KR101382354B1 - 전자기기 및 그 제조 방법과, 발광 다이오드 표시 장치 및그 제조 방법 - Google Patents

전자기기 및 그 제조 방법과, 발광 다이오드 표시 장치 및그 제조 방법 Download PDF

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KR101382354B1
KR101382354B1 KR1020070108944A KR20070108944A KR101382354B1 KR 101382354 B1 KR101382354 B1 KR 101382354B1 KR 1020070108944 A KR1020070108944 A KR 1020070108944A KR 20070108944 A KR20070108944 A KR 20070108944A KR 101382354 B1 KR101382354 B1 KR 101382354B1
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film
wiring
substrate
light emitting
emitting diode
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KR1020070108944A
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Korean (ko)
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KR20080051044A (ko
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카츠히로 토모다
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소니 가부시끼가이샤
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/743—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used as a support during manufacture of interconnect decals or build up layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs

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KR1020070108944A 2006-12-04 2007-10-29 전자기기 및 그 제조 방법과, 발광 다이오드 표시 장치 및그 제조 방법 Expired - Fee Related KR101382354B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006326488A JP2008141026A (ja) 2006-12-04 2006-12-04 電子機器及びその製造方法、並びに、発光ダイオード表示装置及びその製造方法
JPJP-P-2006-00326488 2006-12-04

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KR20080051044A KR20080051044A (ko) 2008-06-10
KR101382354B1 true KR101382354B1 (ko) 2014-04-08

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US (1) US7763901B2 (https=)
JP (1) JP2008141026A (https=)
KR (1) KR101382354B1 (https=)
CN (1) CN101197355B (https=)
TW (1) TW200837819A (https=)

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CN101599442A (zh) * 2008-06-04 2009-12-09 富准精密工业(深圳)有限公司 发光二极管的制造方法
JP2010107935A (ja) * 2008-10-28 2010-05-13 Samsung Mobile Display Co Ltd 平板表示装置及びその製造方法
JP2011129646A (ja) * 2009-12-16 2011-06-30 Panasonic Corp Ｌｅｄモジュール用配線基板、ｌｅｄモジュール及びｌｅｄモジュール用配線基板の製造方法
JP5670051B2 (ja) * 2009-12-25 2015-02-18 日亜化学工業株式会社 半導体発光装置及びその製造方法
JP5481305B2 (ja) 2010-07-30 2014-04-23 株式会社東芝 出力配分制御装置
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US9899329B2 (en) 2010-11-23 2018-02-20 X-Celeprint Limited Interconnection structures and methods for transfer-printed integrated circuit elements with improved interconnection alignment tolerance
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US20120175667A1 (en) * 2011-10-03 2012-07-12 Golle Aaron J Led light disposed on a flexible substrate and connected with a printed 3d conductor
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CN108922959B (zh) * 2013-03-28 2022-07-29 日亚化学工业株式会社 发光装置、及使用发光装置的装置
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JP5961148B2 (ja) * 2013-08-02 2016-08-02 富士フイルム株式会社 発光装置の製造方法
JP6010003B2 (ja) * 2013-08-02 2016-10-19 富士フイルム株式会社 発光装置およびその製造方法
WO2015068344A1 (ja) * 2013-11-07 2015-05-14 東芝ホクト電子株式会社 発光装置
US20170294420A1 (en) * 2014-09-02 2017-10-12 Philips Lighting Holding B.V. A method of applying a lighting arrangement to a surface and a lighting surface
US20160093600A1 (en) * 2014-09-25 2016-03-31 X-Celeprint Limited Compound micro-assembly strategies and devices
US9799719B2 (en) 2014-09-25 2017-10-24 X-Celeprint Limited Active-matrix touchscreen
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US10381332B2 (en) 2014-10-31 2019-08-13 eLux Inc. Fabrication method for emissive display with light management system
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TWI681508B (zh) 2016-02-25 2020-01-01 愛爾蘭商艾克斯瑟樂普林特有限公司 有效率地微轉印微型裝置於大尺寸基板上
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US10418510B1 (en) 2017-12-22 2019-09-17 Facebook Technologies, Llc Mesa shaped micro light emitting diode with electroless plated N-contact
WO2020075431A1 (ja) * 2018-10-09 2020-04-16 ソニー株式会社 表示装置
KR102877921B1 (ko) * 2020-02-20 2025-10-30 삼성디스플레이 주식회사 표시 장치
JP7574845B2 (ja) * 2020-03-31 2024-10-29 大日本印刷株式会社 エンコーダ用反射型光学式スケール及び反射型光学式エンコーダ
JP2023023684A (ja) * 2021-08-06 2023-02-16 株式会社ジャパンディスプレイ 表示装置の製造方法
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JPH0818105A (ja) * 1994-06-28 1996-01-19 Mitsubishi Chem Corp 発光装置
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WO2005099310A2 (en) 2004-03-29 2005-10-20 Articulated Technologies, Llc Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices
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Publication number Priority date Publication date Assignee Title
KR102437208B1 (ko) * 2021-03-03 2022-08-30 웨이브로드 주식회사 반도체 발광소자를 지지 기판으로 이전하는 방법

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KR20080051044A (ko) 2008-06-10
TW200837819A (en) 2008-09-16
US7763901B2 (en) 2010-07-27
CN101197355A (zh) 2008-06-11
CN101197355B (zh) 2010-06-23
TWI375262B (https=) 2012-10-21
JP2008141026A (ja) 2008-06-19
US20080224153A1 (en) 2008-09-18

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