TWI375262B - - Google Patents

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Publication number
TWI375262B
TWI375262B TW096139328A TW96139328A TWI375262B TW I375262 B TWI375262 B TW I375262B TW 096139328 A TW096139328 A TW 096139328A TW 96139328 A TW96139328 A TW 96139328A TW I375262 B TWI375262 B TW I375262B
Authority
TW
Taiwan
Prior art keywords
substrate
light
wiring
film
emitting diode
Prior art date
Application number
TW096139328A
Other languages
English (en)
Chinese (zh)
Other versions
TW200837819A (en
Inventor
Katsuhiro Tomoda
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of TW200837819A publication Critical patent/TW200837819A/zh
Application granted granted Critical
Publication of TWI375262B publication Critical patent/TWI375262B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/743—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used as a support during manufacture of interconnect decals or build up layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs

Landscapes

  • Led Device Packages (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Devices (AREA)
TW096139328A 2006-12-04 2007-10-19 Electronic device, method of producing the same, light-emitting diode display unit, and method of producing the same TW200837819A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006326488A JP2008141026A (ja) 2006-12-04 2006-12-04 電子機器及びその製造方法、並びに、発光ダイオード表示装置及びその製造方法

Publications (2)

Publication Number Publication Date
TW200837819A TW200837819A (en) 2008-09-16
TWI375262B true TWI375262B (https=) 2012-10-21

Family

ID=39547629

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096139328A TW200837819A (en) 2006-12-04 2007-10-19 Electronic device, method of producing the same, light-emitting diode display unit, and method of producing the same

Country Status (5)

Country Link
US (1) US7763901B2 (https=)
JP (1) JP2008141026A (https=)
KR (1) KR101382354B1 (https=)
CN (1) CN101197355B (https=)
TW (1) TW200837819A (https=)

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US9534772B2 (en) 2007-05-31 2017-01-03 Nthdegree Technologies Worldwide Inc Apparatus with light emitting diodes
US8852467B2 (en) 2007-05-31 2014-10-07 Nthdegree Technologies Worldwide Inc Method of manufacturing a printable composition of a liquid or gel suspension of diodes
US9419179B2 (en) 2007-05-31 2016-08-16 Nthdegree Technologies Worldwide Inc Diode for a printable composition
US9343593B2 (en) 2007-05-31 2016-05-17 Nthdegree Technologies Worldwide Inc Printable composition of a liquid or gel suspension of diodes
CN101599442A (zh) * 2008-06-04 2009-12-09 富准精密工业(深圳)有限公司 发光二极管的制造方法
JP2010107935A (ja) * 2008-10-28 2010-05-13 Samsung Mobile Display Co Ltd 平板表示装置及びその製造方法
JP2011129646A (ja) * 2009-12-16 2011-06-30 Panasonic Corp Ｌｅｄモジュール用配線基板、ｌｅｄモジュール及びｌｅｄモジュール用配線基板の製造方法
JP5670051B2 (ja) * 2009-12-25 2015-02-18 日亜化学工業株式会社 半導体発光装置及びその製造方法
JP5481305B2 (ja) 2010-07-30 2014-04-23 株式会社東芝 出力配分制御装置
EP2612380A4 (en) * 2010-09-01 2015-01-14 Nthdegree Tech Worldwide Inc LIGHT-EMITTING, ELECTROMAGING OR OTHER ELECTRONIC DEVICE, AND MANUFACTURING METHOD THEREFOR
US9899329B2 (en) 2010-11-23 2018-02-20 X-Celeprint Limited Interconnection structures and methods for transfer-printed integrated circuit elements with improved interconnection alignment tolerance
US8889485B2 (en) 2011-06-08 2014-11-18 Semprius, Inc. Methods for surface attachment of flipped active componenets
CN102903804B (zh) * 2011-07-25 2015-12-16 财团法人工业技术研究院 发光元件的转移方法以及发光元件阵列
US9306117B2 (en) 2011-07-25 2016-04-05 Industrial Technology Research Institute Transfer-bonding method for light emitting devices
US20120175667A1 (en) * 2011-10-03 2012-07-12 Golle Aaron J Led light disposed on a flexible substrate and connected with a printed 3d conductor
TWI450476B (zh) * 2011-11-18 2014-08-21 Hongkong Dongshan Prec Union Opoelectronic Co Ltd Padding method
CN108922959B (zh) * 2013-03-28 2022-07-29 日亚化学工业株式会社 发光装置、及使用发光装置的装置
EP3300108B1 (en) * 2013-03-28 2019-07-24 Toshiba Hokuto Electronics Corporation Light emitting device and method for manufacturing the same
JP5961148B2 (ja) * 2013-08-02 2016-08-02 富士フイルム株式会社 発光装置の製造方法
JP6010003B2 (ja) * 2013-08-02 2016-10-19 富士フイルム株式会社 発光装置およびその製造方法
WO2015068344A1 (ja) * 2013-11-07 2015-05-14 東芝ホクト電子株式会社 発光装置
US20170294420A1 (en) * 2014-09-02 2017-10-12 Philips Lighting Holding B.V. A method of applying a lighting arrangement to a surface and a lighting surface
US20160093600A1 (en) * 2014-09-25 2016-03-31 X-Celeprint Limited Compound micro-assembly strategies and devices
US9799719B2 (en) 2014-09-25 2017-10-24 X-Celeprint Limited Active-matrix touchscreen
US10236279B2 (en) 2014-10-31 2019-03-19 eLux, Inc. Emissive display with light management system
US10520769B2 (en) 2014-10-31 2019-12-31 eLux, Inc. Emissive display with printed light modification structures
US9825202B2 (en) 2014-10-31 2017-11-21 eLux, Inc. Display with surface mount emissive elements
US10381332B2 (en) 2014-10-31 2019-08-13 eLux Inc. Fabrication method for emissive display with light management system
US10319878B2 (en) 2014-10-31 2019-06-11 eLux, Inc. Stratified quantum dot phosphor structure
US10446728B2 (en) 2014-10-31 2019-10-15 eLux, Inc. Pick-and remove system and method for emissive display repair
US10543486B2 (en) 2014-10-31 2020-01-28 eLux Inc. Microperturbation assembly system and method
US10242977B2 (en) 2014-10-31 2019-03-26 eLux, Inc. Fluid-suspended microcomponent harvest, distribution, and reclamation
US10381335B2 (en) 2014-10-31 2019-08-13 ehux, Inc. Hybrid display using inorganic micro light emitting diodes (uLEDs) and organic LEDs (OLEDs)
US10418527B2 (en) 2014-10-31 2019-09-17 eLux, Inc. System and method for the fluidic assembly of emissive displays
US10535640B2 (en) 2014-10-31 2020-01-14 eLux Inc. System and method for the fluidic assembly of micro-LEDs utilizing negative pressure
JP6591254B2 (ja) * 2015-10-16 2019-10-16 スタンレー電気株式会社 半導体発光装置、及び、半導体発光装置の製造方法
JP6602197B2 (ja) * 2015-12-21 2019-11-06 スタンレー電気株式会社 半導体発光装置、及び、半導体発光装置の製造方法
TWI681508B (zh) 2016-02-25 2020-01-01 愛爾蘭商艾克斯瑟樂普林特有限公司 有效率地微轉印微型裝置於大尺寸基板上
EP3223306B1 (en) * 2016-03-24 2020-08-19 Technische Hochschule Ingolstadt Semiconductor package
US10600671B2 (en) 2016-11-15 2020-03-24 X-Celeprint Limited Micro-transfer-printable flip-chip structures and methods
WO2018091459A1 (en) 2016-11-15 2018-05-24 X-Celeprint Limited Micro-transfer-printable flip-chip structures and methods
US10395966B2 (en) 2016-11-15 2019-08-27 X-Celeprint Limited Micro-transfer-printable flip-chip structures and methods
US11024608B2 (en) 2017-03-28 2021-06-01 X Display Company Technology Limited Structures and methods for electrical connection of micro-devices and substrates
JP6739390B2 (ja) * 2017-03-30 2020-08-12 富士フイルム株式会社 有機ｅｌ画像表示装置の製造方法
EP3462489B1 (en) * 2017-09-29 2021-05-26 Facebook Technologies, LLC Mesa shaped micro light emitting diode with bottom n-contact
CN111357121A (zh) * 2017-12-04 2020-06-30 东旭集团有限公司 微型led器件用上基板、微型led器件以及微型led显示装置
US10418510B1 (en) 2017-12-22 2019-09-17 Facebook Technologies, Llc Mesa shaped micro light emitting diode with electroless plated N-contact
WO2020075431A1 (ja) * 2018-10-09 2020-04-16 ソニー株式会社 表示装置
KR102877921B1 (ko) * 2020-02-20 2025-10-30 삼성디스플레이 주식회사 표시 장치
JP7574845B2 (ja) * 2020-03-31 2024-10-29 大日本印刷株式会社 エンコーダ用反射型光学式スケール及び反射型光学式エンコーダ
KR102437208B1 (ko) * 2021-03-03 2022-08-30 웨이브로드 주식회사 반도체 발광소자를 지지 기판으로 이전하는 방법
JP2023023684A (ja) * 2021-08-06 2023-02-16 株式会社ジャパンディスプレイ 表示装置の製造方法
WO2025222495A1 (zh) * 2024-04-26 2025-10-30 汕头超声显示器技术有限公司 Led阵列装置及其制造方法

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Also Published As

Publication number Publication date
KR20080051044A (ko) 2008-06-10
KR101382354B1 (ko) 2014-04-08
TW200837819A (en) 2008-09-16
US7763901B2 (en) 2010-07-27
CN101197355A (zh) 2008-06-11
CN101197355B (zh) 2010-06-23
JP2008141026A (ja) 2008-06-19
US20080224153A1 (en) 2008-09-18

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