B (zh) * 2019-05-29 2022-09-30 拓自达电线株式会社 电磁波屏蔽膜及屏蔽印制线路板
CN111073530B (zh) * 2019-12-02 2021-03-30 苏州市新广益电子有限公司 一种用于fpc电镀的导电胶膜及其生产工艺
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JP7314841B2 (ja) * 2020-03-12 2023-07-26 Dic株式会社 導電性積層体及び導電性積層テープ
CN111669957B (zh) * 2020-06-15 2022-08-02 江苏百旭电子新材料科技有限公司 一种fpc热压屏蔽膜及其生产方法
CN111968536B (zh) * 2020-09-09 2022-06-10 武汉华星光电半导体显示技术有限公司 屏蔽带及显示模组的制备方法
JP7420062B2 (ja) * 2020-12-24 2024-01-23 Dic株式会社 導電性積層体及び導電性粘着テープ
CN114364245B (zh) * 2022-01-18 2025-06-24 成都佳驰电子科技股份有限公司 一种柔性导电屏蔽膜及其制备方法
CN115734601A (zh) * 2022-11-24 2023-03-03 昆山雅森电子材料科技有限公司 一种高段差电磁干扰屏蔽膜及其制备方法

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KR100996070B1 (ko) 2010-04-29 2010-11-22 우영관 블랙쉴드 및 이의 제조방법, 블랙쉴드를 이용한 ｐｃｂ 또는 ｆｐｃ의 제조방법
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WO2010109842A1 (ja) * 2009-03-25 2010-09-30 三井・デュポンポリケミカル株式会社 電子部品用金属層付きフィルム、その製造方法および用途
KR100996070B1 (ko) 2010-04-29 2010-11-22 우영관 블랙쉴드 및 이의 제조방법, 블랙쉴드를 이용한 ｐｃｂ 또는 ｆｐｃ의 제조방법

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Publication number Priority date Publication date Assignee Title
KR20180071483A (ko) * 2016-12-20 2018-06-28 주식회사 두산 커버레이용 필름
KR102014583B1 (ko) * 2016-12-20 2019-08-26 주식회사 두산 커버레이용 필름

Also Published As

Publication number Publication date
JP5712095B2 (ja) 2015-05-07
JP2013065675A (ja) 2013-04-11
KR20140063546A (ko) 2014-05-27
TW201325428A (zh) 2013-06-16
TWI547236B (zh) 2016-08-21
CN105050314B (zh) 2017-04-12
CN103002725A (zh) 2013-03-27
CN105050314A (zh) 2015-11-11
KR20130099799A (ko) 2013-09-06

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