JP5712095B2 - Ｆｐｃ用電磁波シールド材 - Google Patents

Ｆｐｃ用電磁波シールド材 Download PDF

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Publication number
JP5712095B2
JP5712095B2 JP2011203034A JP2011203034A JP5712095B2 JP 5712095 B2 JP5712095 B2 JP 5712095B2 JP 2011203034 A JP2011203034 A JP 2011203034A JP 2011203034 A JP2011203034 A JP 2011203034A JP 5712095 B2 JP5712095 B2 JP 5712095B2
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JP
Japan
Prior art keywords
fpc
electromagnetic wave
wave shielding
shielding material
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2011203034A
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English (en)
Japanese (ja)
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JP2013065675A (ja
JP2013065675A5 (enrdf_load_stackoverflow
Inventor
後藤　信弘
信弘 後藤
小国　盛稔
盛稔 小国
田中　久道
久道 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zacros Corp
Original Assignee
Fujimori Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujimori Kogyo Co Ltd filed Critical Fujimori Kogyo Co Ltd
Priority to JP2011203034A priority Critical patent/JP5712095B2/ja
Priority to TW101129170A priority patent/TWI547236B/zh
Priority to KR1020120100925A priority patent/KR101405361B1/ko
Priority to CN2012103420250A priority patent/CN103002725A/zh
Priority to CN201510278068.0A priority patent/CN105050314B/zh
Publication of JP2013065675A publication Critical patent/JP2013065675A/ja
Priority to KR1020140045947A priority patent/KR20140063546A/ko
Publication of JP2013065675A5 publication Critical patent/JP2013065675A5/ja
Application granted granted Critical
Publication of JP5712095B2 publication Critical patent/JP5712095B2/ja
Active legal-status Critical Current
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0112—Absorbing light, e.g. dielectric layer with carbon filler for laser processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0326—Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0723—Shielding provided by an inner layer of PCB
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
    • Y02A30/00—Adapting or protecting infrastructure or their operation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
JP2011203034A 2011-09-16 2011-09-16 Ｆｐｃ用電磁波シールド材 Active JP5712095B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2011203034A JP5712095B2 (ja) 2011-09-16 2011-09-16 Ｆｐｃ用電磁波シールド材
TW101129170A TWI547236B (zh) 2011-09-16 2012-08-13 Electromagnetic wave shielding material for FPC
KR1020120100925A KR101405361B1 (ko) 2011-09-16 2012-09-12 Ｆｐｃ용 전자파 실드재
CN201510278068.0A CN105050314B (zh) 2011-09-16 2012-09-14 Fpc用电磁波屏蔽材料
CN2012103420250A CN103002725A (zh) 2011-09-16 2012-09-14 Fpc用电磁波屏蔽材料
KR1020140045947A KR20140063546A (ko) 2011-09-16 2014-04-17 Ｆｐｃ용 전자파 실드재

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011203034A JP5712095B2 (ja) 2011-09-16 2011-09-16 Ｆｐｃ用電磁波シールド材

Publications (3)

Publication Number Publication Date
JP2013065675A JP2013065675A (ja) 2013-04-11
JP2013065675A5 JP2013065675A5 (enrdf_load_stackoverflow) 2015-03-19
JP5712095B2 true JP5712095B2 (ja) 2015-05-07

Family

ID=47930680

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011203034A Active JP5712095B2 (ja) 2011-09-16 2011-09-16 Ｆｐｃ用電磁波シールド材

Country Status (4)

Country Link
JP (1) JP5712095B2 (enrdf_load_stackoverflow)
KR (2) KR101405361B1 (enrdf_load_stackoverflow)
CN (2) CN105050314B (enrdf_load_stackoverflow)
TW (1) TWI547236B (enrdf_load_stackoverflow)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015109404A (ja) * 2013-10-24 2015-06-11 信越ポリマー株式会社 電磁波シールドフィルム、電磁波シールドフィルム付きフレキシブルプリント配線板、およびそれらの製造方法
CN103717050A (zh) * 2013-12-03 2014-04-09 明冠新材料股份有限公司 一种薄型柔性热固化电磁屏蔽胶膜
KR102202145B1 (ko) 2014-03-28 2021-01-13 삼성디스플레이 주식회사 완충패드를 갖는 표시장치
JP2015220259A (ja) * 2014-05-14 2015-12-07 Tdk株式会社 磁気抑制シート及びその製造方法
KR20150130915A (ko) 2014-05-14 2015-11-24 티디케이가부시기가이샤 자기억제 시트 및 그 제조방법
JP2015220260A (ja) * 2014-05-14 2015-12-07 Tdk株式会社 磁気抑制シート及びその製造方法
JP6381117B2 (ja) * 2014-09-04 2018-08-29 信越ポリマー株式会社 電磁波シールドフィルムおよび電磁波シールドフィルム付きフレキシブルプリント配線板の製造方法
JP6184025B2 (ja) * 2014-09-04 2017-08-23 信越ポリマー株式会社 電磁波シールドフィルムおよび電磁波シールドフィルム付きフレキシブルプリント配線板の製造方法
JP6435540B2 (ja) * 2014-09-19 2018-12-12 信越ポリマー株式会社 電磁波シールドフィルム、電磁波シールドフィルム付きフレキシブルプリント配線板、およびそれら製造方法
JP6467701B2 (ja) * 2014-10-28 2019-02-13 信越ポリマー株式会社 電磁波シールドフィルム、電磁波シールドフィルム付きフレキシブルプリント配線板、およびそれらの製造方法
JP6028290B2 (ja) * 2014-12-11 2016-11-16 東洋インキＳｃホールディングス株式会社 電磁波シールドシートおよびプリント配線板
KR101862121B1 (ko) * 2015-02-02 2018-05-29 토요잉크Sc홀딩스주식회사 전자파 차폐 시트, 프린트 배선판 및 전자 기기
CN104639693A (zh) * 2015-02-28 2015-05-20 上海鼎讯电子有限公司 柔性连接件及移动终端
KR20170084672A (ko) * 2016-01-12 2017-07-20 후지모리 고교 가부시키가이샤 커버레이 필름
CN106003916A (zh) * 2016-05-04 2016-10-12 胡银坤 一种电磁屏蔽膜
JP6694763B2 (ja) * 2016-06-08 2020-05-20 信越ポリマー株式会社 電磁波シールドフィルムおよび電磁波シールドフィルム付きプリント配線板
KR102014583B1 (ko) * 2016-12-20 2019-08-26 주식회사 두산 커버레이용 필름
CN107953648A (zh) * 2017-12-27 2018-04-24 太仓金煜电子材料有限公司 一种阻燃级哑黑复合薄膜及其生产方法
JP6706655B2 (ja) * 2018-10-01 2020-06-10 信越ポリマー株式会社 電磁波シールドフィルム、電磁波シールドフィルム付きフレキシブルプリント配線板、およびそれらの製造方法
JP6706654B2 (ja) * 2018-10-01 2020-06-10 信越ポリマー株式会社 電磁波シールドフィルム、電磁波シールドフィルム付きフレキシブルプリント配線板、およびそれらの製造方法
JP6497477B1 (ja) * 2018-10-03 2019-04-10 東洋インキＳｃホールディングス株式会社 電磁波シールドシート、および電子部品搭載基板
JP7281888B2 (ja) * 2018-10-16 2023-05-26 信越ポリマー株式会社 電磁波シールドフィルム及びその製造方法、並びに電磁波シールドフィルム付きプリント配線板及びその製造方法
JP2020064927A (ja) * 2018-10-16 2020-04-23 信越ポリマー株式会社 電磁波シールドフィルム及びその製造方法、並びに電磁波シールドフィルム付きプリント配線板
CN109808267B (zh) * 2019-01-31 2021-01-29 常德力元新材料有限责任公司 一种电磁屏蔽复合材料及其制备方法
CN113853839B (zh) * 2019-05-29 2022-09-30 拓自达电线株式会社 电磁波屏蔽膜及屏蔽印制线路板
CN111073530B (zh) * 2019-12-02 2021-03-30 苏州市新广益电子有限公司 一种用于fpc电镀的导电胶膜及其生产工艺
TWI812889B (zh) * 2020-03-03 2023-08-21 日商拓自達電線股份有限公司 電磁波屏蔽膜
JP7314841B2 (ja) * 2020-03-12 2023-07-26 Dic株式会社 導電性積層体及び導電性積層テープ
CN111669957B (zh) * 2020-06-15 2022-08-02 江苏百旭电子新材料科技有限公司 一种fpc热压屏蔽膜及其生产方法
CN111968536B (zh) * 2020-09-09 2022-06-10 武汉华星光电半导体显示技术有限公司 屏蔽带及显示模组的制备方法
JP7420062B2 (ja) * 2020-12-24 2024-01-23 Dic株式会社 導電性積層体及び導電性粘着テープ
CN114364245B (zh) * 2022-01-18 2025-06-24 成都佳驰电子科技股份有限公司 一种柔性导电屏蔽膜及其制备方法
CN115734601A (zh) * 2022-11-24 2023-03-03 昆山雅森电子材料科技有限公司 一种高段差电磁干扰屏蔽膜及其制备方法

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Also Published As

Publication number Publication date
JP2013065675A (ja) 2013-04-11
KR20140063546A (ko) 2014-05-27
TW201325428A (zh) 2013-06-16
TWI547236B (zh) 2016-08-21
CN105050314B (zh) 2017-04-12
CN103002725A (zh) 2013-03-27
CN105050314A (zh) 2015-11-11
KR20130099799A (ko) 2013-09-06
KR101405361B1 (ko) 2014-06-10

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