TWI529186B - 熱聚合系起始劑系統及黏著劑組成物 - Google Patents

熱聚合系起始劑系統及黏著劑組成物 Download PDF

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Publication number
TWI529186B
TWI529186B TW102141662A TW102141662A TWI529186B TW I529186 B TWI529186 B TW I529186B TW 102141662 A TW102141662 A TW 102141662A TW 102141662 A TW102141662 A TW 102141662A TW I529186 B TWI529186 B TW I529186B
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TW
Taiwan
Prior art keywords
adhesive composition
compound
component
group
film
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TW102141662A
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English (en)
Chinese (zh)
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TW201412800A (zh
Inventor
川上晉
永井朗
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日立化成股份有限公司
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Publication of TW201412800A publication Critical patent/TW201412800A/zh
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Publication of TWI529186B publication Critical patent/TWI529186B/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F4/00—Polymerisation catalysts
    • C08F4/28—Oxygen or compounds releasing free oxygen
    • C08F4/32—Organic compounds
    • C08F4/34—Per-compounds with one peroxy-radical
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F4/00—Polymerisation catalysts
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C08G65/08—Saturated oxiranes
    • C08G65/10—Saturated oxiranes characterised by the catalysts used
    • C08G65/105—Onium compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C08G65/16—Cyclic ethers having four or more ring atoms
    • C08G65/18—Oxetanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/02—Halogenated hydrocarbons
    • C08K5/03—Halogenated hydrocarbons aromatic, e.g. C6H5-CH2-Cl
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/37—Thiols
    • C08K5/375—Thiols containing six-membered aromatic rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Epoxy Resins (AREA)
  • Wire Bonding (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
TW102141662A 2009-11-05 2010-11-05 熱聚合系起始劑系統及黏著劑組成物 TWI529186B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009254024 2009-11-05

Publications (2)

Publication Number Publication Date
TW201412800A TW201412800A (zh) 2014-04-01
TWI529186B true TWI529186B (zh) 2016-04-11

Family

ID=43970020

Family Applications (2)

Application Number Title Priority Date Filing Date
TW099138184A TWI425014B (zh) 2009-11-05 2010-11-05 A thermal polymerization-based initiator system and an adhesive composition
TW102141662A TWI529186B (zh) 2009-11-05 2010-11-05 熱聚合系起始劑系統及黏著劑組成物

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW099138184A TWI425014B (zh) 2009-11-05 2010-11-05 A thermal polymerization-based initiator system and an adhesive composition

Country Status (5)

Country Link
JP (2) JP5533568B2 (ja)
KR (1) KR101403846B1 (ja)
CN (2) CN102597044B (ja)
TW (2) TWI425014B (ja)
WO (1) WO2011055784A1 (ja)

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CN103081236B (zh) * 2010-08-06 2016-03-09 旭化成电子材料株式会社 各向异性导电性粘接膜及固化剂
JP2013187375A (ja) * 2012-03-08 2013-09-19 Hitachi Chemical Co Ltd 半導体装置用接着フィルム、半導体装置の製造方法及びそれを用いた半導体装置
JP2013187376A (ja) * 2012-03-08 2013-09-19 Hitachi Chemical Co Ltd 半導体装置用接着フィルム、半導体装置の製造方法及びそれを用いた半導体装置
JP2013194076A (ja) * 2012-03-16 2013-09-30 Daicel Corp 硬化性組成物、及びその硬化物
JP6044261B2 (ja) * 2012-10-22 2016-12-14 日立化成株式会社 異方導電性接着剤組成物
JP5952732B2 (ja) * 2012-12-28 2016-07-13 協立化学産業株式会社 熱カチオン重合性組成物
JP6232855B2 (ja) * 2013-08-30 2017-11-22 デクセリアルズ株式会社 ラジカル重合型接着剤組成物、及び電気接続体の製造方法
JPWO2016021535A1 (ja) * 2014-08-08 2017-05-18 横浜ゴム株式会社 導電性組成物、太陽電池セルおよび太陽電池モジュール
WO2016060191A1 (ja) * 2014-10-17 2016-04-21 太陽インキ製造株式会社 ドライフィルムおよびフレキシブルプリント配線板
JP6510846B2 (ja) * 2015-03-24 2019-05-08 デクセリアルズ株式会社 異方性導電フィルム、接続方法、及び接合体
KR101595696B1 (ko) * 2015-04-02 2016-02-19 주식회사 이녹스 비전도성 접착필름용 조성물 및 이를 포함하는 비전도성 접착필름
CN106928893B (zh) * 2015-10-26 2020-07-21 黑龙江省科学院石油化学研究院 一种阳离子型紫外光和热双重深层固化胶粘剂的制备方法
KR101900544B1 (ko) * 2015-12-07 2018-09-19 삼성에스디아이 주식회사 이방 도전성 필름용 조성물, 이방 도전성 필름 및 이를 이용한 접속 구조체
JP6894686B2 (ja) * 2016-09-30 2021-06-30 リンテック株式会社 粘接着剤組成物、粘接着剤、粘接着シートおよび表示体
JP7372916B2 (ja) * 2018-07-27 2023-11-01 リンテック株式会社 硬化性フィルム状接着剤及びデバイスの製造方法
EP3719088A1 (en) * 2019-04-02 2020-10-07 3M Innovative Properties Company Curable precursor of a structural adhesive composition
EP3719089A1 (en) * 2019-04-02 2020-10-07 3M Innovative Properties Company Process of manufacturing a curable precursor of a structural adhesive composition
CN116635956A (zh) * 2020-10-22 2023-08-22 株式会社力森诺科 电路连接用黏合剂膜、连接结构体及连接结构体的制造方法
CN115466543B (zh) * 2022-10-19 2024-02-27 福斯特(安吉)新材料有限公司 光固化黑色喷墨用封装组合物、封装结构和其应用

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JP2002097443A (ja) * 2000-09-21 2002-04-02 Hitachi Chem Co Ltd 接着剤組成物及びこれを用いた回路接続材料並びに接続体
US7550097B2 (en) * 2003-09-03 2009-06-23 Momentive Performance Materials, Inc. Thermal conductive material utilizing electrically conductive nanoparticles
JP2005215443A (ja) * 2004-01-30 2005-08-11 Fuji Photo Film Co Ltd 重合性組成物及びそれを用いた画像形成材料
JP2006096925A (ja) * 2004-09-30 2006-04-13 Sumitomo Bakelite Co Ltd 樹脂組成物、樹脂層、樹脂層付きキャリア材料および回路基板
JP2006124518A (ja) * 2004-10-29 2006-05-18 Sumitomo Bakelite Co Ltd 樹脂組成物、樹脂層、樹脂層付きキャリア材料および回路基板
JP4865246B2 (ja) * 2005-03-25 2012-02-01 株式会社カネカ 熱ラジカル硬化／熱カチオン硬化併用硬化性組成物
US20070092733A1 (en) * 2005-10-26 2007-04-26 3M Innovative Properties Company Concurrently curable hybrid adhesive composition
EP1967540B1 (en) * 2005-12-26 2013-04-03 Kaneka Corporation Curable composition
JP2008013721A (ja) * 2006-07-10 2008-01-24 Kyocera Chemical Corp 硬化性樹脂組成物、表示素子用接着剤及び接着方法
JP5168860B2 (ja) * 2006-09-14 2013-03-27 株式会社スリーボンド 光重合性組成物
JP2008291137A (ja) * 2007-05-25 2008-12-04 Kaneka Corp 硬化性組成物
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JP2009194359A (ja) * 2008-01-16 2009-08-27 Hitachi Chem Co Ltd 回路接続用接着フィルム、これを用いた回路部材の接続構造及び回路部材の接続方法

Also Published As

Publication number Publication date
CN104017173B (zh) 2017-04-12
TW201412800A (zh) 2014-04-01
CN102597044B (zh) 2014-06-11
CN102597044A (zh) 2012-07-18
KR101403846B1 (ko) 2014-06-03
TW201134842A (en) 2011-10-16
JP5533568B2 (ja) 2014-06-25
KR20120088796A (ko) 2012-08-08
JP2011116977A (ja) 2011-06-16
TWI425014B (zh) 2014-02-01
JP2014139328A (ja) 2014-07-31
CN104017173A (zh) 2014-09-03
WO2011055784A1 (ja) 2011-05-12
JP5892192B2 (ja) 2016-03-23

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