KR101376951B1 - 첩합 판상체 검사 장치 및 방법 - Google Patents

첩합 판상체 검사 장치 및 방법 Download PDF

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Publication number
KR101376951B1
KR101376951B1 KR1020120092053A KR20120092053A KR101376951B1 KR 101376951 B1 KR101376951 B1 KR 101376951B1 KR 1020120092053 A KR1020120092053 A KR 1020120092053A KR 20120092053 A KR20120092053 A KR 20120092053A KR 101376951 B1 KR101376951 B1 KR 101376951B1
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South Korea
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plate
edge
edge end
inspection
distance information
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KR20130033949A (ko
Inventor
요시노리 하야시
히로시 와카바
오사무 이즈츠
타카노리 곤도
요코 오노
카츠토시 세키
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시바우라 메카트로닉스 가부시키가이샤
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/14—Measuring arrangements characterised by the use of optical techniques for measuring distance or clearance between spaced objects or spaced apertures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/60—Analysis of geometric attributes
    • G06T7/62—Analysis of geometric attributes of area, perimeter, diameter or volume
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
    • G01N2021/8893—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques providing a video image and a processed signal for helping visual decision
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N2021/9513—Liquid crystal panels

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biochemistry (AREA)
  • Signal Processing (AREA)
  • Health & Medical Sciences (AREA)
  • Geometry (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Theoretical Computer Science (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
KR1020120092053A 2011-09-27 2012-08-23 첩합 판상체 검사 장치 및 방법 Expired - Fee Related KR101376951B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011211257 2011-09-27
JPJP-P-2011-211257 2011-09-27

Publications (2)

Publication Number Publication Date
KR20130033949A KR20130033949A (ko) 2013-04-04
KR101376951B1 true KR101376951B1 (ko) 2014-03-20

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KR1020120092053A Expired - Fee Related KR101376951B1 (ko) 2011-09-27 2012-08-23 첩합 판상체 검사 장치 및 방법

Country Status (4)

Country Link
JP (1) JP5959104B2 (enExample)
KR (1) KR101376951B1 (enExample)
CN (1) CN103017671B (enExample)
TW (1) TWI449877B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6322087B2 (ja) * 2014-08-27 2018-05-09 芝浦メカトロニクス株式会社 検査装置及び検査方法
JP6128337B2 (ja) * 2014-10-23 2017-05-17 パナソニックＩｐマネジメント株式会社 半導体装置の製造方法及び製造装置
CN110501349B (zh) * 2018-05-18 2022-04-01 蓝思科技（长沙）有限公司 一种盖板弧边检测方法和系统及其检测设备
JP7485973B2 (ja) * 2022-04-28 2024-05-17 日亜化学工業株式会社 光学部材の製造方法及び発光装置の製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008304306A (ja) * 2007-06-07 2008-12-18 Nippon Steel Corp 疵検査装置及び疵検査方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2640400B2 (ja) * 1992-03-13 1997-08-13 積水化学工業株式会社 画像処理による板状体の寸法算出装置
JP3523408B2 (ja) * 1996-02-19 2004-04-26 東レエンジニアリング株式会社 凹凸状物形状測定方法および装置
JPH10227617A (ja) * 1997-02-12 1998-08-25 Nikon Corp 微小線幅測定方法及び微小線幅測定装置
JPH11328756A (ja) * 1998-03-13 1999-11-30 Sanyo Electric Co Ltd 貼り合せ型ディスクの接着部の検査方法および検査装置
JP2003016463A (ja) * 2001-07-05 2003-01-17 Toshiba Corp 図形の輪郭の抽出方法、パターン検査方法、パターン検査装置、プログラムおよびこれを格納したコンピュータ読み取り可能な記録媒体
CN1220032C (zh) * 2002-01-21 2005-09-21 株式会社日立国际电气 线宽测定方法和线宽测定装置
JP4217112B2 (ja) * 2002-08-01 2009-01-28 株式会社リコー 光ディスク検査装置、光ディスク検査方法、光ディスクの製造方法及び光ディスク
JP4193579B2 (ja) * 2003-05-21 2008-12-10 凸版印刷株式会社 フィルム貼り付け位置検査方法及び検査装置
US7292346B2 (en) * 2003-09-15 2007-11-06 Zygo Corporation Triangulation methods and systems for profiling surfaces through a thin film coating
DK1623943T3 (da) * 2004-08-04 2011-08-29 Fms Force Measuring Systems Ag Indretning og fremgangsmåde til registrering af et kendetegn ved en løbende materialebane
JP4776197B2 (ja) * 2004-09-21 2011-09-21 日本特殊陶業株式会社 配線基板の検査装置
JP4312706B2 (ja) * 2004-12-27 2009-08-12 シャープ株式会社 膜厚差検出装置、膜厚差検出方法、カラーフィルタ検査装置、カラーフィルタ検査方法
JP5099848B2 (ja) * 2006-08-10 2012-12-19 芝浦メカトロニクス株式会社 円盤状基板の検査装置及び検査方法
TWI306149B (en) * 2007-01-05 2009-02-11 Chroma Ate Inc Optical device for sensing distance
JP2008242191A (ja) * 2007-03-28 2008-10-09 Sharp Corp カラーフィルタ基板の検査方法、カラーフィルタ基板の絵素の検査装置、カラーフィルタ基板の製造方法及びカラーフィルタ基板を備えた表示装置
JP2011009395A (ja) * 2009-06-25 2011-01-13 Nec Corp 部品の実装装置および部品の実装方法
TWI393852B (zh) * 2009-12-07 2013-04-21 Univ Nat Yunlin Sci & Tech 玻璃基板量測方法及其裝置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008304306A (ja) * 2007-06-07 2008-12-18 Nippon Steel Corp 疵検査装置及び疵検査方法

Also Published As

Publication number Publication date
CN103017671B (zh) 2016-03-02
JP5959104B2 (ja) 2016-08-02
TWI449877B (zh) 2014-08-21
JP2013083628A (ja) 2013-05-09
TW201314170A (zh) 2013-04-01
CN103017671A (zh) 2013-04-03
KR20130033949A (ko) 2013-04-04

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