KR101403846B1 - 열 중합계 개시제 시스템 및 접착제 조성물 - Google Patents

열 중합계 개시제 시스템 및 접착제 조성물 Download PDF

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KR101403846B1
KR101403846B1 KR1020127014112A KR20127014112A KR101403846B1 KR 101403846 B1 KR101403846 B1 KR 101403846B1 KR 1020127014112 A KR1020127014112 A KR 1020127014112A KR 20127014112 A KR20127014112 A KR 20127014112A KR 101403846 B1 KR101403846 B1 KR 101403846B1
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adhesive composition
compound
group
component
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KR1020127014112A
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KR20120088796A (ko
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스스무 가와카미
아키라 나가이
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히타치가세이가부시끼가이샤
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F4/00—Polymerisation catalysts
    • C08F4/28—Oxygen or compounds releasing free oxygen
    • C08F4/32—Organic compounds
    • C08F4/34—Per-compounds with one peroxy-radical
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F4/00—Polymerisation catalysts
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C08G65/08—Saturated oxiranes
    • C08G65/10—Saturated oxiranes characterised by the catalysts used
    • C08G65/105—Onium compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C08G65/16—Cyclic ethers having four or more ring atoms
    • C08G65/18—Oxetanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/02—Halogenated hydrocarbons
    • C08K5/03—Halogenated hydrocarbons aromatic, e.g. C6H5-CH2-Cl
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/37—Thiols
    • C08K5/375—Thiols containing six-membered aromatic rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Epoxy Resins (AREA)
  • Wire Bonding (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
KR1020127014112A 2009-11-05 2010-11-05 열 중합계 개시제 시스템 및 접착제 조성물 KR101403846B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2009-254024 2009-11-05
JP2009254024 2009-11-05
PCT/JP2010/069693 WO2011055784A1 (ja) 2009-11-05 2010-11-05 熱重合系開始剤システム及び接着剤組成物

Publications (2)

Publication Number Publication Date
KR20120088796A KR20120088796A (ko) 2012-08-08
KR101403846B1 true KR101403846B1 (ko) 2014-06-03

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KR1020127014112A KR101403846B1 (ko) 2009-11-05 2010-11-05 열 중합계 개시제 시스템 및 접착제 조성물

Country Status (5)

Country Link
JP (2) JP5533568B2 (ja)
KR (1) KR101403846B1 (ja)
CN (2) CN102597044B (ja)
TW (2) TWI529186B (ja)
WO (1) WO2011055784A1 (ja)

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CN103081236B (zh) * 2010-08-06 2016-03-09 旭化成电子材料株式会社 各向异性导电性粘接膜及固化剂
JP2013187375A (ja) * 2012-03-08 2013-09-19 Hitachi Chemical Co Ltd 半導体装置用接着フィルム、半導体装置の製造方法及びそれを用いた半導体装置
JP2013187376A (ja) * 2012-03-08 2013-09-19 Hitachi Chemical Co Ltd 半導体装置用接着フィルム、半導体装置の製造方法及びそれを用いた半導体装置
JP2013194076A (ja) * 2012-03-16 2013-09-30 Daicel Corp 硬化性組成物、及びその硬化物
JP6044261B2 (ja) * 2012-10-22 2016-12-14 日立化成株式会社 異方導電性接着剤組成物
JP5952732B2 (ja) * 2012-12-28 2016-07-13 協立化学産業株式会社 熱カチオン重合性組成物
JP6232855B2 (ja) * 2013-08-30 2017-11-22 デクセリアルズ株式会社 ラジカル重合型接着剤組成物、及び電気接続体の製造方法
WO2016021535A1 (ja) * 2014-08-08 2016-02-11 横浜ゴム株式会社 導電性組成物、太陽電池セルおよび太陽電池モジュール
WO2016060191A1 (ja) * 2014-10-17 2016-04-21 太陽インキ製造株式会社 ドライフィルムおよびフレキシブルプリント配線板
JP6510846B2 (ja) * 2015-03-24 2019-05-08 デクセリアルズ株式会社 異方性導電フィルム、接続方法、及び接合体
KR101595696B1 (ko) * 2015-04-02 2016-02-19 주식회사 이녹스 비전도성 접착필름용 조성물 및 이를 포함하는 비전도성 접착필름
CN106928893B (zh) * 2015-10-26 2020-07-21 黑龙江省科学院石油化学研究院 一种阳离子型紫外光和热双重深层固化胶粘剂的制备方法
KR101900544B1 (ko) 2015-12-07 2018-09-19 삼성에스디아이 주식회사 이방 도전성 필름용 조성물, 이방 도전성 필름 및 이를 이용한 접속 구조체
JP6894686B2 (ja) * 2016-09-30 2021-06-30 リンテック株式会社 粘接着剤組成物、粘接着剤、粘接着シートおよび表示体
WO2020022485A1 (ja) * 2018-07-27 2020-01-30 リンテック株式会社 硬化性フィルム状接着剤及びデバイスの製造方法
EP3719088A1 (en) * 2019-04-02 2020-10-07 3M Innovative Properties Company Curable precursor of a structural adhesive composition
EP3719089A1 (en) * 2019-04-02 2020-10-07 3M Innovative Properties Company Process of manufacturing a curable precursor of a structural adhesive composition
WO2022085741A1 (ja) * 2020-10-22 2022-04-28 昭和電工マテリアルズ株式会社 回路接続用接着剤フィルム、接続構造体、及び接続構造体の製造方法
CN115466543B (zh) * 2022-10-19 2024-02-27 福斯特(安吉)新材料有限公司 光固化黑色喷墨用封装组合物、封装结构和其应用

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JP2008013721A (ja) * 2006-07-10 2008-01-24 Kyocera Chemical Corp 硬化性樹脂組成物、表示素子用接着剤及び接着方法

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JP2008013721A (ja) * 2006-07-10 2008-01-24 Kyocera Chemical Corp 硬化性樹脂組成物、表示素子用接着剤及び接着方法

Also Published As

Publication number Publication date
CN104017173B (zh) 2017-04-12
CN102597044B (zh) 2014-06-11
WO2011055784A1 (ja) 2011-05-12
JP2011116977A (ja) 2011-06-16
TW201412800A (zh) 2014-04-01
TWI529186B (zh) 2016-04-11
JP5533568B2 (ja) 2014-06-25
TWI425014B (zh) 2014-02-01
JP2014139328A (ja) 2014-07-31
JP5892192B2 (ja) 2016-03-23
TW201134842A (en) 2011-10-16
CN102597044A (zh) 2012-07-18
KR20120088796A (ko) 2012-08-08
CN104017173A (zh) 2014-09-03

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