CN101197355B - 电子器件及其制造方法、发光二极管显示单元及其制造方法 - Google Patents

电子器件及其制造方法、发光二极管显示单元及其制造方法 Download PDF

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Publication number
CN101197355B
CN101197355B CN2007101875674A CN200710187567A CN101197355B CN 101197355 B CN101197355 B CN 101197355B CN 2007101875674 A CN2007101875674 A CN 2007101875674A CN 200710187567 A CN200710187567 A CN 200710187567A CN 101197355 B CN101197355 B CN 101197355B
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substrate
film
wiring
light emitting
emitting diode
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Expired - Fee Related
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CN2007101875674A
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CN101197355A (zh
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友田胜宽
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Sony Corp
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Sony Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/743—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used as a support during manufacture of interconnect decals or build up layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs

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  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Devices (AREA)
CN2007101875674A 2006-12-04 2007-12-03 电子器件及其制造方法、发光二极管显示单元及其制造方法 Expired - Fee Related CN101197355B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006326488 2006-12-04
JP2006326488A JP2008141026A (ja) 2006-12-04 2006-12-04 電子機器及びその製造方法、並びに、発光ダイオード表示装置及びその製造方法
JP2006-326488 2006-12-04

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CN101197355A CN101197355A (zh) 2008-06-11
CN101197355B true CN101197355B (zh) 2010-06-23

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US (1) US7763901B2 (https=)
JP (1) JP2008141026A (https=)
KR (1) KR101382354B1 (https=)
CN (1) CN101197355B (https=)
TW (1) TW200837819A (https=)

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US8852467B2 (en) 2007-05-31 2014-10-07 Nthdegree Technologies Worldwide Inc Method of manufacturing a printable composition of a liquid or gel suspension of diodes
US9419179B2 (en) 2007-05-31 2016-08-16 Nthdegree Technologies Worldwide Inc Diode for a printable composition
US9343593B2 (en) 2007-05-31 2016-05-17 Nthdegree Technologies Worldwide Inc Printable composition of a liquid or gel suspension of diodes
CN101599442A (zh) * 2008-06-04 2009-12-09 富准精密工业(深圳)有限公司 发光二极管的制造方法
JP2010107935A (ja) * 2008-10-28 2010-05-13 Samsung Mobile Display Co Ltd 平板表示装置及びその製造方法
JP2011129646A (ja) * 2009-12-16 2011-06-30 Panasonic Corp Ｌｅｄモジュール用配線基板、ｌｅｄモジュール及びｌｅｄモジュール用配線基板の製造方法
JP5670051B2 (ja) * 2009-12-25 2015-02-18 日亜化学工業株式会社 半導体発光装置及びその製造方法
JP5481305B2 (ja) 2010-07-30 2014-04-23 株式会社東芝 出力配分制御装置
EP2612380A4 (en) * 2010-09-01 2015-01-14 Nthdegree Tech Worldwide Inc LIGHT-EMITTING, ELECTROMAGING OR OTHER ELECTRONIC DEVICE, AND MANUFACTURING METHOD THEREFOR
US9899329B2 (en) 2010-11-23 2018-02-20 X-Celeprint Limited Interconnection structures and methods for transfer-printed integrated circuit elements with improved interconnection alignment tolerance
US8889485B2 (en) 2011-06-08 2014-11-18 Semprius, Inc. Methods for surface attachment of flipped active componenets
CN102903804B (zh) * 2011-07-25 2015-12-16 财团法人工业技术研究院 发光元件的转移方法以及发光元件阵列
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US20120175667A1 (en) * 2011-10-03 2012-07-12 Golle Aaron J Led light disposed on a flexible substrate and connected with a printed 3d conductor
TWI450476B (zh) * 2011-11-18 2014-08-21 Hongkong Dongshan Prec Union Opoelectronic Co Ltd Padding method
CN108922959B (zh) * 2013-03-28 2022-07-29 日亚化学工业株式会社 发光装置、及使用发光装置的装置
EP3300108B1 (en) * 2013-03-28 2019-07-24 Toshiba Hokuto Electronics Corporation Light emitting device and method for manufacturing the same
JP5961148B2 (ja) * 2013-08-02 2016-08-02 富士フイルム株式会社 発光装置の製造方法
JP6010003B2 (ja) * 2013-08-02 2016-10-19 富士フイルム株式会社 発光装置およびその製造方法
WO2015068344A1 (ja) * 2013-11-07 2015-05-14 東芝ホクト電子株式会社 発光装置
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US20160093600A1 (en) * 2014-09-25 2016-03-31 X-Celeprint Limited Compound micro-assembly strategies and devices
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US10236279B2 (en) 2014-10-31 2019-03-19 eLux, Inc. Emissive display with light management system
US10520769B2 (en) 2014-10-31 2019-12-31 eLux, Inc. Emissive display with printed light modification structures
US9825202B2 (en) 2014-10-31 2017-11-21 eLux, Inc. Display with surface mount emissive elements
US10381332B2 (en) 2014-10-31 2019-08-13 eLux Inc. Fabrication method for emissive display with light management system
US10319878B2 (en) 2014-10-31 2019-06-11 eLux, Inc. Stratified quantum dot phosphor structure
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US10543486B2 (en) 2014-10-31 2020-01-28 eLux Inc. Microperturbation assembly system and method
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US10381335B2 (en) 2014-10-31 2019-08-13 ehux, Inc. Hybrid display using inorganic micro light emitting diodes (uLEDs) and organic LEDs (OLEDs)
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US10535640B2 (en) 2014-10-31 2020-01-14 eLux Inc. System and method for the fluidic assembly of micro-LEDs utilizing negative pressure
JP6591254B2 (ja) * 2015-10-16 2019-10-16 スタンレー電気株式会社 半導体発光装置、及び、半導体発光装置の製造方法
JP6602197B2 (ja) * 2015-12-21 2019-11-06 スタンレー電気株式会社 半導体発光装置、及び、半導体発光装置の製造方法
TWI681508B (zh) 2016-02-25 2020-01-01 愛爾蘭商艾克斯瑟樂普林特有限公司 有效率地微轉印微型裝置於大尺寸基板上
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JP6739390B2 (ja) * 2017-03-30 2020-08-12 富士フイルム株式会社 有機ｅｌ画像表示装置の製造方法
EP3462489B1 (en) * 2017-09-29 2021-05-26 Facebook Technologies, LLC Mesa shaped micro light emitting diode with bottom n-contact
CN111357121A (zh) * 2017-12-04 2020-06-30 东旭集团有限公司 微型led器件用上基板、微型led器件以及微型led显示装置
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WO2020075431A1 (ja) * 2018-10-09 2020-04-16 ソニー株式会社 表示装置
KR102877921B1 (ko) * 2020-02-20 2025-10-30 삼성디스플레이 주식회사 표시 장치
JP7574845B2 (ja) * 2020-03-31 2024-10-29 大日本印刷株式会社 エンコーダ用反射型光学式スケール及び反射型光学式エンコーダ
KR102437208B1 (ko) * 2021-03-03 2022-08-30 웨이브로드 주식회사 반도체 발광소자를 지지 기판으로 이전하는 방법
JP2023023684A (ja) * 2021-08-06 2023-02-16 株式会社ジャパンディスプレイ 表示装置の製造方法
WO2025222495A1 (zh) * 2024-04-26 2025-10-30 汕头超声显示器技术有限公司 Led阵列装置及其制造方法

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Also Published As

Publication number Publication date
KR20080051044A (ko) 2008-06-10
KR101382354B1 (ko) 2014-04-08
TW200837819A (en) 2008-09-16
US7763901B2 (en) 2010-07-27
CN101197355A (zh) 2008-06-11
TWI375262B (https=) 2012-10-21
JP2008141026A (ja) 2008-06-19
US20080224153A1 (en) 2008-09-18

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